A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, an effective amount of a cross-linkable diluent; (d) optionally, an effective amount of a source of free radical initiators; and (e) optionally, an effective amount of a resin. By employing an acrylate, methacrylate, or phenol in the structure of the adhesive flux, the cure temperature and moisture absorption characteristics can be significantly improved. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and otherelectrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simulatneously, the fluxing agent itself cross-links to mechanically bond and encapsulate the surfaces and their metallizations. The compositions can also be used to formulate sinterable conductive ink.

Polymerizable fluxing agents and fluxing adhesive compositions therefrom

A photocurable and thermosetting resin composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination: (A) a photosensitive prepolymer soluble in a dilute aqueous alkali solution obtained by esterifying an epoxy resin represented by the following general formula (1) with (meth)acrylic acid and further adding an acid anhydride thereto until an acid value reaches a level in the range of 60 to 120 mg KOH/g, (B) a diglycidyl ether type epoxy compound containing two epoxy groups in the molecular unit thereof, (C) a photopolymerization initiator, and (D) a diluent at such ratios of combination that said epoxy compound (B) accounts for a proportion in the range of 5 to 120 parts by weight and said photopolymerization initiator (C) for a proportion in the range of 0.1 to 30 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A): ##STR1## wherein X represents CH2, C(CH3)2, or SO2, n is an average value in the range of 1 to 12, and Y represents a hydrogen atom or a glycidyl group, providing that Y is a glycidyl group where n is 1 and at least one of the plurality of Y's is a glycidyl group where n is 2 or more.

Photocurable thermosettting resin composition developable with aqueous alkali solution

Proposed is a thermosetting powder coating composition comprising a mixture of particles reactive towards one another and a catalyst, with a portion of the reactive particles comprising a polymer reacting with epoxy to form ester forming or ether forming groups, while another portion comprises an at least bifunctional cross-linking agent which contains 2-oxo-1,3-dioxolan-4-yl groups, hereinafter referred to as cyclocarbonate groups, and, optionally, epoxy groups, with both the polymer reacting with epoxy to form ester forming and/or ether forming groups and the cross-linking agent being obtained by means of a non-vinylic addition and/or polymerisation process. The catalyst used as ring opener for the cyclocarbonate groups is present in a quantity of 0,01 to 10, preferably 0,1 to 5, parts by weight per 100 parts by weight of the mixture of particles reactive towards one another. The quantity of epoxy oxygen present in the cross-linking agent after CO2 unblocking preferably is at least 0,4 wt.%. The reactive polymer preferably is a polymer containing groups reactive towards epoxy such as carboxyl, anhydride and/or hydroxyl groups, with preference being given to polyesters and/or polyurethanes.

Thermosetting powder coating composition

Radiation curable paint

A process for the production of hydroxyalkylated phenolic or hydroxyalkylated thiophenolic compounds is disclosed. The process comprises providing a phenolic or thiophenolic compound, a cyclic organic carbonate compound, and a catalyst selected from the group consisting of an alkali metal, an alcohol-derived salt of the alkali metal, and mixtures thereof; and reacting the phenolic compound and the cyclic organic carbonate compound in the presence of the catalyst to form the hydroxyalkylated phenolic or hydroxyalkylated thiophenolic compound. Preferably, the alkali metal is selected from sodium, potassium, or lithium.

Hydroxyalklylation of phenols

A radiation-curing resin composition comprising (A) a resin having a carboxylic acid group and an unsaturated double bond, and (B) a compound containing a cyclocarbonate group. The composition is excellent in stability and curing properties and provides a cured film excellent in water resistance, solvent resistance, chemical resistance, and heat resistance.

Radiation-curing resin composition

PURPOSE: The titled composition which is excellent in pigment dispersibility and can give a cured film excellent in adhesion and mechanical strength, containing a resin obtained by reacting a specified urethane prepolymer with a specified compound and a specified carboxylic acid as a film-forming component. CONSTITUTION: In an organic solvent is dissolved a resin, as a film-forming component, obtained by reacting (A) a urethane prepolymer having at least one unreacted isocyanato group, obtained by reacting a polyol having at least two hydroxyl groups in the molecule with a compound having at least two isocyanato groups in the molecule (e.g., hexamethylene diisocyanate) at a hydroxyl group/isocyanato group ratio of 1/1.01W2 (ratio by equivalent) with (B) a compound having hydroxyl and epoxy groups (MW≤500) at a ratio of unreacted isocyanate to hydroxyl groups of component A of 1/1W2 and then reacted with (C) a (meth)acryloyloxy group-containing carboxylic acid at a ratio of epoxy groups to carboxyl groups of 0.5W2. COPYRIGHT: (C)1986,JPO&Japio

Masashi Kinoshita

Papers

Radiation-curing resin composition

Radiation-curable resin composition