A bibliography of 847 publications dealing with air cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks, extended surfaces and adhesives for bonding heat sinks. The papers are classified in several categories.

bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages

In airborne electronic packages, for either thermal or electrical reasons cooling air often is not ducted directly over the components but is passed through a heat exchanger. Consequently, the thermal path between the heat exchanger and the components must be of low impedance to result in efficient heat transfer. The high heat transfer coefficients obtainable as a liquid boils and condenses permit an effective reduction of the temperature drop between the electronic components and the heat exchanger. In this paper the development and design of an evaporative system utilizing gravity return flow is discussed, and the test results of such a system are compared with those obtained utilizing a conventional metallic conductive paths technique. Where heat dissipation or cooling air inlet temperature is high, the evaporative-gravity (ev-grav) system is shown to be the most effective.

An Evaporative-Gravity Technique for Airborne Equipment Cooling

A solution to the problem of cooling certain types of high heat-dissipating airborne electronic equipment is the modification of the equipment chassis to incorporate a simple plate-fin heat exchanger, sometimes called a ?cold plate.? In this paper equations for cold plates are developed and the effect of variations in fin configuration on performance are discussed. Theoretical and experimental results based on tubes mounted on a cold plate are found to compare very favorably. The application of the cold-plate technique is illustrated for power transistors. This method of cooling is shown to be useful and efficient.

Cold Plate Design for Airborne Electronic Equipment

In this paper, the multifunctional structure was designed in electronic equipment of the control system, reducing the weight in the housings of the electronic equipment, wire and cable. The functions of thermal design and dynamic design and protection design were completed by using structure. The qualitative analysis of the center control unit structure model was done. Thermal analysis and the thermal design of the multifunctional electronic equipment structure were finished on the basis of the thermal design principles and attention of the matters. The cooling capacity was increased by fin structure with the cold plate. The modeling analyses of the same multi- functional structure with different fin spacing and height were completed in Icepak. The curves of the maximum temperature for the multi-functional structures corresponding to a group of fin height were got. The high-power MCM chip was placed in the middle of the multifunctional structure, and the remaining low-power chips were distributed around, which can reduce the thermal coupling of the chip, reducing the overall temperature of the multi-functional structure effectively, which has certain theoretical significance to the design of today’s electronic devices.

Heat Design of Multi-Functional Structure of Electronic Equipment with Material Properties in Control System

Analysis of Heat Loadings in the Forced Cooled Electronic Chassis or Cold Plate

A method of cooling certain types of electronic equipment incorporates in the chassis a simple plate-fin heat exchanger, sometimes called a cold plate or cooled chassis. To determine which internal configuration gives most efficient heat transfer, equations for cold plates are developed, and fin density, height, and thickness are varied. The effect on required power, coolant flow rate, and pressure drop is noted, and some conclusions are drawn as to optimum design.

M. Stephenson

Papers

Design and Performance of Air-Cooled Chassis for Electronic Equipment