To provide a thin-film capacitor capable of preventing the degradation of electrical characteristics caused by direct contact between an adhesion layer of a terminal electrode and a dielectric layer, to increase the reliability. The thin-film capacitor comprises: a dielectric layer deposited on a base electrode; an upper electrode layer deposited on the dielectric layer; a terminal electrode including an adhesion layer, a seed layer, and a plating layer; a resin layer for wiring provided between the upper electrode layer and the terminal electrode for isolating the upper electrode layer from the terminal electrode; and a wiring layer provided so as to extend through the resin layer for wiring in contact with the adhesion layer for electrically connecting the upper electrode layer and the terminal electrode, wherein a composition of the wiring layer differs from that of the adhesion layer of the terminal electrode, and wherein a reducing power of the wiring layer to the dielectric layer is smaller than that of the adhesion layer.

Thin film capacitor

1.1 Definitions of Integrated Passives Passive elements are indispensable in RF systems and are used for matching networks, LC tank circuits, attenuators, filtering, decoupling purposes and so on (Tilmans H. A C et al., 2003). Passive elements can be simply classified into distributed elements including transmission lines and waveguides, and lumped elements including inductors, capacitors and resistors. The distributed circuits take into account the phase shift occurring when the signal wave propagates along the circuits. As the operating frequency moves into the microwave spectrum, the distributed circuits have a higher Q factor, and thus they are usually used for high-frequency applications. Lumped elements are zero-dimensional by definition. In other words, the lumped elements have no physical dimensions which are significant with respect to the wavelength at the operating frequency, so that the phase shift that arises can be ignored. Discrete lumped elements are conventionally used in electronic circuits that work at a lower frequency. This is because the sizes of the discrete lumped elements become comparable to the wavelength at microwave frequencies. With the advent of new photolithography and passive integration technologies, the three basic building blocks for circuit design-inductors, capacitors, and resistors can be made small enough to be available in lumped form (Tummala R. R. et al., 2000). Lumped passive components may be discrete, integrated or embedded. The discrete is a singular device in a leaded or surface mount technology (SMT) case. This includes screen-printed resistors, capacitors, and inductors. Passive integration technologies allow several passive components to be integrated, either into a substrate (embedded) or onto a substrate (integrated). Integrated passive devices usually come in a compact SMT package or chipscale package (CSP) as a stand-alone component with input, output and ground terminations, which is much smaller than the operating wavelength providing some complete circuit functions, such as impedance-matching, filtering and so on, for highfrequency applications up to several tens of GHz (Tilmans H. A C et al., 2003). The lumped element circuits have the advantage of a smaller size, lower cost, and wide-band characteristics, though the Q factor is generally lower than distributed circuits. Integrated lumped passive circuits with a small form factor are especially suitable for some RF and microwave applications where real estate or wide-band requirements are of prime importance, for example mobile phones or other handheld wireless products. The choice 13

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Integrated Passives for High-Frequency Applications

Embodiments of the invention avoid erasure of recorded data by concentrating stray fields on a magnetic head element. According to one embodiment, in a magnetic storage apparatus using a perpendicular recording medium with a soft magnetic under layer, a soft magnetic shield is provided so as to surround the upper parts and sides of magnetic head elements. A distance between the soft magnetic shield and the medium is shorter than that between the soft magnetic shield and the magnetic head element.

Magnetic head with soft magnetic shield and magnetic storage

A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z, wherein the structure comprises at least one capacitor coupled in series or parallel to at least one inductor to provide at least one filter; the at least one capacitor being sandwiched between the at least one feature layer and at least one via in said at least adjacent via layer, such that the at least one via stands on the at least one capacitor, and the at least one of the first feature layer and the adjacent via layer includes at least one inductor extending in the XY plane.

Multilayer electronic structures with embedded filters

A low stress sacrificial cap layer 120 having a silicon oxide liner film 130 , a low stress silicon film 140 , and a silicon nitride film. Alternatively, a low stress sacrificial cap layer 410 having a silicon oxide liner film 130 and a graded silicon nitride film 420 . Also, methods 300, 500 for fabricating a transistor 20, 400 having a low stress sacrificial cap layer 120, 410.

