Presented are methods, systems, and apparatuses for managing and maintaining an electronic device such as a sensor apparatus.

Sensor apparatus management methods and apparatus

A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for a more simplified configuration.

Determining process condition in substrate processing module

A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.

Integrated process condition sensing wafer and data analysis system

A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for easy configuration.

Data collection and analysis system

A process module tuning method characterizes a process module by gathering data using a process condition measuring device to measure process outputs while inputs are excited The data is used to identify a dynamic process model The dynamic process model is then be used to determine process input settings that will produce desired outputs For multi-zone process modules, the interactions between zones may be modeled

Process module tuning

A temperature stabilized CMOS oscillator circuit modifies the gain of a CMOS oscillator transistor to cancel the gain variation over temperature using a bias circuit. The bias circuit utilizes a combination of two current mirrors to establish a temperature compensating supply current to a CMOS oscillator transistor. A primary current mirror and a temperature variable resistor establish a current in the current mirror output to the CMOS oscillator transistor. A secondary current mirror and a temperature variable resistor divert current from the primary current mirror over temperature to vary the current mirror output to the CMOS oscillator transistor to compensate for its gain variation.

Temperature stabilized CMOS oscillator circuit

A rubidium frequency standard control circuit which utilizes an initial sweep hand-off frequency locking process followed by a negative feedback loop for optimization of the stability of the voltage control oscillator employing the rubidium frequency standard.

Leo J. Haman

Papers

Temperature stabilized CMOS oscillator circuit

Rubidium frequency standard control method and system for voltage-controlled oscillators