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Mang I Vai

Researcher at University of Macau

Publications -  206
Citations -  2728

Mang I Vai is an academic researcher from University of Macau. The author has contributed to research in topics: Computer science & Signal. The author has an hindex of 21, co-authored 181 publications receiving 2193 citations. Previous affiliations of Mang I Vai include University of Hong Kong.

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Proceedings ArticleDOI

In vivo validation of quasi-static field model in intra-body communication

TL;DR: Intra-Body communication (IBC) is a short-range body based communication using the human body as the transmission medium in biomedical application and the gain is greatly affected by the thickness of muscle both in calculation result and in vivo experiment.

An Investigation on Conductive Intracardiac Communication Dynamic Channel Gain During the Cardiac Cycle for Leadless Pacemakers

TL;DR: In this paper , the authors analyzed the effect of frequency and blood volume variations during the cardiac cycle on the channel gain in galvanic coupling conductive intracardiac communication channels of leadless pacemakers.

Temperature Fiber Sensor Based on 1-D CNN Incorporated Time-Stretch Method for Accurate Detection

TL;DR: In this article , the authors proposed a novel method for temperature detection based on 1-D CNN and time-stretch method, which can effectively solve the problem in demodulation and improve the detection speed.
Proceedings ArticleDOI

The Network Security Regime for the Hybrid Connection of Healthcare Entities

TL;DR: This paper proposes a method of creating a new subnet as common network area for sharing the resources, while maintaining their independencies at the same time, and adds the network security appliances (firewalls) connecting to the healthcare entities.
Proceedings ArticleDOI

Fabrication of CMUTs using sacrificial release process with ashing assisted polysilicon release

TL;DR: In this article , a capacitated micromachined ultrasonic transducer (CMUT) was fabricated in the sacrificial layer release process, with polysilicon as the main sacrificial material.