L
Li Konglin
Publications - 10
Citations - 64
Li Konglin is an academic researcher. The author has contributed to research in topics: Layer (electronics) & Substrate (printing). The author has an hindex of 3, co-authored 10 publications receiving 64 citations.
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Patent
Communication equipment metal shell and preparation method thereof
TL;DR: In this article, a communication equipment metal shell is described, which consists of a metal substrate with more than one slit, an anodic oxidation film layer and a plastic support layer.
Patent
Preparation method for communication equipment metal shell
TL;DR: In this paper, a preparation method for a communication equipment metal shell and the corresponding metal shell obtained by the method is described, which consists of three steps: 1) providing the metal shell which comprises a metal matrix and a plastic supporting layer attached to the inner surface of the metal matrix; 2) forming more than one narrow slit by laser etching; 3) forming a decorative layer on the outer surface; and 4) processing the narrow slit with a smooth and burr-free surface.
Patent
Communication equipment metal shell
TL;DR: In this paper, a communication equipment metal shell, which comprises a metal substrate, more than one slit, a plastic support layer and a decorative layer, is described, and the ratio of the widths of the slits on the inner surface of the metal substrate to those on the outer surface is (1.05-1.5) to 1.5.
Patent
Metal shell of communication equipment
TL;DR: The metal shell of communication equipment includes a metal substrate, a slit penetrating an inner and an outer surface, a plastic-supporting layer formed on the inner surface of the metal substrate and a decorative layer forming on the outer surface as mentioned in this paper.
Patent
Communication equipment metal housing and preparation method therefor
TL;DR: In this article, a method for preparing a communication equipment metal housing and a corresponding metal housing obtained by the method is described, which is based on a first injection in a non-slit area on the inner surface of a metal substrate, opening one or more slits in a slit area, and then performing a second injection in the slit area.