An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary apparatus comprises: a plurality of diodes; at least a trace amount of a first solvent; and a polymeric or resin film at least partially surrounding each diode of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.

Apparatus with light emitting or absorbing diodes

The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes are substantially spherical, and have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.

/pdf/light-emitting-photovoltaic-or-other-electronic-apparatus-3lyihiqeaw.pdf

Light emitting, photovoltaic or other electronic apparatus and system

An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary diode comprises: a light emitting or absorbing region having a diameter between about 20 and 30 microns and a height between 2.5 to 7 microns; a plurality of first terminals spaced apart and coupled to the light emitting region peripherally on a first side, each first terminal of the plurality of first terminals having a height between about 0.5 to 2 microns; and one second terminal coupled centrally to a mesa region of the light emitting region on the first side, the second terminal having a height between 1 to 8 microns.

Diode for a printable composition

The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.

https://ntrs.nasa.gov/api/citations/20150003311/downloads/20150003311.pdf

Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system

A close-spaced diode array in which connection to driver circuitry is enabled by application of a flip-chip solder bonding technique. Not only does this allow dense packing, high pixel content to be achieved but has concomitant advantages of increased light efficiency and improved heat sinking.

Light emitting diode array with aligned solder bumps

A light-emitting diode element comprises a semiconductor wafer including a pair of a p-type semiconductor region and an n-type semiconductor region forming a pn junction, an inclined first electrode provided on at least one of the peripheral edges of the surface of one of the semiconductor regions in the semiconductor wafer, and a flat second electrode provided on the surface of the other semiconductor region. A light-emitting diode device is provided in which a plurality of such light-emitting diode elements are respectively received in a plurality of openings of a substrate having a first wiring conductor group and a second wiring conductor group electrically connected to the first and second electrodes respectively of the light-emitting diode elements by a low-melting metal. Thus, these light-emitting diode elements can be mounted on the single substrate in a high package density, and the light-emitting diode device of simple construction can be easily assembled.

Kusano Masaaki

Papers

Light-emitting diode element and device

Lichtemissionsdiodenelement und -anordnung