Microfluidics is an emerging field that has given rise to a large number of scientific and technological developments over the last few years. This review reports on the use of various materials, such as silicon, glass and polymers, and their related technologies for the manufacturing of simple microchannels and complex systems. It also presents the main application fields concerned with the different technologies and the most significant results reported by academic and industrial teams. Finally, it demonstrates the advantage of developing approaches for associating polymer technologies for manufacturing of fluidic elements with integration of active or sensitive elements, particularly silicon devices.

https://iopscience.iop.org/article/10.1088/0960-1317/17/5/R01/pdf

Lab-on-chip technologies: making a microfluidic network and coupling it into a complete microsystem : a review

Piezoelectric sensing is of increasing interest for high-temperature applications in aerospace, automotive, power plants and material processing due to its low cost, compact sensor size and simple signal conditioning, in comparison with other high-temperature sensing techniques. This paper presented an overview of high-temperature piezoelectric sensing techniques. Firstly, different types of high-temperature piezoelectric single crystals, electrode materials, and their pros and cons are discussed. Secondly, recent work on high-temperature piezoelectric sensors including accelerometer, surface acoustic wave sensor, ultrasound transducer, acoustic emission sensor, gas sensor, and pressure sensor for temperatures up to 1,250 °C were reviewed. Finally, discussions of existing challenges and future work for high-temperature piezoelectric sensing are presented.

/pdf/high-temperature-piezoelectric-sensing-4t4e813w78.pdf

High-Temperature Piezoelectric Sensing

This paper focuses on commonalities and differences between the two mixed-signal hardware description languages, VHDL-AMS and Verilog-AMS, in the case of modeling heterogeneous or multidiscipline systems. The paper has two objectives. The first one is modeling the structure and the behavior of an airbag system using both the VHDL-AMS and the Verilog-AMS languages. Such a system encompasses several time abstractions (i.e., discrete-time and continuous-time), several disciplines, or energy domains (i.e., electrical, thermal, optical, mechanical, and chemical), and several continuous-time description formalisms (i.e., conservative-law and signal-flow descriptions). The second objective is to discuss the results of the proposed modeling process in terms of the descriptive capabilities of the VHDL-AMS and Verilog-AMS languages and of the generated simulation results. The tools used are the Advance-MS from Mentor Graphics for VHDL-AMS and the AMS Simulator from Cadence Design Systems for Verilog-AMS. This paper shows that both languages offer effective means to describe and simulate multidiscipline systems, though using different descriptive approaches. It also highlights current tool limitations, since full language definitions are not yet supported.

/pdf/vhdl-ams-and-verilog-ams-as-alternative-hardware-description-3pj6dhb0dc.pdf

VHDL-AMS and Verilog-AMS as alternative hardware description languages for efficient modeling of multidiscipline systems

Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. 

This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs.

KEY FEATURES
* Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples.
* Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book.
* Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits.
* Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing.
* Practical problems at the end of each chapter for students.

System-on-Chip Test Architectures: Nanometer Design for Testability

The development of microelectromechanical systems (MEMS) based on micromachining and microelectronics technologies has been significant for almost a decade. However, it is unrealistic to consider micromachining technology as a micro version of conventional machining technology. As a matter of fact, micromachining technology stemmed from the planar technology of silicon and is basically a two-dimensional processing technology. On the other hand, it is obvious that a micromachine cannot compare with a conventional machine in strength and power. For the successful development of MEMS in the future, a simple rule is suggested by the experience gained in the past few years: try to avoid as much as possible mechanical coupling with the outside world while trying hard to improve the MEMS technology to enhance the mechanical power of the devices. In addition to that, the strategy proven to be correct for the development of solid-state sensors also applies: MEMS devices should mainly be developed for new applications with a vast market. Their substitution for traditional applications should not be considered as a main strategy of development. Based on these arguments, the future development of MEMS devices and technologies is further discussed in the paper.

Future of microelectromechanical systems (MEMS)

A low cost, high reliability accelerometer microsystem designed for crash sensing in automotive airbag electronic control units is presented. The proposed microsystem offers high level output, on-line self-test function, small size (3.5 mm × 3.5 mm × 1.15 mm), and high design flexibility thanks to a two-chip construction. The sensitive part is a surface micromachined capacitive interdigitated structure realized from a SIMOX SOI substrate. The accelerometer operates in a closed loop mode using electrostatic feedback with conditioning circuitry realized in a 2 μm CMOS process. A high performance readout circuit using switched capacitors has been developed. Behavioural simulation results show a bandwidth of 630 Hz at ±50 g with 5 V power supply. The fabrication process includes the realization of a free-standing seismic mass by means of reactive ion etching and sacrificial oxide etching, the mechanical protection of the sensing element with a thin silicon cap bonded onto the structured SOI wafer, and eventually the electrical connection with the ASIC by flip-chip bonding. Preliminary results are very encouraging: dynamic actuation of the sensing elements is optically tested, with a yield of 70% at a prototype level. Excellent shock resistance and low internal stress are observed.

L. Zimmermann

Papers

Airbag application: a microsystem including a silicon capacitive accelerometer, CMOS switched capacitor electronics and true self-test capability