A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder

Preparation of polyimide polymers

A new copolymer composition comprising the hard segment of a polyimide and the soft segment of an oligomeric aliphatic polyester. The new polyimide copolymer membranes have exhibited high thermal stability for separation of an aromatic/saturate mixture. These new membranes have higher aromatic/saturate selectivity than polyurethanes.

Polyimide aliphatic polyester copolymers (C-2356)

A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use

Novel fluoro-containing polyetherimides are prepared from bis ether dianhydrides, fluoro-containing dianhydrides, and organic diamines The compolymers exhibit both increased Tg and increased solubility in halogenated solvents which enhances their value in a wide variety of uses including films, molding compounds, and coatings

Poly(etherimides) and compositions containing the same

The intercondensation of aryldiamine and a mixture of oxydiphthalic anhydride and aromatic bis(ether anhydride), such as 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]-propane dianhydride, have been found to provide tough flexible transparent copolymer having T g 's from about 217° C to 300° C

Polyetherimide copolymers, and method for making

Disclosed is a process for preparing oligomeric polyetheramide-acid by reacting an aromatic dianhydride component including an aromatic bis(ether anhydride) with an organic diamine in an inert organic liquid selected from methylene chloride, chloroform, 1,2-dichloroethane, and mixtures thereof with acetone. The oligomeric polyetheramide-acid is substantially insoluble in the inert organic liquid, in which the oligomer typically appears as a precipitate which may be recovered in powder or finely divided particulate form without need for grinding.

Solvent free or sinterable polyetheramide acid reaction product

Certain aryloxyphosphonium salts have been found to be effective as curing agents for various cationically polymerizable organic materials, such as epoxy resins, when incorporated into such materials. The materials are found to be moisture curable coating compositions.

Moisture curable compositions and aryloxyphosphonium salts

An improved substantially solvent-free process for preparing phthalate-moiety based polyesterimide resins, new resins prepared by the process, and substrates (e.g., electrical conductors) coated with compositions comprising the new resins are described.

Martin Andrew Byrne

Papers

Solvent free or sinterable polyetheramide acid reaction product

Moisture curable compositions and aryloxyphosphonium salts

Polyesterimide resins and synthesis thereof