Kazuhiko Kobayashi

TL;DR: In this paper, a high frequency amplifier containing a constant envelope signal generation circuit for transforming an input signal to form two constant envelope signals where phases of the constants envelope signals correspond to an amplitude of an envelope of the input signal, two amplifying circuits for separately amplifying two constant envelopes, and a power synthesizing circuit for synthesizing the first and second amplified signals to generate an amplified signal of an input electric signal.

TL;DR: In this paper, a wave combining circuit for combining the first and second constant-amplitude waves and for generating an output wave was proposed for a wave combination type amplifier with a first amplifier outputting a first amplified output and a second amplifier producing a second amplified output.

TL;DR: In this paper, a high-frequency device has a semiconductor substrate, a highfrequency circuit layer formed on the substrate and including a circuit element and a multilayer wiring layer; electrically conductive pads; rewiring layers connected to the electricallyconductive pads, an electrically insulating sealing layer, and a third electrical conductive post corresponding to an output of power output amplifier has a third diameter larger than the second diameter.

TL;DR: In this article, an optical module has a module case in which an optical device and a circuit unit electrically connected to the optical device are mounted, and an optical connector of an optical fiber is detachably attached to the module case so as to be in contact with the optical devices.

TL;DR: In this article, the UV-curable resin is supplied onto the workpiece and the setting table is raised to and stopped at a filling operation position where the mold surface of the nano-imprinting mold and the surface of a workpiece are apart.