An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Solid state lighting component

The present disclosure relates to a semiconductor light emitting device, comprising: a plurality of semiconductor layers, including a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, and an active layer interposed between the first semiconductor layer and the second semiconductor layer, generating light via electron-hole recombination; a first electrode, supplying either electrons or holes to the plurality of semiconductor layers; a second electrode, supplying, to the plurality of semiconductor layers, electrons if the holes are supplied by the first electrode, or holes if the electrons are supplied by the first electrode; a non-conductive distributed bragg reflector coupled to the plurality of semiconductor layers, reflecting the light from the active layer; and a first light-transmitting film coupled to the distributed bragg reflector from a side opposite to the plurality of semiconductor layers with respect to the non-conductive distributed bragg reflector, with the first light-transmitting film having a refractive index lower than an effective refractive index of the distributed bragg reflector.

Semiconductor Light Emitting Device

An object is to provide a method for manufacturing a semiconductor device, in which the number of photolithography steps can be reduced, the manufacturing process can be simplified, and manufacturing can be performed with high yield at low cost A method for manufacturing a semiconductor device includes the following steps: forming a semiconductor film; irradiating a laser beam by passing the laser beam through a photomask including a shield for shielding the laser beam; subliming a region which has been irradiated with the laser beam through a region in which the shield is not formed in the photomask in the semiconductor film; forming an island-shaped semiconductor film in such a way that a region which is not irradiated with the laser beam is not sublimed because it is a region in which the shield is formed in the photomask; forming a first electrode which is one of a source electrode and a drain electrode and a second electrode which is the other one of the source electrode and the drain electrode; forming a gate insulating film; and forming a gate electrode over the gate insulating film

Method for Manufacturing Semiconductor Device

A semiconductor light-emitting device of the invention includes: a semiconductor layer including a light-emitting layer and having a first major surface and a second major surface opposite to the first major surface; a phosphor layer facing to the first major surface; an interconnect layer provided on the second major surface side and including a conductor and an insulator; and a light-blocking member provided on a side surface of the semiconductor layer and being opaque to light emitted from the light-emitting layer.

Semiconductor light-emitting device and method for manufacturing same

A lamp includes an outer shell having heat conductivity, a base provided in the outer shell, and a cover provided in the outer shell. The outer shell has a light source support, and a heat radiating surface exposed to the outside of the outer shell. The light source support is formed integral with the heat radiating surface. A light source is supported on the light source support. The light source is heated during lighting, and thermally connected to the light source support. The light source is covered with the cover.

Lamp Having Outer Shell to Radiate Heat of Light Source

A light-emitting module includes at least one light-emitting element provided on a mount surface of a substratum. A translucent member is provided so as to face the mount surface of the substratum. The translucent member is separated from the light-emitting element and contains a phosphor material that converts a wavelength of light emitted by the light-emitting element. A frame having heat conducting properties is interposed between the substratum and the translucent member. The frame surrounds the light-emitting element. The frame includes an opening that leads light emitted by the light-emitting element to the translucent member, and a heat conductor thermally connected to the translucent member. The heat conductor includes a heat radiator exposed outside of the translucent member.

Light-emitting module and illumination apparatus

A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe.

Self-ballasted lamp and lighting equipment

A light emitting device, with which the luminous efficiency is improved and the color non-uniformity of the emitted light is lessened. Specifically, a light emitting diode element is covered with a diffusing layer, with which a diffusing agent is added to a resin. A phosphor layer, with which a phosphor is added to a resin, is disposed on top of the diffusing layer. The light from the light emitting diode element is diffused by the diffusing layer. By exciting the phosphor layer with the light diffused by the diffusing layer and thereby making the phosphor layer emit light, the luminous efficiency is improved and the color non-uniformity is lessened.

Light Emitting Device and Illuminating Device

In a lamp device 12 using a GX53-type cap 31 and also using an LED 56 as a light source, there is regulated an appropriate configuration of a metallic cover 32. A cap 31 and a lighting device 36 are arranged on an upper surface side of the metallic cover 32, and a substrate 33 on which the LED 56 is mounted is arranged on a lower surface side thereof. The metallic cover 32 has an approximately cylindrical shape with a maximum outer diameter D of 80 to 150 mm, a height H of 5 to 25 mm, and 2π (D/2) H/W, that is, an area of the outer peripheral surface per gross input power W to the lamp device 12 being in a range of 200 to 800 mm 2 /W. The gross input power W is 5 to 20 W.

Lamp device and lighting fixture

PROBLEM TO BE SOLVED: To provide a light emitting diode lighting system capable of improving light emission efficiency, and of reducing cost. SOLUTION: This light emitting diode lighting system is provided with: a toric lens 2 having a toric lens body 2c, an annular groove 2d formed on a bottom surface 2a of the lens body, and a total reflection surface 2c2 formed at least on an inner surface on an outer peripheral side of the lens body, and totally reflecting light entered into the inner surface toward a projection surface; and a plurality of light emitting diode devices 3, 3, 3... optically oppositely arranged on the annular groove of the toric lens, and arranged at required intervals in the circumferential direction of the annular groove. COPYRIGHT: (C)2009,JPO&INPIT

Kozo Ogawa

Papers

Light-emitting module and illumination apparatus

Self-ballasted lamp and lighting equipment

Light Emitting Device and Illuminating Device

Lamp device and lighting fixture

Light emitting diode lighting system