Techniques are provided for extending the use of phase shift techniques to implementation of masks used for complex layouts in the layers of integrated circuits, beyond selected critical dimension features. The method includes identifying features for which phase shifting can be applied, automatically mapping the phase shifting regions for implementation of such features, resolving phase conflicts which might occur according to a given design rule, and application of assist features and proximity correction features. The method includes applying an adjustment to a phase shift mask pattern including a first and a second phase shift window, and a control chrome with a control width, and/or to a trim mask pattern having a trim shape with a trim width based upon one or both of a rule based correction and a model based correction to improve a match between a resulting exposure pattern and a target feature.

Phase shift masking for complex patterns with proximity adjustments

Phase information is incorporated into a cell-based design methodology Standard cells have four edges: top, bottom, left, and right The top and bottom edges have fixed phase shifters placed, eg 0 A given cell C will have a phase set created with two versions: 0-180 (left-right) as well as 180-0 Alternatively, the same phase set: 0—0 and 180—180 could be created for a cell The phase sets are selected based on the ability to phase shift the features within the cell C By creating a phase set for most of the cells of a cell library, standard cell placement and routing techniques can be used and phase can then be quickly assigned using a simple ripple technique This ensures a phase compliant design upfront for the standard cell areas In some instances, phase sets are created for every cell in a library

Standard cell design incorporating phase information

Definition of a phase shifting layout from an original layout can be time consuming. If the original layout is divided into useful groups, i.e. clusters that can be independently processed, then the phase shifting process can be performed more rapidly. If the shapes on the layout are enlarged, then the overlapping shapes can be grouped together to identify shapes that should be processed together. For large layouts, growing and grouping the shapes can be time consuming. Therefore, an approach that uses bins can speed up the clustering process, thereby allowing the phase shifting to be performed in parallel on multiple computers. Additional efficiencies result if identical clusters are identified and processing time saved so that repeated clusters of shapes only undergo the computationally expensive phase shifter placement and assignment process a single time.

Design data format and hierarchy management for processing

A simulated wafer image of a physical mask and a defect-free reference image are used to generate a severity score for each defect, thereby giving a customer meaningful information to accurately assess the consequences of using a mask or repairing that mask. The defect severity score is calculated based on a number of factors relating to the changes in critical dimensions of the neighbor features to the defect. A common process window can also be used to provide objective information regarding defect printability. Certain other aspects of the mask relating to mask quality, such as line edge roughness and contact corner rounding, can also be quantified by using the simulated wafer image of the physical mask.

System and method of providing mask defect printability analysis

A method for defining a full phase layout for defining a layer of material in an integrated circuit is described. The method can be used to define, arrange, and refine phase shifters to substantially define the layer using phase shifting. Through the process, computer readable definitions of an alternating aperture, dark field phase shift mask and of a complimentary mask are generated. Masks can be made from the definitions and then used to fabricate a layer of material in an integrated circuit. The separations between phase shifters, or cuts, are designed for easy mask manufacturability while also maximizing the amount of each feature defined by the phase shifting mask. Cost functions are used to describe the relative quality of phase assignments and to select higher quality phase assignments and reduce phase conflicts.

Design and layout of phase shifting photolithographic masks

Photomask pattern inspection using transmitted light and/or reflected light is commonly used for Die to Die or Die to Database comparison method. We have applied the differential interference contrast method to phase defect inspection for alternating phase shifting mask (Alt-PSM). The key parameters for optics are resident phase in an interferometer, shearing direction and distance between two spots, which are determined by Nomarski prism design. Firstly, we studied defect image contrast by simulation. Chrome edge defects are more detectable than isolated center defects from the simulation result. Next, we configured a reflective type, differential interference optics using an Ar ion laser as a light source. A test mask having 70-degree phase defects on 520, 600, and 720 nm CD are inspected. Edge defects down to 520nm CD were detectable compared with conventional reflective method.

Kiyoshi Ogawa

Papers

Phase defect inspection by differential interference