Metallic silver is deposited upon the surface of a nonconducting substrate using a multi-step wet deposition process. The surface is cleaned, and then activated in an aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt, a reduction agent that reduces the salt to form the metallic silver, and a deposition control agent that prevents the silver from nucleating throughout the solution. After the substrate is coated, the coating is stabilized in an aqueous solution of a salt of a metal from the platinum group or gold, dissolved in dilute hydrochloric acid. The process is particularly effective for depositing uniform films of 2 to 2000 Angstroms thickness, which strongly adhere to the substrate.

Deposition of silver layer on nonconducting substrate

An investigation of thermal stability of thin palladium–silver alloy membranes for high temperature hydrogen separation

An integrated chip package structure and method of manufacturing the same is by adhering dies on a metal substrate and forming a thin-film circuit layer on top of the dies and the metal substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

Method for fabricating chip package

A transparent electro-conductive structure comprising a transparent substrate and formed successively thereon a transparent electro-conductive layer and a transparent coat layer, which is used in, e.g., front panels of display devices such as CRTs. The transparent electro-conductive layer is composed chiefly of i) noble-metal-coated fine silver particles having an average particle diameter of from 1 nm to 100 nm, the fine silver particles being surface-coated with gold or platinum alone or a composite of gold and platinum, and ii) a binder matrix. A transparent electro-conductive layer forming coating fluid used in the production of this transparent conductive structure comprises a solvent and noble-metal-coated fine silver particles dispersed in the solvent and having an average particle diameter of from 1 nm to 100 nm, the fine silver particles being surface-coated with gold or platinum alone or a composite of gold and platinum.

Transparent electro-conductive structure, process for its production, transparent electro-conductive layer forming coating fluid used for its production, and process for preparing the coating fluid

An inverted PCRAM cell is formed by plating the bottom electrode, made of copper for example, with a conductive material, such as silver. Chalcogenide material is disposed over the plated electrode and subjected to a conversion process so that ions from the plated material diffuse into the chalcogenide material.

Resistance variable memory cells

Improved electroless or autocatalytic gold plating baths wherein the gold ingredient is a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate. The bath contains an amino borane, an alkali metal borohydride, or an alkali metal cyanoborohydride as the reducing agent; an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. Optionally, the bath may contain added alkali metal cyanide. The method of utilizing such electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a non-metallic substrates is also described and claimed.

Electroless gold plating

An electroless plating process for depositing gold on substrates, such as metal and metallized substrates, which involves immersing the substrates in an electroless plating bath composed of a trivalent gold complex, an organic carboxylic acid, and/or a mineral acid sufficient in amount so that the pH of the bath will range from about 0.1 to 6.0. The process of utilizing said electroless bath to deposit gold on the aforementioned substrates is also disclosed and claimed.

Process for the immersion deposition of gold

An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refining, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop. The method of depositing the bright gold metal on various substrates from such electroplating solutions is also described and claimed.

Gold sulphite electroplating solutions and methods

Waessriges bad zur stromlosen abscheidung von goldueberzuegen

An electrolytic bath for the production of mirror bright silver deposits comprising an alkali metal silver cyanide as the source of silver; boric acid, citric acid, alkali or ammonium metal salts of such acids, as well as mixtures thereof; selenous acid or alkali metal selenite; and, in certain preferred baths, antimony in the form of an alkali metal carboxylic acid salt. The bath is designed to be operated at high current densities of from 200 to 5,000 ASF, i.e. about 20 to 500 ASD. The process of utilizing such as electrolytic bath is also disclosed and claimed.

Kenneth D. Baker

Papers

Electroless gold plating

Process for the immersion deposition of gold

Gold sulphite electroplating solutions and methods

Waessriges bad zur stromlosen abscheidung von goldueberzuegen

High speed bright silver electroplating bath and process