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Michael P. Nesnidal

Researcher at Northrop Grumman Corporation

Publications -  12
Citations -  45

Michael P. Nesnidal is an academic researcher from Northrop Grumman Corporation. The author has contributed to research in topics: Dielectric & Layer (electronics). The author has an hindex of 3, co-authored 12 publications receiving 45 citations. Previous affiliations of Michael P. Nesnidal include TRW Inc..

Papers
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Patent

High power single mode semiconductor lasers and optical amplifiers using 2D Bragg gratings

TL;DR: In this article, a two-dimensional optical wavelength Bragg grating is embedded within a semiconductor laser medium to provide simultaneous frequency selective feedback for mode control in both the longitudinal and lateral directions.
Patent

Semiconductor-air gap grating fabrication using a sacrificial layer process

TL;DR: In this paper, a dielectric layer is deposited on a first semiconductor layer and is patterned and etched to define dielectrics strips, and then a semiconductor material is grown within the openings and then another semiconductor is grown over the entire surface after removing the dieslectric strips.
Proceedings ArticleDOI

Large spatial mode, single frequency semiconductor lasers using two dimensionalgratings

TL;DR: In this article, the authors demonstrate single mode operation of laser diode cavities up to 200|iim wide using 2-D Bragg gratings for simultaneous longitudinal and lateral mode control.
Patent

High power single mode-semiconductor laser with two- dimensional bragg grating and optical amplifier

TL;DR: In this article, a waveguide is equipped with a two-dimensional optical wavelength Bragg grating 20 embedded inside a semiconductor laser medium 16, where a light of a certain wavelength can be selectively fed back at the same time for controlling the mode of a laser in both the longitudinal and a lateral direction.
Patent

High index-step grating fabrication using a regrowth-over-dielectric process

TL;DR: In this paper, a dielectric layer is deposited on a first semiconductor layer (64), and is patterned and etched to define dielectrics strips (66), followed by another semiconductor material (70) is grown within the openings and then the entire surface is removed.