A surface cleaning apparatus comprises a body including a rear compartment, a forward compartment and an intermediate compartment arranged between the rear and forward compartments. An elongate rotatable brush arrangement is positioned within and extends across the forward compartment. An electric motor is positioned in the rear compartment, and drive means extends between the rotatable brush arrangement and the electric motor.

Surface cleaning apparatus

Temperature probes for measuring the temperature of objects are disclosed. The temperature probes include a housing and a tip in thermal contact with an end of the housing. The tip is adapted to contact a surface of the object whose temperature is to be measured by the temperature probe. A portion of the housing in contact with the tip has a high thermal resistance effective to thermally isolate the tip from an adjacent portion of the housing. A sensor is located inside of the housing and adapted to measure the temperature of the tip.

Temperature probes having a thermally isolated tip

Methods for processing a vessel, for example to provide a gas barrier or lubricity, are disclosed. First and second PECVD or other vessel processing stations or devices and a vessel holder comprising a vessel port are provided. An opening of the vessel can be seated on the vessel port. The interior surface of the seated vessel can be processed via the vessel port by the first and second processing stations or devices. Vessel barrier, lubricity and hydrophobic coatings and coated vessels, for example syringes and medical sample collection tubes are disclosed. A vessel processing system and vessel inspection apparatus and methods are also disclosed.

Vessel, coating, inspection and processing apparatus

An eddy current sensor (10) has a sensor coil (100) disposed near a conductive film (6) formed on a semiconductor wafer (W) and a signal source (124) configured to supply an AC signal to the sensor coil (100) to produce an eddy current in the conductive film (6). The eddy current sensor (10) includes a detection circuit operable to detect the eddy current produced in the conductive film (6). The detection circuit is connected to the sensor coil (100). The eddy current sensor (10) also includes a housing (200) made of a material having a high magnetic permeability. The housing (200) accommodates the sensor coil (100) therein. The housing (200) is configured so that the sensor coil (100) forms a path of a magnetic flux (MF) so as to effectively produce an eddy current in the conductive film (6).

Eddy current sensor

A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for a more simplified configuration.

Determining process condition in substrate processing module

An apparatus for measuring thickness in super-thin films consists of a special resonator unit in the form of an open-bottom cylinder which is connected to a microwave swept frequency microwave source via a decoupler and a matching unit installed in a waveguide that connects the resonator unit with the microwave source. The apparatus operates on the principle that thin metal film F, the thickness of which is to be measured, does not contact the end face of the open bottom of the cylindrical resonator sensor unit and functions as a bottom of the cylindrical body. The design of the resonator excludes generation of modes other than the resonance mode and provides the highest possible Q-factor. As the conductivity directly related to the film thickness, it is understood that measurement of the film thickness is reduced to measurement of the resonance peak amplitudes. This means that superhigh accuracy inherent in measurement of the resonance peaks is directly applicable to the measurement of the film thickness or film thickness deviations.

Method and apparatus for precision measurement of film thickness

A universal electromagnetic resonance system is aimed at detecting and measuring local non-uniformities in objects made from conductive or non-conductive materials. The system comprises a composite measuring unit composed of two identical and symmetrically arranged individual oscillation circuits with measurement elements in the form of identical and symmetrically arranged inductive coils or capacitor chips. The unit is connected to an impedance analyzer for supplying RF current and for measuring the voltage signal in the oscillation circuit. Since all the elements of individual oscillation circuits are identical, in the case of non-uniformity of the object on the scanned area, the parameters of the resonance will hanged. This change will violate the symmetry in the operation of the individual oscillation circuits. The variation in measured signal can be calibrated in terms of the target parameter or characteristic of the object.

Universal electromagnetic resonance system for detecting and measuring local non-uniformities in metal and non-metal objects

An apparatus of the invention is intended for multiple identical continuous records of characteristics on the surface of an object, e.g., a semiconductor wafer, after selected stages of manufacture and treatment. The apparatus is provided with a rotary table for rotation of the wafer with a mechanism for installing the wafer in a predetermined initial position for starting measurements from the same point after each selected stage of manufacture or treatment. The measurements are synchronized for all sequential manufacturing stages of the wafer and are carried out with the use of a resonance sensor based on the principles of resonance sensor technology. The recorded information is stored on a memory device, and if the final product has a defect or deviations, the stored information can be easily retrieved for revealing the time, place on the product, and the source of the defect. The same records can also be used for correlation between the defects or deviations and the failure of the final product on quality control and even during exploitation of the chip in a semiconductor device.

Apparatus and method for multiple identical continuous records of characteristics on the surface of an object after selected stages of manufacture and treatment

The system of the invention for measuring characteristics of thin conductive and non-conductive material, such as bulk material or films, is based on the use of a resonance oscillating circuit that incorporates at least two components selected from the group consisting of an inductive coil and a capacitor, which in combination form a sensor that could be approached close to the surface to be measured. The measurement of the film or material characteristics, such as film resistance (film thickness) or a dielectric constant (film thickness) of a non-conductive material, is based on the principle that the sensor is approached to the measured surface at a distance, at which the inductance and capacitance of the sensor generate in the measured material a virtual coil and an additional capacitance, which strongly depend on the characteristics of the measured material. As the sensor approached towards the surface to be measured, the sensor-material system generates a series of resonances having different values of power. One of these resonances can be defined as the so-called full resonance, which is characterized by the maximum value of the power, and hence provides the most accurate measurement and can be used for precisely determining the measurement distance. By comparing the results of measurements with those known from measuring the precalibrated films or materials under the same conditions, it becomes possible to determine the target characteristics of the films or materials. Stabilization of the measurement distance can be carried out by the same methods as described in U.S. patent application Ser. No. 434,625 of the same applicants.

System and method for measuring characteriscs of materials with the use of a composite sensor

The invention relates to an apparatus and method for measuring thickness and deviations from the thickness of very thin conductive coatings on various non-conductive substrates, or of very thin non-conductive coatings on conductive substrates The apparatus consists of an inductive coil having specific parameters, an external AC generator operating on frequencies, eg, from 50 MHz to 25 GHz, preferably from 100 MHz to 200 MHz, and a measuring instrument, such as an oscilloscope, voltmeter, etc for measuring output of the sensor The coil has miniature dimensions The invention is based on the principle that inductive coil of the sensor, active resistance of the coil winding, inherent capacitance of the inductive coil (or a separate capacitor built into the sensor's circuit), and the aforementioned AC generator form a parallel oscillating circuit The apparatus operates on very high resonance frequencies, preferably within the range of 100 to 200 MHz, at which a capacitive coupling is established between the coil of the oscillating circuit and the thin films being measured By measuring the parameters of the resonance oscillating circuit, it becomes possible to measure film thickness below 500 Angstroms

Leonid Velikov

Papers

Method and apparatus for precision measurement of film thickness

Universal electromagnetic resonance system for detecting and measuring local non-uniformities in metal and non-metal objects

Apparatus and method for multiple identical continuous records of characteristics on the surface of an object after selected stages of manufacture and treatment

System and method for measuring characteriscs of materials with the use of a composite sensor

Method and apparatus for measuring thickness of thin films with improved accuracy