A method including modelling, by a computer system, a high resolution patterning error information of a patterning process involving a patterning device in a patterning system using an error mathematical model, modelling, by the computer system, a correction of the patterning error that can be made by a patterning device modification tool using a correction mathematical model, the correction mathematical model having substantially the same resolution as the error mathematical model, and determining, by the computer system, modification information for modifying the patterning device using the patterning device modification tool by applying the correction mathematical model to the patterning error information modeled by the error mathematical model.

Method and apparatus to correct for patterning process error

A method including: obtaining information regarding a patterning error in a patterning process involving a patterning device; determining a nonlinearity over a period of time introduced by modifying the patterning error by a modification apparatus according to the patterning error information; and determining, by a computer system, a patterning error offset for use with the modification apparatus based on the determined nonlinearity.

Method and apparatus to reduce effects of nonlinear behavior

The invention relates to a method for determining at least one unknown laser beam parameter of a laser beam used for correcting errors of a transparent material including inducing a first persistent modification in the material by an interaction with the laser beam having a first set of laser beam parameters, measuring the induced first persistent modification of the material, calculating a second persistent modification in the material using a model describing persistent modifications in the material with a second set of laser beam parameters, wherein the first set of laser beam parameters comprises the second set of laser beam parameters and the at least one unknown laser beam parameter, setting up a target functional including the first persistent modification and the second persistent modification, and determining the at least one unknown laser beam parameter by minimizing the target functional.

Method And Apparatus For The Determination Of Laser Correcting Tool Parameters

The invention relates to a method for generating a predetermined three-dimensional contour of a component and/or a wafer, comprising: (a) determining a deviation of an existing three-dimensional contour of the component and/or the wafer from the predetermined three-dimensional contour; (b) calculating at least one three-dimensional arrangement of laser pulses having one or more parameter sets defining the laser pulses for correcting the determined existing deviation of the three-dimensional contour from the predetermined three-dimensional contour; and (c) applying the calculated at least one three-dimensional arrangement of laser pulses on the component and/or the wafer for generating the predetermined three-dimensional contour.

Method and apparatus for generating a predetermined three-dimensional contour of an optical component and/or a wafer

A method of forming a pattern on a mask sheet using a laser beam includes determining a target scan line with respect to the mask sheet, which corresponds to a position of the pattern on a final mask sheet, determining a correction scan line with respect to the mask sheet, along which the laser beam is scanned to form the pattern of the final mask sheet, applying a counter force to the mask sheet, fixing the mask sheet onto a mask frame while the counter force is applied to the mask sheet, scanning the laser beam along the correction scan line, and releasing the counter force which is applied to the mask sheet.

Method for forming a mask pattern using a laser

Provided are photomask registration errors of which have been corrected and a method of correcting the registration errors of a photomask. The photomask includes a photomask substrate, an optical pattern formed on one surface of the photomask substrate, and a plurality of stress generation portions formed in the photomask substrate. A method of correcting the registration errors of a photomask includes the steps of forming an optical pattern on a photomask substrate, measuring the registration errors of the optical pattern, and forming a plurality of stress generation portions in the photomask substrate so that the stress generation portions correspond to the measured registration errors.

Photomask registration errors of which have been corrected and method of correcting registration errors of photomask

A photomask with corrected registration is provided to reduce the fabricating cost of a photomask and a semiconductor device and shorten an interval of fabrication time by reprocessing and using a completed photomask according to a registration error An optical pattern is formed on one surface of a photomask substrate Laser is irradiated to the inside of the photomask substrate to form a plurality of stress generating parts(220) capable of corresponding to a registration error of the optical pattern The optical pattern can physically be transferred by the stress generating parts to correct the registration error of the optical pattern

Lee Jung Hoon

Papers

Photomask registration errors of which have been corrected and method of correcting registration errors of photomask

Registration corrected photomask and method for correcting photomask registration