The present invention relates to a pressure sensitive adhesive composition comprising a thermoplastic polyurethane and a tackifying resin, which thermoplastic polyurethane is derived from an aromatic diisocyanate and/or a cycloaliphatic diisocyanate, a chain extender, and a polymeric diol and/or a hydrogenated polydiene diol and a hydrogenated polydiene mono-ol, and wherein the number average functionality of the diol and mono-ol ranges from 1.2 to 1.8. Further, the invention relates to a thermoplastic polyurethane for use in pressure sensitive adhesives and to articles containing the pressure sensitive adhesives.

Pressure sensitive adhesives comprising thermoplastic polyurethanes

Thermoplastic polyurethanes are formed from a polydiene diol, preferably a hydrogenated polybutadiene diol, having from 1.6 to 2 terminal hydroxyl groups per molecule and a number average molecular weight between 500 and 20,000, an isocyanate having two isocyanate groups per molecule, and optionally a chain extender having two hydroxyl groups per molecule. The thermoplastic polyurethane composition is prepared by a prepolymer method, preferably a solventless prepolymer method using the branched chain extender.

Use of polydiene diols in thermoplastic polyurethanes

This invention provides a process for producing a polyurethane resin from a hydrogenated polydiene diol or polyol having a functional group equivalent weight of 750 to 10000, a reinforcing agent having a functional group equivalent weight of 30 to 200, and a polyisocyanate. In a preferred embodiment, the process comprises reacting at least one of a polydiene diol or a reinforcing diol or triol with the polyisocyanate at an NCO/functional group molar ratio of 0.4 to 0.7 or a functional group/NCO molar ratio of 0.25 to 0.55 to form a stable reaction product, adding to this reaction product an additional sufficient amount of the polyisocyanate and, as needed, one or both of the polydiene diol or the reinforcing agent to bring the NCO/OH functional group ratio up to from 0.9 to 1.1 and to achieve a polydiene agent content of 35 to 80 wt.% (on solids basis) and a reinforcing agent content of 2 to 17 wt.% (on solids basis), and reacting this final mixture to form a cross-linked polyurethane product. This process can also be carried out at an OH/NCO ratio of 0.9 to 1.1 using a blocked polyisocyanate wherein the intermediate reaction product is a stable polyurethane resin.

Polyurethane compositions made from hydroxy-terminated polydiene polymers

A flame-retardant urethane resin composition comprises a polyisocyanate compound, a polyol compound, a trimerization catalyst, a foaming agent, a foam stabilizer, and an additive, in which the trimerization catalyst is at least one selected from the group consisting of a nitrogen-containing aromatic compound, a carboxylic acid alkali metal salt, a tertiary ammonium salt, and a quaternary ammonium salt, and the additive comprises red phosphorus and at least one selected from the group consisting of a phosphoric acid ester, a phosphate-containing flame retardant, a bromine-containing flame retardant, a boron-containing flame retardant, an antimony-containing flame retardant, and a metal hydroxide.

Flame-retardant urethane resin composition

Thermoplastic polyurethanes are formed from a hydrogenated polydiene diol having from 1.6 to 2 terminal hydroxyl groups per molecule and a number average molecular weight between 500 and 20,000, an isocyanate having two isocyanate groups per molecule, and optionally a chain extender having two hydroxyl groups per molecule. The thermoplastic polyurethanes have excellent resistance to moisture as evidenced by retention of more than 70%, preferably at least 85%, of original tensile strength after aging in water for 7 days at a temperature of at least 70° C. Preparation by a prepolymer method with subsequent addition of the chain extender is preferred.

