A process is provided for enhancing the wear resistance of aluminum and other materials by depositing on the substrate a nickel, cobalt, phosphorous alloy coating using an electroless plating bath to provide a plated alloy having a cobalt content of at least about 20% by weight and a % Co/% P weight ratio of at least about 5. A preferred bath contains an effective amount of glycolic acid or salts thereof. The alloy deposit is preferably plated over a zincated aluminum substrate.

Electroless nickel cobalt phosphorous composition and plating process

The invention relates to a chemical nickel-phosphate plating solution. The chemical nickel-phosphate plating solution comprises a basic chemical nickel-phosphate plating solution and an inorganic additive, wherein the inorganic additive is selected from one or several of ferrous sulfate, cobaltous sulfate and zinc sulfate. According to the chemical nickel-phosphate plating solution, the inorganic additive (one or several of ferrous sulfate, cobaltous sulfate and zinc sulfate) is added in the basic chemical nickel-phosphate alloy plating solution. The plating speed of chemical nickel-phosphate alloy plating can be increased, and the corrosion resistance of a chemical nickel-phosphate alloy plating layer can be improved after the inorganic additive is added.

Chemical nickel-phosphate plating solution

The invention relates to a process for electroless chemically reductive deposition of ternary, nickel and phosphorus-containing alloys from aqueous, nickel ions and containing sodium hypophosphite or other reducing agent aqueous solutions in the presence of organic compounds, which is characterized ge that one metallic or nichtme-metallic materials after appropriate pretreatment ternary for depositing Ni-WP alloys lung at a pH value in the range from 4.5 to 9.5 immersed in an aq membered solution containing nickel ions, tungstate ions and sodium hypophosphite or other reducing agent and optionally buffer substances, or deposition of ternary Ni-Co-P alloys appeared at a pH in the range of 4.5 to 9.5 into an aqueous solution containing nickel ions, cobalt ions and sodium hypochlorite phosphite or other reducing agent and, where appropriate, buffer substances containing membered the respective aq solutions in addition organ to sets ic carboxylic acids as complexing agents, stabilizers and accelerators and, optionally, organic carboxylic acids or 8-hydroxyquinoline as a wetting agent and a brightener, and the materials then optionally heat treated.

Klaus Scharwächter

Papers

Process for the electroless plating of ternary alloys containing nickel and phosphor