A valve arrangement from microstructured components worked out of a basic body, for the control of fluids, include an actuation element which is movable relative to a flow path distributor and opens or closes fluid paths depending on its position. A transition from one position into the other is effected by adding an actuating drive connected to an electrical power source. The actuation element is held in its switch position. For a high fluid flow, a large force can be applied to the actuation element. The actuating drive works according to an operating principle aimed at covering the longest distance possible. A holding device is provided, which works according to an operating principle working independent of the first operating principle and provides the generation of the greatest cohesion possible.

Valve arrangement of microstructured components

An electronic tire maintenance system is provided for measuring a parameter of a device at a first location. The system includes a sensor for measuring the device parameter and generating a data signal representing the measured parameter. The system also includes a microprocessor coupled to the sensor for activating the sensor on a first periodic basis to measure the device parameter. The microprocessor includes a memory for storing the generated data signal representing the measured parameter. A transmitter and a receiver are coupled to the microprocessor. The microprocessor periodically partially awakens to determine, on a second periodic basis, if a received transmission is a valid interrogation signal and, if so, fully awakens and responds to the valid interrogation signal, via the transmitter, by at least transmitting the last stored measured parameter. In one embodiment, the device is a tire tag mounted inside a tire that measures tire data and transmits that data to a remote source in response to an interrogation request, an alert condition, or automatically on a periodic basis.

Electronic tire management system

An ink jet printer head comprises: a spacer (4, 200) including
path holes (5, 90) for forming pressure generating chambers
(48, 201) continuous to nozzle openings (2, 210a, 204), ink
supply paths (104, 202), and reservoirs (203); a cover member
(1, 210) for sealingly covering the pressure generating
chambers (48, 201); and pressure generating means (30) for
generating pressure in the pressure generating chambers (48,
201) in accordance with print data. In this ink jet printer
partition walls (111, 112) for partitioning the pressure
generating chambers (48, 201) are provided, separated from each
other by a space (110) in the form of a slit (114), and each of
them having such a thickness as to be resiliently deformable
when a pressure is applied for ink discharge.

Ink jet print head

Catalysts for automobile emission control

A method for making a semiconductor device of a type comprising at least first and second semiconductor circuit units, which method comprises the step of forming a plurality of connecting electrodes on an upper surface of each of at least first and second semiconductor substrates; forming an electrically insulating layer entirely over the upper surface of each of the first and second substrates so as to cover the respective connecting electrodes; partially removing the insulating layer on each of the first and second substrates to permit the respective electrodes to be exposed to the outside; forming metal studs on the first substrate in contact with the electrodes so as to protrude outwardly of the respective insulating layer to complete the first semiconductor unit and forming solder deposits on the second substrate in contact with the respective electrodes on such second substrate to complete the second semiconductor unit; combining the first and second semiconductor units with the metal studs in the first semiconductor unit aligned respectively with the solder deposits in the second semiconductor unit; and heating the resultant assembly to allow the solder deposits to be melted with the associated metal studs consequently immersed into the melted solder deposits thereby to accomplish a firm interlock between the electrodes on the first and second substrates.

Method of making a hybrid semiconductor device

An electrically controllable valve etched from two silicon substrates includes an inlet orifice communicating with two outlet orifices through a channel etched into the substrates. A mesa, in operative alignment with the inlet orifice, is suspended between the channel and a sealed recess by a diaphragm. The mesa has a permanent magnet attached thereto in operative alignment with a flat helical coil deposited on another substrate which seals the recess. Electronic control circuitry passes current through the coil in an appropriate direction to deflect the mesa in a corresponding direction for either opening or closing the valve. Equalized pressure is maintained on opposing mesa surfaces by a passageway communicating between the sealed recess and an outer surface of the valve thereby minimizing the force required to operate the valve.

Electrically controllable valve etched from silicon substrates

A method of bonding two silicon wafers each having a capacitive plate. Two highly-doped electrically semiconductive feedthrough paths are formed through one wafer, each path contacting one of the capacitive plates. A glass layer is formed on one of the silicon wafers where bonding is desired between the two wafers. The glass layer is anodically bonded to the other of the silicon layers.

Method of making silicon capacitive pressure sensor with glass layer between silicon wafers

A silicon variable capacitance pressure sensor has two silicon wafers. The first wafer has a first capacitor plate contacting a highly doped first semiconductor path through the first wafer. The second wafer has a second capacitor plate contacting a highly doped second semiconductor path through the second wafer. An insulating layer is attached to the first and second wafers for preventing electrically conductive coupling between the first and second wafers, thereby reducing parasitic capacitance between the first and second semiconductor paths.

High temperature pressure sensor with low parasitic capacitance

A method of forming a hermetic seal between two silicon wafers includes forming opposing troughs in each of the two wafers. In each trough are formed an isolation layer, a diffusion barrier and a tub of polysilicon. A gold strip is put on one polysilicon tub and the two silicon wafers are brought together and heated in a thermal gradient oven. A silicon gold eutectic is formed which migrates to the diffusion barrier of the silicon wafer.

Hermetic sealing of silicon

A capacitive pressure sensor uses two silicon wafers hermetically sealed to each other by recrystallized silicon formed by the migration of a ring of silicon-aluminum eutectic material from the wafer interface to the surface of one wafer. Within the ring of the eutectic a cavity with opposing conductive plates forms a capacitor. Another high conductivity path through the wafer can be formed simultaneously with the ring of eutectic material by placing an aluminum dot on the interior side of one silicon wafer. Thus, a high conductivity path is available through a silicon wafer for each of the two capacitor plates.

Mati Mikkor

Papers

Electrically controllable valve etched from silicon substrates

Method of making silicon capacitive pressure sensor with glass layer between silicon wafers

High temperature pressure sensor with low parasitic capacitance

Hermetic sealing of silicon

Silicon capacitive pressure sensor and method of making