A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

Electronic device with electromagnetic shielding structures

A method for filling vias formed in a dielectric layer with a metal or metal alloy that has a low solubility with copper over copper containing interconnects, wherein the vias are part of a dual damascene structure with trenches and vias is provided. A sealing layer of a first metal or metal alloy that has a low solubility with copper is selectively deposited directly on the copper containing interconnects in at bottoms of the vias, wherein sidewalls of the dielectric layer forming the vias are exposed to the depositing the sealing layer, and wherein the first metal or metal alloy that has a low solubility is selectively deposited to only form a layer on the copper containing interconnects. A via fill of a second metal or metal alloy that has a low solubility with copper is electrolessly deposited over the sealing layer, which fills the vias.

Dual damascene fill

An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.

High phosphorus electroless nickel

A method of electrolessly plating an iron-based substrate, including immersing an iron-based substrate in an acidic solution, immersing the iron-based substrate in a basic complexing solution, immersing the iron-based substrate in a catalytic metal solution including a catalytic metal, and immersing the iron-based substrate in an electroless nickel plating solution or an electroless cobalt plating solution.

Pretreatment of iron-based substrates for electroless plating

The invention is directed to a process for electroless plating of a substrate, comprising; (i) contacting a substrate with a first plating fluid comprising one or more first plating metals in the presence of one or more first reducing agents to form a first plating on the substrate; and (ii) contacting the substrate with a second plating fluid comprising one or more second plating metals in the presence of one or more second reducing agents to form a second plating on the substrate; wherein the molar concentration of the one or more first reducing agents in the first plating fluid is higher than the molar concentration of the one or more second reducing agents in the second plating fluid, and/or the molar ratio of first reducing agent(s) to first plating metal(s) in the first plating fluid is higher than the molar ratio of second reducing agent(s) to second plating metal(s) in the second plating fluid The invention is also directed to a plated substrate that can be produced by such a method

Electroless plating of double nickel-phosphorous layers

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.

Electroless nickel coatings and compositions and methods for forming the coatings

An aqueous electroless nickel-phosphorous plating bath for forming an electroless nickel-phosphorous coating on an alkaline zincate coated substrate includes about 1.0 g/l to less than 5.0 g/l Ni, about 25 g/l to about 40 g/l hypophosphorous reducing agent; and 0 to about 120 g/l orthophosphite by-product. The electroless nickel-phosphorous bath with an orthophosphite concentration of up to about 120 g/l provides an electroless nickel-phosphorous deposit on the zincate coated substrate with an intrinsic stress that is more compressive than electroless nickel-phosphorous deposit provided using conventional electroless nickel-phosphorous baths.

Matthew Joseph Wojcik

Papers

Electroless nickel coatings and compositions and methods for forming the coatings

Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use

Electroless nickel-phosphorous plating method using baths with reduced ion concentration