A system and method are presented for forming a grid array device package around an integrated circuit (i.e., chip). The device package includes a substrate and a heat spreader. The chip includes multiple I/O pads preferably arranged in a two-dimensional array on an underside surface. The substrate includes a first set of bonding pads on an upper surface configured to vertically align with the I/O pads. The chip is connected to the first set of bonding pads using the C4 method. The substrate maintains its substantially planar shape during C4 heating. The heat spreader is thermally conductive and preferably dimensioned to substantially cover the upper surface of the substrate. An underside surface of the heat spreader includes a cavity dimensioned to receive the chip and multiple pins extending outwardly therefrom. The substrate includes multiple holes adapted to receive the pins of the heat spreader. Following the C4 mounting of the chip upon the substrate, the heat spreader is attached to the upper surface of the substrate such that the pins of the heat spreader extend into the holes of the substrate and the chip resides within the heat spreader cavity. The ends of the heat spreader pins are connected to at least one member of a second set of bonding pads on the underside surface of the substrate, providing additional thermal paths for the dissipation of heat energy produced by the chip during operation.

Grid array device package including advanced heat transfer mechanisms

Method and apparatus for quickly and easily securing a computer device, such as a floppy disk drive, to a device carrier. In a preferred embodiment, the carrier contains a plurality of dowels that align with pre-existing screw holes on the device. When the device is placed into the carrier, a first dowel attached to a bottom panel of the carrier is inserted into a first screw hole of the device. The device is thereby partially secured to the carrier. The device is further secured to the carrier when both the device and the carrier together are inserted into a computer bay. As the carrier enters the computer bay, a second dowel flexibly attached to a side panel of the carrier is inserted into a second screw hole of the device. Therefore, whenever the device and carrier are in the computer bay, the device is completely secured to the carrier.

Carrier for a computer device

A screwless hard drive mounting in a computer system includes first and second interconnectable brackets. The first bracket is rigidly mounted on the computer chassis and provides a releasable engagement with the hard drive. The second bracket is movably mounted on the chassis and provides a releasable engagement with the hard drive and also provides a releasable engagement with the first bracket. A resilient member is mounted on the first bracket to releasably engage the hard drive and provide a preload between the hard drive and the first bracket. The resilient member further provides electrical grounding and vibration damping.

Screwless hard drive mounting in a computer system with a chassis via a first bracket rigidly mounted to the chassis and a second bracket movably mounted to the chassis

A disk-drive chassis of the invention has stiffening and damping members for reducing the transmission of vibrations between disk-drive units of a disk-drive array. The stiffening members include vertical dividers that are mechanically coupled between top and middle panels of the chassis. The stiffening members also include a corrugated stiffener attached to a bottom surface of the middle panel. The stiffener's corrugations are aligned parallel with a spindle axis of the respective disk-drive units. The damping member includes a constrained-layer damping plate which is attached to a top surface of the top panel by a visco-elastic damping adhesive. The chassis allows improved performance by the individual disk-drive units.

Disk-drive chassis for reducing transmission of vibrations between disk-drive units of a disk-drive array

A shield including a cover and pins is inserted in a solder-free connection into an electronic substrate for shielding electronic components on the substrate in an electronic device. The shield has a conductive cover, preferably with an integrally formed roof and wall, which defines a cavity. The cavity is configured to receive an electronic component or components positioned therein. The shield also has a conductive mounting pins which extend from the cover. The cover and the pins are preferably formed as a single piece. The shield also preferably includes a conductive gasket connected in a groove in the cover between the cover and the electronic substrate. Methods of assembling the shield on an electronic substrate in forming an electronic package for an electronic device are also provided.

Press-fit shields for electronic assemblies, and methods for assembling the same

There is disclosed a cover for protecting the leads extending between a silicon chip device and an associated printed circuit board and their electrical connections with the board. The cover is formed out of clear plastic allowing inspection of the chip device and has several legs for securing and maintaining the cover on the board and has openings that allow for cooling of the chip device.

Protective cover for a silicon chip device and method relating thereto

An apparatus and method are disclosed for minimizing the space required for a disk drive housing by mounting a disk drive unit in an enclosure of minimum size, using only a connection on one side of the disk drive and a drive belly plate, which is mounted on the bottom side of the disk drive, connected to an engaging surface on the bottom or intermediate cross-member of the superstructure, whereby the disk drive is held securely. The apparatus may accommodate four 3.5 inch form factor full height disk drives or six 3.5 inch form factor one inch high disk drive units. Additional space savings in the housing are achieved by the use of a unique electrical-connector attachment plate for connecting the cable connector terminals to the housing without the use of the normal connectors such as screws, bolts, etc.

Method and apparatus for assembly of a multi-disk pack unit

of EP0632455An apparatus and method are disclosed for minimizing the space required for a disk drive housing by mounting a disk drive unit in an enclosure of minimum size, using only a connection on one side of the disk drive and a drive belly plate, which is mounted on the bottom side of the disk drive, connected to an engaging surface on the bottom or intermediate cross-member of the super-structure, whereby the disk drive is held securely. The apparatus may accommodate four 3.5 inch form factor full height disk drives or six 3.5 inch form factor one inch high disk drive units. Additional space savings in the housing are achieved by the use of a unique electrical-connector attachment plate for connecting the cable connector terminals to the housing without the use of the normal connectors such as screws, bolts, etc.

Mario N. Palmeri

Papers

Protective cover for a silicon chip device and method relating thereto

Method and apparatus for assembly of a multi-disk pack unit

A method and apparatus for assembling several disk pack units