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Leslie Moore

Researcher at Eastman Kodak Company

Publications -  13
Citations -  335

Leslie Moore is an academic researcher from Eastman Kodak Company. The author has contributed to research in topics: Image sensor & Color image. The author has an hindex of 10, co-authored 13 publications receiving 335 citations.

Papers
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Patent

A color sequential optical offset image sampling system

TL;DR: In this paper, a color image beam is generated by a set of primary color filters, including at least two filters of the same color, with at least one of the filters being capable of displacing the image beam by a distance equal to a fraction of the distance between adjacent pixels.
Patent

Method for rapidly changing digital content for a digital cinema house

TL;DR: In this article, a method for rapidly changing digital content for a digital cinema house is described, which includes assigning the digital content to a first server for transmitting to the first projector in a cinema house; and deciding to change an assigned playback location of the digital contents to a second projector.
Patent

Illumination system for a film scanner

TL;DR: In this paper, an illumination system for a film scanner is described, which comprises a light source and optics for providing a line of light on a film, and an integrating cylinder is used to provide diffuse light on the film.
Patent

Telecine scanning apparatus with spectrally-shifted sensitivities responsive to negative or print film dyes

TL;DR: In this article, a telecine scanner is selectively conformed to evaluate the dye densities characteristic of either negative or print film by inserting an appropriate shaping filter set (44, 45) into the light path, preferably between the light source and the film, for conforming the peak sensitivity of at least one of the passbands to the peak spectral density of the corresponding dye of the particular film material.
Patent

High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact.

TL;DR: In this article, a multilayer circuit board having layers of conductive material separated by layers of insulating material and having an opening therethrough sufficient in size to accept the heat sink provides the system support.