A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Probe card assembly and kit, and methods of making same

Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

Microelectronic contact structure, and method of making same.

An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

Microelectronic contact structure

Flexible composites which are ballistic and stab resistant. The composites are formed from at least one, and preferably a plurality of, fibrous layer comprising a network of high tenacity fibers. A stack of a plurality of fibrous layers is consolidated in a desired pattern over a substantial portion of its surface area which results in areas which are consolidated and areas that are unconsolidated. The unconsolidated areas provide flexibility to the overall composite structure and the structure is resistant to ballistic projectiles and/or sharp objects. Body armor formed from the composites is comfortable to wear and reduces the degree of trauma to the wearer as a result of impact by the ballistic projectile or sharp object.

Fragment and stab resistant flexible material with reduced trauma effect

The present invention relates to a method of producing a high strength and high modulus elongated product comprising the steps of (a) making a composition comprising a semi-crystalline polymer and carbon nanotubes, (b) extruding said composition into an elongated product, and (c) stretching the product below the melting point of the polymer, wherein in step (a) the composition is a colloidal dispersion of nanotubes in a solution of the polymer. The advantages of the invention include production of elongated products, like fibres with higher tensile properties, especially strength, with a lower concentration of nanotubes than with a known method. The invention also concerns a high strength elongated product containing nanotubes obtainable by the method according to the invention, especially a polyolefin fibre containing nanotubes having a tensile strength of higher than 3.0 GPa. The invention also relates to a process for making composite articles wherein high strength elongated products, preferably fibres, according to the invention are used and to anti-ballistic composites comprising said products.

Method of producing high strength elongated products containing nanotubes

In a process for preparing polybenzoxazole or polybenzothiazole filaments by extruding a polybenzoxazole or polybenzothiazole dope, drawing the dope filament across an air gap, and coagulating the dope filament; the number of filament breaks can be reduced by placing a stress isolation device after extruding but before coagulating the filament.

Method for preparing polybenzoxazole or polybenzothiazole fibers

This invention aims at improvement of heat-treatment technology for manufacture of large amounts of polybenzazole fibers. The fibers are heat treated using steam as the heat treatment gas in a device that provides for a rapid, cocurrent, countercurrent or both cocurrent and countercurrent flow of steam.

Steam heat-treatment method for polybenzazole fiber

A tire is described which includes polybenzazole (PBZ) fibers. The PBZ fibers can be used as part of either the carcass of the tire or as the reinforcing belts of the tire or as both. Tires made with PBZ fibers weigh less than do tires made with steel or other organic fibers, therefore the fuel efficiency of vehicles with tires that contain PBZ fibers is greater than that of vehicles that have tires that do not contain PBZ fibers.

Kazuyuki Yabuki

Papers

Method for preparing polybenzoxazole or polybenzothiazole fibers

Steam heat-treatment method for polybenzazole fiber

Light weight tire