Process gas discharged from a bypass pipe to a gas exhaust system can be prevented from diffusing back to the inside of a process chamber without having to install a dedicated vacuum pump at the downstream side of the bypass pipe. The substrate processing apparatus includes a process chamber accommodating a substrate, a gas supply system supplying process gas from a process gas source to the process chamber for processing the substrate, a gas exhaust system configured to exhaust the process chamber, two or more vacuum pumps installed in series at the gas exhaust system, and a bypass pipe connected between the gas supply system and the gas exhaust system. The most upstream one of the vacuum pumps is a mechanical booster pump, and the bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the mechanical booster pump.

Substrate Processing Apparatus

A build-up monitoring system in combination with a refrigerated enclosure comprises a refrigerated enclosure having a drain, a drain basin and a refrigeration unit adapted to maintain refrigerating conditions in the refrigerated enclosure. A build-up detector is positioned with respect to the refrigerated enclosure so as to monitor a level of build-up in the drain/drain basin. A condition analyzer receives detection data from the build-up detector, the condition analyzer identifying from the detection data a build-up in the drain/drain basin requiring an intervention. An interface indicates the requirement for the intervention. A method is provided to identify a build-up requiring an intervention in a drain/drain basin of a refrigerated enclosure.

Build-up monitoring system for refrigerated enclosures

Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot, e.g. a dual side-by-side end effector robot, during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.

High throughput method of in transit wafer position correction in a system using multiple robots

Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

Cluster tool architecture for processing a substrate

One sensor constituted of a light emission element and a light-receiving element is provided in a path through which a wafer is transferred. The sensor is positioned so that the wafer passes through an area between the light emission element and the light-receiving element. Coordinates of the center of the wafer are calculated based on encoder values obtained when the wafer starts passing through the sensor and when the wafer completes passing through the sensor, position data of wafer transfer means corresponding to the encoder value, and the diameter of the wafer; and thereby the amount of positional deviation of the center of the wafer from a reference position is calculated.

Wafer transfer apparatus, wafer transfer method and storage medium

A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Substrate handling system for aligning and orienting substrates during a transfer operation

A control system includes a clustered architecture having a master controller, a central control section including one or more first remote controllers under direct control of the master controller, and a distributed control section including a cluster controller controlled by the master controller. The cluster controller controls the activities of one or more second remote controllers. Each of the first and second remote controllers are utilized to drive one or more axes.

Scalable motion control system

The present invention is an edge grip aligner with buffering capabilities and a method for increasing the throughput of wafers through the device. According to one embodiment, the present invention has first and second buffer arms, and a chuck arm. A workpiece can be aligned while supported on the chuck arm. Once the workpiece is aligned, the chuck arm transfers the workpiece to the buffer arms so that a second workpiece can be aligned on the chuck arm. While the second workpiece is being aligned, an end effector can transfer the first workpiece away from the buffer arms and retrieve another workpiece to place upon the chuck arm.

Edge grip aligner with buffering capabilities

A substrate loading device having a frame, a cassette support, and a user interface. The frame is connected to a substrate processing apparatus. The frame has a transport opening through which substrates are transported between the device and processing apparatus. The cassette support is connected to the frame for holding at least one substrate holding cassette. The user interface is arranged for inputting information, and is mounted to the frame so that the user interface is integral with the frame.

Load port module

A dual paddle end effector robot (108) is disclosed which is capable of parallel processing of workpieces. The end effector (108) includes a lower paddle (250) rotatably coupled to an end of the distal link (106), and an upper paddle (252) rotatably coupled to the lower paddle (250). The lower paddle supports a drive assembly capable of rotating the upper paddle (252) with respect to the lower paddle (250). In one embodiment of the present invention, the dual paddle end effector robot (108) may be used within a wafer sorter to perform parallel processing of workpieces on a pair of aligners within a wafer sorter. In such an embodiment, the robot (100) may first acquire a pair of workpieces from adjacent shelves within the workpiece cassette. After withdrawing from the cassette, the respective paddles on the end effector (108) may fan out and transfer the wafers to the chucks of the respective aligners. After processing of the workpieces on the aligners is complete, the fanned end effector paddles may reacquire the workpieces, the upper paddle (252) may return to its home position located directly over the lower paddle (250), and then return the processed workpieces to their original cassette or to a new cassette. Parallel processing of workpieces in this fashion provides significantly greater throughput than in conventional wafer sorter systems. Throughput may be improved still further by providing buffering locations for the workpieces at the respective aligners.

Matthew W. Coady

Papers

Substrate handling system for aligning and orienting substrates during a transfer operation

Scalable motion control system

Edge grip aligner with buffering capabilities

Load port module

System for parallel processing of workpieces