A power semiconductor device includes trenches disposed in a first base layer of a first conductivity type at intervals to partition main and dummy cells, at a position remote from a collector layer of a second conductivity type. In the main cell, a second base layer of the second conductivity type, and an emitter layer of the first conductivity type are disposed. In the dummy cell, a buffer layer of the second conductivity type is disposed. A gate electrode is disposed, through a gate insulating film, in a trench adjacent to the main cell. A buffer resistor having an infinitely large resistance value is inserted between the buffer layer and emitter electrode. The dummy cell is provided with an inhibiting structure to reduce carriers of the second conductivity type to flow to and accumulate in the buffer layer from the collector layer.

Power semiconductor device

LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techniques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.

Led light bulbs

In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.

Gas cooled led lamp

A process for providing a metal-seeded liquid crystal polymer comprises the steps of providing a liquid crystal polymer substrate, applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer, to etch the liquid crystal polymer substrate, and depositing an adherent metal layer on the etched liquid crystal polymer substrate using electroless metal plating or vacuum deposition of metal. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer substrate, followed by application of a palladium(II) solution, provides a metal-seeded liquid crystal polymer. An aqueous solution, comprising from 35wt.% to 55wt.% of an alkali metal salt, and from 10wt.% to 35wt.% of a solubilizer, provides an etchant for the liquid crystal polymer at temperatures from 50°C to 120°C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using the etchant compositions previously described.

Liquid crystal polymers for flexible circuits

LED based lamps and bulbs are disclosed that comprise a pedestal having a plurality of LEDs, wherein the pedestal at least partially comprises a thermally conductive material. A heat sink structure is included with the pedestal thermally coupled to the heat sink structure. A remote phosphor is arranged in relation to the LEDs so that at least some light from the LEDs passes through the remote phosphor and is converted to a different wavelength of light. Some lamp or bulb embodiments can emit a white light combination of light from the LEDs and the remote phosphor. These can include LEDs emitting blue light with the remote phosphor having a material that absorbs blue light and emits yellow or green light. A diffuser can be included to diffuse the emitting light into the desired pattern, such as omnidirectional.

Led based pedestal-type lighting structure

PROBLEM TO BE SOLVED: To secure desired luminance by using a plurality of chip LEDs. SOLUTION: This electric lamp type LED luminaire 1 having an electrode base 2 has a heat transfer case 3 incorporated with a power circuit, and a light transmissive cover 4 surrounding a substrate structure 5 of a polyhedral structure constituted of a plurality of substrates 6 and 7 mounted with a plurality of low luminance chip LEDs 10. The light transmissive cover 4 is formed as an inside-outside double structure of an outside cover 4a and an inside cover 4b, and has a sealing space 4c between the outside cover 4a and the inside cover 4b, and proper gas is sealed in the sealing space 4c. Fluorescent paints 22 and 24 are also typically applied to the outside cover 4a and the inside cover 4b. COPYRIGHT: (C)2010,JPO&INPIT

Electric lamp type led luminaire

PROBLEM TO BE SOLVED: To provide a method for partially plating substrates (including a single substrate and assembled substrates highly integrated with substrates of chip parts) composed of synthetic resins and other materials in order to manufacture electronic and electric parts, such as printed circuit boards and lead frame insert-forming circuit parts. SOLUTION: The method for partially plating the assembled substrates 21 by using catalysts for plating is provided with a stage for partially covering the surfaces to be plated or the segments exclusive of the surfaces to be plated with covering materials selected from water-soluble high-polymer materials and hydrolyzable high-polymer materials before or behind a stage for applying the catalysts for plating to be executed by immersing containers containing the assembled substrates 21 into the catalyst liquid for plating. COPYRIGHT: (C)2001,JPO

Partial plating method for substrate

PROBLEM TO BE SOLVED: To easily solve an error occurring based on latest information while reducing the burden of a user. SOLUTION: An electronic apparatus is so constituted as to be connectable to a prescribed network. A service center 100 is provided with database 101 storing error information occurring in a printer 201, a handling program corresponding to respective errors, and manual handling methods corresponding to the respective errors. When the error occurs in the printer 201, information related to the error is transmitted to the database 101, an automatic restoration program is searched in the database 101 based on the information related to the error and the searched program is transmitted to the printer 201. The printer 201 implements the transmitted program. COPYRIGHT: (C)2004,JPO

Method and system for handling error of electronic apparatus, and server

PURPOSE:To realize two-frequency resonance with the matching circuit with an antenna element in one-frequency resonating as it is in order to realize the antenna resonated by two frequencies with a simple mechanical structure. CONSTITUTION:The matching circuit is made up of a coil L1 being a component of an adjustment circuit to adjust a feeding point impedance of an antenna to have a series resonance characteristic which is capacitive in a 1st resonance frequency and inductive in a 2nd resonance frequency higher than the 1st resonance frequency, a capacitor C1 being a component of a 2-frequency compensation circuit adjusting almost equally a reactance component at the 1st resonance frequency and a reactance component at the 2nd resonance frequency and a lumped constant circuit consisting of a coil L2 and a capacitor C2 being components of a matching circuit for matching with a characteristic impedance of a feeder.

Two-frequency matching circuit for antenna

PROBLEM TO BE SOLVED: To provide a technique for accurately forming a fine metal bump on a flexible board. SOLUTION: This method of manufacturing a flexible board is carried out through a manner where a metal bump 16 is grown by the use of a mask film 13 that is patterned through photolithography. An opening is not provided to a polyimide film by the use of a laser beam, so that a fine opening can be accurately formed, and a fine metal bump 16 can be accurately formed. After the metal bump 16 is formed, the mask film 13 is removed, liquid resin material is applied thereon and then dried out for the formation of a film, and the film is cured into a resin film. In a stage of coating when the surface part is etched, the tip of the metal bump 16 can be made exposed.

亮伊藤

Papers

Electric lamp type led luminaire

Partial plating method for substrate

Method and system for handling error of electronic apparatus, and server

Two-frequency matching circuit for antenna

Manufacture of flexible board

亮 伊藤

Papers

Electric lamp type led luminaire

Partial plating method for substrate

Method and system for handling error of electronic apparatus, and server

Two-frequency matching circuit for antenna

Manufacture of flexible board

亮伊藤