Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Printed circuit board and method for manufacturing the same

PROBLEM TO BE SOLVED: To provide a method of efficiently depositing an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited. SOLUTION: A part of or the entire of an electroless gold-plating film of a plating film laminate on which an electroless nickel plating film, an electroless palladium plating film and an electroless gold-plating film are deposited, is formed by the electroless gold plating using an electroless gold plating bath containing a water-soluble gold compound, a complexing agent, a formaldehyde and/or formaldehyde bisulfite additive, and an amine compound expressed by a general formula R 1 -NH-C 2 H 4 -NH-R 2 or R 3 -(CH 2 -NH-C 2 H 4 -NH-CH 2 ) n -R 4 . In this method, two kinds of baths of a flash gold plating bath and a heavy-deposition gold plating bath need not be prepared. The gold-plated film of various kinds of thickness suitable for soldering or wire bonding can be deposited by one kind of gold plating bath. In particular, the electroless gold plating film of the thickness of ≥0.15 μm can be efficiently and effectively deposited in one process by using one kind of plating bath, the process can be simplified favorably in the cost aspect. COPYRIGHT: (C)2009,JPO&INPIT

Electroless gold-plating method and electronic component

PROBLEM TO BE SOLVED: To provide a wiring board for a light emitting device which suppresses the oxidization of a wiring pattern.SOLUTION: A wiring board 1 has: a substrate 10; a wiring pattern 20 formed on a first main surface R1 of the substrate 10; a plating layer 30 formed so as to cover a surface 20A of the wiring pattern 20; and an insulation layer 40 which covers the wiring pattern 20, where the plating layer 30 is formed, and is formed on the first main surface R1. An opening 40X, which exposes a part of the wiring pattern 20 where the plating layer 30 is formed as a mounting region CA of a light emitting element, is formed at the insulation layer 40. The plating layer 30 has a three layer structure formed by sequentially laminating a first plating layer 31 which is formed on the surface 20A of the wiring pattern 20 and made of Ni or Ni alloy; a second plating layer 32 made of Pd or Pd alloy, and a third plating layer 33 made of Au or Au alloy.

Wiring board for light emitting device, light emitting device, and manufacturing method of wiring board for light emitting device

A ceramic substrate part comprising on its upper surface pluralities of external electrodes comprising wire-bonding electrodes, each of which comprises a primer layer based on Ag or Cu, a Ni-based lower layer, an intermediate layer based on a Pd—P alloy containing 0.4-5% by mass of P, and a Au-based upper layer formed in this order on a ceramic substrate, the upper layer containing Pd after heated by soldering, and having a Au concentration of 80 atomic % or more based on the total concentration (100 atomic %) of Au and Pd.

Ceramic substrate part and electronic part comprising it

PROBLEM TO BE SOLVED: To provide a ceramic substrate being inexpensive and excellent in bonding property and solder wettability and an electronic component SOLUTION: The ceramic substrate has a plurality of external electrodes where an underlayer comprises mainly Ag or Cu A film comprising mainly Ni is formed on the surface of the underlayer, a film mainly comprising Pd is formed on its surface and a film mainly comprising Au is formed on its surface COPYRIGHT: (C)2007,JPO&INPIT

Ceramic substrate and electronic component using it

PROBLEM TO BE SOLVED: To provide a process for producing a substrate, having a terminal electrode exhibiting a high bonding strength to a bonding wire and solder and a strength sufficient for enduring flip-chip mounting. SOLUTION: On a underlying layer of Cu, or the like, formed on a substrate body, an Ni film or an Ni alloy film, a Pd film or a Pd alloy film, and an Au film are deposited sequentially and then heat treated at 200-300°C, for not longer than 120 sec, thus alloying the Pd film or the Pd alloy film and the Au film. COPYRIGHT: (C)2004,JPO

Masaaki Mizushiro

Papers

Process for producing substrate