Low Stress Sacrificial Cap Layer

The capacitor (10) in accordance with the present invention comprises a lower electrode (14A), a dielectric layer (16) including an SiO2 layer (20) formed on the lower electrode (14A) and an Si3N4 layer (22) formed on the SiO2 layer (20), and an upper electrode (14B) formed on the dielectric layer (16). When the SiO2 layer (20) is thus interposed between the lower electrode (14A) and Si3N4 layer (22), the lower electrode (14A) and Si3N4 layer (22) adhere to each other more firmly than in the case where the Si3N4 layer (22) is directly formed on the lower electrode (14A) as in a conventional capacitor. Namely, since the dielectric layer (16) includes the Si3N4 layer having a higher dielectric constant, the capacitor (10) in accordance with the present invention yields a large capacitance, while the adhesion between the dielectric layer (16) and lower electrode (14A) is improved over the conventional capacitor.

Capacitor, method of making the same, filter using the same, and dielectric thin film used for the same

The invention provides an electronic component which has an improved breakdown limit value of withstand voltage and improved insulation properties and which can be made compact and provided with a multiplicity of layers and a great capacity. The electronic component includes a first conductor having a bottom conductor formed on a substrate and a raised conductor formed to protrude from the bottom conductor, a dielectric film formed on the raised conductor, and a second conductor formed on the dielectric film to constitute a capacitor element in combination with the raised conductor and the dielectric film.

Electronic component comprising a coil conductor and a capacity element

PROBLEM TO BE SOLVED: To provide a capacitor, its manufacturing method, a filter using it and a dielectric thin film using it for improving the adhesiveness of a dielectric layer and a lower electrode while increasing an electrostatic capacity. SOLUTION: A capacitor 10 is provided with a lower electrode 14A; a dielectric layer 16 having an SiO 2 layer 20 formed on the lower electrode 14A, an SiON layer 21 formed on the SiO 2 layer 20, and an Si 3 N 4 layer 22 formed on the SiON layer 21; and an upper electrode 14B formed on the dielectric layer 16. When the SiO 2 layer 20 is interposed between the lower electrode 14A and the Si 3 N 4 layer 22, the lower electrode 14A and the Si 3 N 4 layer 22 are more strongly adhered than such a case that the Si 3 N 4 layer 22 is directly formed on the lower electrode 14A just like a conventional capacitor. Furthermore, when the SiON layer 21 is interposed between the SiO 2 layer 20 and the Si 3 N 4 layer 22, the SiO 2 layer 20 and the Si 3 N 4 layer 22 are more strongly adhered. COPYRIGHT: (C)2006,JPO&NCIPI

Capacitor and method for manufacturing the same, filter using the same and dielectric thin film to be used therefor

The present invention provides a rotary head comprising a tubular rotary cylinder; and a magnetic head for carrying out at least one of recording and reading of information with respect to a magnetic tape transported about the rotary cylinder; wherein the magnetic head is supported so as to be movable toward the outside of the rotary cylinder.

Rotary head having an adjustment magnetic head and a magnetic recording/reproducing apparatus

PROBLEM TO BE SOLVED: To provide a magnetic head and its manufacturing method capable of always correctly executing, reproducing or writing of a magnetic record without being substantially badly influenced by a magnetic disturbance even if various kinds of magnetized particles or the like stick to the magnetic head or the like to cause the magnetic disturbance. SOLUTION: The main part of this magnetic head is composed of a core chip 12 and a slider 13 formed as another separated body of the core chip 12. An influence of a magnetic disturbance to the core chip 12 is prevented with the slider 13 by enclosing the core chip 12 with a magnetic body. The slider 13 may be entirely formed of a magnetic material or may be also constituted to provide a structural body consisting of a non-magnetic material and a magnetic material layer consisting of the magnetic material formed so as to cover the structural body. Further, the slider 13 may be also constituted to prepare the structural body consisting of the non-magnetic material and the conductive magnetic material layer formed so as to cover the structural body.

Makoto Shibata

Papers

Capacitor, method of making the same, filter using the same, and dielectric thin film used for the same

Electronic component comprising a coil conductor and a capacity element

Capacitor and method for manufacturing the same, filter using the same and dielectric thin film to be used therefor

Rotary head having an adjustment magnetic head and a magnetic recording/reproducing apparatus

Magnetic head and its manufacture