Many performance/cost advantages can be gained if a chip-set is optimally redesigned to take advantage of the high wire density, fast interconnect delays, and high pin-counts available in MCM-D/flip-chip technology. Examples are given showing for what conditions the cost of the system can be reduced through chip partitioning and how the performance/cost of a computer core can be increased. >

http://ieeexplore.ieee.org/iel4/96/10019/00475267.pdf

System design optimization for MCM-D/flip-chip

Many performance/cost advantages can be gained if a chip-set is optimally redesigned to take advantage of the high wire density, fast interconnect delays, and high pin-counts available in MCM-D/flip-chip technology. Examples are given showing for what conditions the cost of the system can be reduced through chip partitioning and how the performance/cost of a computer core can be increased by 81%.

http://ieeexplore.ieee.org/iel3/3860/11277/00512017.pdf

System design optimization for MCM

In the future, many everyday objects will be linked to each other by means of microelectronic components. The resulting ambient intelligence is predicted by several roadmaps in the field of information technology. Sensor networks can contribute costeffective solutions for the coupling of various objects. The combination of advanced technologies for chip fabrication, electronic packaging, and system integration is expected to lead to many innovations in the field of wireless sensor nodes. Wireless sensor networks are very complex systems with a wide range of realization options. Cost models are required to structure the development decisions in order to support hardware designers in identifying of cost drivers. The parameterized cost models for product development, system components, and fabrication processes represent a key element of the proposed cost optimization procedure. The granularity of the cost models is adjusted during the development process, starting with coarse cost models with few input parameters. In the later design phases, the cost-driving elements are continually refined in order to lower the estimation error in the cost assessment of implementation options. A design tool was developed for a rational decision-making with the goal of finding the most advantageous sensor network implementation. Through the integration of the developed cost models, the development team can examine the cost of various options in order to select the most appropriate system architecture and the corresponding manufacturing technologies. In the past, cost optimizations were usually based on a single target criterion. Therefore, all cost relevant influences were translated into monetary terms. Then, a minimization of the total cost was performed. Here, the choice fell on a multicriteria approach. This allows for consideration of all cost relevant criteria – ranging from development duration to process complexity – without the knowledge of how to quantify the corresponding costs. Evolutionary algorithms have been implemented to determine the Pareto-front of the most cost-efficient sensor network options. The result was a design tool, which supports the hardware designer in cost optimization of wireless sensor networks. Thus, the user is able to adequately adjust the design focus during the entire cost reduction process. The verification of the developed cost models and the implemented design tool was very successful in practical applications. Valuable insights were gained from the example of a sensor network for condition monitoring in paper plants. Important conclusions were drawn regarding which technology alternatives are particularly suitable for the cost situation of today. Cost reduction strategies were derived for universal and modular sensor nodes in moderate quantities for niche applications. Furthermore, the current cost boundaries for very simple sensor network architectures have been determined. To optimize costs in similar system classes – such as cost effective radio modules and digital sensors – a transfer of the developed methods is possible with reasonable effort. It is expected, for a holistic optimization of wireless sensor networks, that future topics will to take into account further system parameters, for instance, coupling the cost models with reliability models. Those model enhancements will become an important research topic.

/pdf/methoden-zur-kostenoptimierung-von-drahtlosen-5fvtojtwcm.pdf

Methoden zur Kostenoptimierung von drahtlosen Sensornetzwerken

In the design of electronics packaging systems, there is rarely a single “best” solution; the final design is usually a tradeoff between different performance attributes (system speed, thermal constraints or size) and cost. In many cases, tradeoffs between cost and performance are the most important. Unfortunately, the analysis of cost and performance tradeoffs is a very complex task. On the performance end, the vast variety of design options available today to the packaging engineer precludes an exhaustive analysis of all viable alternatives. On the cost end, the treatment usually is even more cursory because of the complexity and uncertainty of cost before actual production.

Lee Hong Ng

Papers

MCM Package Selection: Cost Issues