A physiological monitoring garment (10) includes first and second elastic fabric portions (12, 14). An elongate stretchable textile data/power bus (16) is disposed between the first and second elastic fabric portions (12, 14). The elongate stretchable textile data/power bus (16) includes a plurality of integral conductors (20), woven, knitted, or braided along the length thereof. One or more sensors (30, 32) are connected to the elongate stretchable textile data/power bus (16).

Physiological monitoring garment

Printed circuit board

Provided is a method for manufacturing a printed wiring board, which can enhance the peel strength between an insulating layer and a conductive pattern by a two-step process, that is, a semi-hardening and full-hardening of the insulating layer. In the method for manufacturing the printed wiring board having one or more layers of a conductive pattern and an insulating pattern, an insulating pattern is formed on an insulating substrate, and at least one of the insulating substrate and the insulating pattern is semi-hardened. A conductive pattern is formed on the insulating substrate and/or the insulating pattern, thereby providing a stack structure. Then, a thermal treatment is performed on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern, and the conductive pattern is fired.

Printed wiring board and method for manufacturing the same

A physiological monitoring system includes a sensor subsystem worn by a person including at least a one sensor. A dock is associated with the sensor subsystem and includes a first connector component electrically connected to the sensor. A portable transmitting unit is received in the dock and includes a transmitter and a connector component removeably mateable with the dock connector component to route sensor data to the transmitter.

Physiological status monitoring system

A core crush resistant prepreg for use in making a fiber reinforced composite panel structure is provided. The prepreg comprises a woven fabric consisting essentially of carbon fiber tow strands impregnated with a hardenable polymeric resin composition. Typically the fabric has an areal weight of from about 180 to about 205 grams per square meter. The prepreg has an average fiber tow aspect ratio of less than about 15.4, a prepreg thickness of at least about 0.245 mm, and a prepreg openness of at least about 1.2 percent but less than about 6.0 percent. Preferably, the resin composition is predominantly viscous in nature and has a tan δ value of between 0.9 and 2.0 at an elevated temperature between 70° C. and 140° C., and an average epoxy functionality of greater than 2.0. A method for evaluating core crush resistance properties of a prepreg is also provided. The method includes determining a fiber tow average aspect ratio of the prepreg, determining a prepreg thickness, and comparing said average fiber tow aspect ratio and prepreg thickness to a set of predetermined values.

Core-crush resistant fabric and prepreg for fiber reinforced composite sandwich structures

PROBLEM TO BE SOLVED: To enable manufacturing with cost reduction, without need for long time using a simple manufacturing method, by simultaneously forming a conductor pattern on the surface of an insulator. SOLUTION: An ink-jet unit 7 connected with a personal computer 10 has an ink-jet nozzle 8 which can be slid sideways and longitudinally, and an insulator 9 is placed on a carrier which can carry the insulator 9 in the direction of travel, and both of a conductor pattern and an insulating pattern are formed simultaneously on the surface of the insulator 9 by a jet of ink from a nozzle on the basis of pictorial information data transmitted by the personal computer. When ink to be used is solvent type or heat curing type, the insulator 9 is carried through a heating furnace subsequent to the ink-jet unit 7 for drying solvent or cure binder. This allows manufacturing time to be shorten by simple equipment and method.

Printed wiring board and manufacture thereof

To enhance the tear strength without increasing the thickness, a woven glass cloth having a mass of 15 to 30 g/m2, for use as a base material for printed wiring board material, is characterized in that the weft or warp is provided by a 75 denier or more strand, thicker than the warp, and thread count of the thicker strand per unit length is set smaller than that of the other strand.

Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom

A method for forming a resin pattern which includes selectively polymerizing a photopolymerizable resin utilizing a light radiated from a photosensitive substance to form a desired resin pattern. A photosensitive substance layer is formed in a desired pattern on a substrate (or in a substrate when it is light permeable). The photosensitive substance absorbs an irradiation light and radiates a light of a longer wavelength than that of the irradiation light. A photopolymerizable resin layer formed on the substrate is not activated by the irradiation light but is activated by the light radiated from the photosensitive substance. The photopolymerizable resin layer is irradiated with an irradiation light capable of exciting the photosensitive substance and the photo-polymerizable resin is polymerized in the pattern of the photosensitive substance layer with the light radiated from the photosensitive substance.

Method for forming pattern

PROBLEM TO BE SOLVED: To obtain a prepreg, a laminated board and a multilayer printed circuit board by using a glass cloth having improved tear strength even in a thin state and woven by using warp or weft thicker than the other weft or warp and decreasing the count of the thicker strand. SOLUTION: A two ply yarn or a single yarn having a filament diameter of 0.003-0.010mm is used as the strand of warp and/or weft. The weft or the warp is composed of a strand of >=75de which is thicker than the other warp or weft, the count of the strand of the weft or warp per unit length is set to be smaller, i.e., 0.3-0.8 times the count of the other warp or weft and the weight of the thicker strand of the weft or warp per unit length is set to be 1.5-2.5 times that of the other warp or weft to obtain a woven thin glass cloth having an areal density of 15-30g/m . The cloth is impregnated with 60-80wt.% (based on the weight of prepreg) of an epoxy resin and the obtained prepreg is hot- pressed together with a metallic foil to form a laminated board having an insulation layer thickness of 0.040-0.080mm and a tear strength of >=35gf. A multilayer printed circuit board is manufactured from the laminated board.

Glass cloth, prepreg, laminated board and multilayer printed circuit board

PROBLEM TO BE SOLVED: To provide a reinforcing fiber woven fabric giving a laminate which is processed by laser beams, scarcely generates the irregularity in the diameters of holes formed by the laser beams and does not cause the detects of insulation and conduction, when used as a substrate of printed circuit. SOLUTION: This reinforcing fiber woven fabric used for a laminate to be processed by laser beams comprises a plain woven fabric in which at least one kind of reinforcing fibers constituting warps and wefts comprise glass fibers and which has a reinforced fiber woven fabric thickness of <=80 μm and a glass porosity of <=10%.

Keita Miyasato

Papers

Printed wiring board and manufacture thereof

Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom

Method for forming pattern

Glass cloth, prepreg, laminated board and multilayer printed circuit board

Reinforcing fiber woven fabric used for laminate to be processed by laser beam