A flexible wearable computer in the form of a belt comprising, in combination, elements for computing comprising a microprocessor module (200), a RAM-I/O module (300), a plurality of mass memory modules (400), a power supply module (500), and a plurality of bus termination modules (100) operationally associated with a plurality of flexible signal relaying means. The computing elements are mechanically associated with a flexible non-stretchable member (004), and a protective covering means (006). The flexible non-stretchable wearable member (004) is secured around various parts of the body. An input and output device (060) is connected to the flexible wearable computer (004) by the I/O bus (061) attached to the output and input ports (326) and (327), respectively.

Flexible wearable computer

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

Microelectronic packages and methods therefor

An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic parts having a connection terminal flip-chip mounted on the wiring pattern exposed in the opening portion of the first insulating film, a second insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the first and second insulating films on the wiring pattern, and an upper wiring pattern formed on the second insulating film and connected to the wiring pattern through the via hole.

Electronic parts packaging structure and method of manufacturing the same

A thermally enhanced semiconductor device (10) having an exposed backside (22) is described. In one embodiment, a PC board substrate (12) is provided having a pattern of conductive traces (14) on both upper and lower surfaces of the substrate. Electrical continuity is maintained between the two surfaces with conductive vias (16). A semiconductor die (18) is flip-mounted to the upper surface of the substrate. Solder bumps (26) electrically connect the die to the conductive traces, and an underfill (28) couples the active side (20) of the die to the upper surface of the substrate. A package body (40) is formed around the perimeter (24) of the die leaving the inactive backside exposed for enhanced thermal dissipation. The inactive backside can also be coupled to a heat sink for increased thermal dissipation. A plurality of solder balls (42) electrically connected to the conductive traces is attached to the lower surface of the substrate.

Thermally enhanced semiconductor device having exposed backside and method for making the same

A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

Socket for engaging bump leads on a microelectronic device and methods therefor

A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chip on the circuit board, the circuit board is provided with a groove or a shoulder in a position where it faces the edges of the open end of the cap. After the chip has been positioned on the circuit board, the cap is bonded to the circuit board via the groove or the shoulder.

Kenzi Kobayashi

Papers

Semiconductor device package having locating mechanism for properly positioning semiconductor device within package