An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

A thin film transistor (TFT) using an oxide semiconductor as an active layer, a method of manufacturing the TFT, and a flat panel display device having the TFT include source and drain electrodes formed on a substrate; an active layer formed of an oxide semiconductor disposed on the source and drain electrodes; a gate electrode; and an interfacial stability layer formed on at least one of top and bottom surfaces of the active layer. In the TFT, the interfacial stability layer is formed of an oxide having a band gap of 3.0 to 8.0 eV. Since the interfacial stability layer has the same characteristics as a gate insulating layer and a passivation layer, chemically high interface stability is maintained. Since the interfacial stability layer has a band gap equal to or greater than that of the active layer, charge trapping is physically prevented.

Thin film transistor, method of manufacturing the same, and flat panel display device having the same

Medical devices and methods for making and using the same are disclosed. An example device may include a catheter extending along a longitudinal axis. A balloon may be coupled to an end of the catheter. The balloon having a plurality of cylindrical treatment zones extending along the longitudinal axis in an expanded state. A plurality of electrode assemblies may be coupled to the balloon. Each electrode assembly may include a distal electrode pad and a proximal electrode pad.

Methods and apparatuses for remodeling tissue of or adjacent to a body passage

A circuitry sheet (322) comprising an electronic device layer stack (304) containing electronic devices, e.g., thin-film transistors, or portions thereof, formed by removing material from both sides of the device layer stack. The circuitry sheet may be made by an electronic/optoelectronic device manufacturing method (200) that includes the steps of forming the device layer stack on a temporary substrate (300), removing material from both sides of the device layer stack, and then attaching a permanent substrate (348) to the device layer stack. The method uses one or more resist layers (600) that may be activated simultaneously and independently to impart distinct circuit pattern images (603, 608, 612) into each of a plurality of image levels (612, 616, 620) within each resist layer, thereby obviating repetitive sequential exposure, registration and alignment steps.

Method of making a microelectronic and/or optoelectronic circuitry sheet

Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Semiconductor device packages with electromagnetic interference shielding

A semiconductor device includes: a substrate; a semiconductor chip that is fixed to a first surface of the substrate; a chip covering lid body that is provided on the first surface of the substrate so as to cover the semiconductor chip and that forms a hollow first space portion that surrounds the semiconductor chip, and in which there is provided a substantially cylindrical aperture portion that extends to the outer side of the first space portion and has an aperture end at a distal end thereof and that is connected to the first space portion; and a first resin mold portion that forms the first space portion via the chip covering lid body and covers the substrate such that the aperture end is exposed, and that fixes the substrate integrally with the chip covering lid body.

Semiconductor device, semiconductor device manufacturing method and lid frame

A method of fabricating a semiconductor device includes the steps of: providing a substrate having an insulating layer thereon; forming a connection hole including a first sub-hole and a second sub-hole mutually connected in the insulating layer, wherein the first sub-hole has a first diameter and the second sub-hole has a second diameter larger than the first diameter; forming a first conductive layer over the substrate; removing the first conductive layer to a thickness so as to form a side wall spacer film on a side wall of the second sub-hole and a plug film in the first sub-hole; forming a barrier metal layer over the substrate to cover the side wall spacer and the plug film; forming a second conductive layer over the substrate to fill space in the connection hole; and chemical mechanical polishing the second conductive layer.

Damascene wiring with flat surface

In a three-axis magnetic sensor, a plurality of magnetoresistive effect element bars are connected in series by means of bias magnets formed on a flat surface parallel to the flat surface of the substrate to constitute magnetoresistive effect elements. The sensitivity direction of magnetization is a direction perpendicular to the longitudinal direction of each of the magnetoresistive effect element bars. Magnetoresistive effect elements forming X-axis and Y-axis sensors have magnetization directions that are orthogonal to each other. Magnetoresistive effect elements of the Z-axis sensor are formed on a tilted surface substrate in such a way that the magnetization direction is inside the tilted surface. The sensitivity direction of the Z-axis sensor is perpendicular to the longitudinal direction of the magnetoresistive effect element bar.

Three-axis magnetic sensor and method for manufacturing the same

An azimuth processing device is designed for outputting azimuth data based on measurement data sequentially output from a compass sensor. In the device, an accumulation section selectively accumulates substantially new pieces of the measurement data. An offset data updating section updates offset data of the compass sensor based on plural pieces of the measurement data accumulated by said accumulation section. An azimuth data output section outputs the azimuth data based on substantially newest measurement data and the offset data.

Azimuth processing device, azimuth processing method, azimuth processing program, direction finding device, tilt offset correcting method, azimuth measuring method, compass sensor unit, and portable electronic device

A magnetic sensor includes a single substrate, a conventional GMR element formed of a spin-valve film including a single-layer-pinned fixed magnetization layer, and a SAF element formed of a synthetic spin-valve film including a plural-layer-pinned fixed magnetization layer. When the spin-valve film intended to act as the conventional GMR element and the synthetic spin-valve film intended to act as the SAF element are subjected to the application of a magnetic field oriented in a single direction at a high temperature, they become giant magnetoresistive elements whose magnetic-field-detecting directions are antiparallel to each other. Since films intended to act as the conventional GMR element and the SAF element can be disposed close to each other, the magnetic sensor which has giant magnetoresistive elements whose magnetic-field-detecting directions are antiparallel to each other can be small.

Masayoshi Omura

Papers

Semiconductor device, semiconductor device manufacturing method and lid frame

Damascene wiring with flat surface

Three-axis magnetic sensor and method for manufacturing the same

Azimuth processing device, azimuth processing method, azimuth processing program, direction finding device, tilt offset correcting method, azimuth measuring method, compass sensor unit, and portable electronic device

Magnetic sensor using giant magnetoresistive elements and method for manufacturing the same