Polyurethanes having improved moisture resistance

PROBLEM TO BE SOLVED: To obtain a phenolic resin material which can give a molding excellent in heat resistance and tracking resistance by mixing a resol phenolic resin as the main component with an inorganic filler which liberates its water of crystallization at 200 deg.C or above and an organic filler. SOLUTION: This material is obtained by mixing 20-40wt.% phenolic resin based on a resol phenolic resin with 45-60wt.% inorganic filler based on an inorganic filler which liberates its water of crystallization at 200 deg.C or above and 5-10wt.% organic filler. When a novolac phenolic resin is used in combination, it is used in an amount of at most 50wt.% based on the entire phenolic resin. The inorganic filler as the principal component is exemplified by aluminum hydroxide, magnesium hydroxide, talc or zeolite and is used in an amount of desirably at least 40wt.% based on the entire molding material. The organic filler is exemplified by a ground cloth or a pulp, which is desirable in respect of its ability to improve mechanical strengths. It is produced by mixing these components with other common additives such as a pigment and a curing agent and kneading the resulting mixture under heating.

Phenolic resin molding material

PROBLEM TO BE SOLVED: To obtain a phenolic resin composition excellent in water resistance, flame resistance and electric characteristics and suitably used for molded products requiring the characteristics, especially electronic parts. SOLUTION: This phenolic resin composition contains hexamethylene tetramine as a curing agent, and further contains a filler releasing crystal water at 100-150 deg.C in an amount of =50 pts.wt., as flame retardant components. Therein, at least one or more kinds of flame retardants used as the fillers releasing the crystal water at 200-500 deg.C include the flame retardants releasing >=20wt.% of the crystal water at 200-500 deg.C.

Phenolic resin composition

PURPOSE: To obtain a phenol resin compsn. excellent in flame retardance and useful for producing electronic parts by compounding a phenol resin, an inorg. filler which releases water of crystallization at 100 deg.C or higher, and microcapsuled ammonium phosphate. CONSTITUTION: This compsn. is prepd. by compounding 100 pts.wt. phenol resin with flame retardants comprising 5-20 pts.wt. inorg. filler which releases water of crystallization at 100 deg.C or higher and 1-10 pts.wt. ammonium phosphate microcapsuled with a resin. The inorg. filler is boric acid, aluminum hydroxide, unbaked clay, zinc borate, magnesium hydroxide, talc, etc., and is compounded pref. in an amt. of 5-10 pts.wt. The compsn. is further mixed with other fillers, pigments, and additives and kneaded to give a molding material. Usually a novolak phenol resin is used, but a resole phenol resin is used when heat resistance is esp. required.

Phenol resin composition

PURPOSE:To obtain the title compsn. having low initial viscosity, good processability, excellent electrical characteristics and moisture resistance and being suitable for a casting material for electrical and electronic parts, and which is comprised of a specified liq. polybutadiene, a caster oil polyol, a specified liq. short-chain diol and a liq. arom. polyisocyanate. CONSTITUTION:The title compsn. is comprised of a liq. polybutadiene (A) having prim. hydroxyl groups of 40mgKOH/g or more hydroxyl number, a caster oil polyol (B), a liq. short-chain polyol (C) having one prim. hydroxyl group and one sec. or tert. hydroxyl group in its molecule (e.g., 2-ethyl-1,3-hexanediol) and a liq. arom. polyisocyanate (D) [a compd. of the formula (wherein n>=0) is pref.]. The component B decreases the viscosity of the compsn. and increases the solubility between the components A and C. The component C, which is a chain extender and the initial reactivity of which is small, therefore acts as a reactive diluent and depresses the increase in viscosity of the system. This compsn. has low initial viscosity and long pot life. Moreover, as crosslinking density of the cured product is high and the cured product has excellent electrical characteristics and moisture resistance, the title compsn. is suitable as a casting material for electrical and electronic parts.

Liquid polyurethane resin composition

PROBLEM TO BE SOLVED: To provide a mold cleaning material for sealing a semiconductor with which abrasion of a mold is little and which is excellent in packing properties and cleaning effects. SOLUTION: The mold cleaning material comprises (A) a resol-type phenol resin which is solid at room temperature, (B) a filler containing hydrated amorphous silicon dioxide as a main component, and (C) spherical silica.

Maebotoke Shinichi

Papers

Phenolic resin molding material

Phenolic resin composition

Phenol resin composition

Liquid polyurethane resin composition

Mold cleaning material for sealing semiconductor