Porous ternary Pd–Co–P alloy network nanostructures were synthesized by reducing K2PdCl4/K3Co(CN)6 cyanogel with a mixture of NaH2PO2 and NaBH4 at room temperature, which show superior electrocatalytic activity and stability towards hydrazine oxidation reaction.

Facile synthesis of Pd–Co–P ternary alloy network nanostructures and their enhanced electrocatalytic activity towards hydrazine oxidation

Dramatically enhanced aerobic Cr(VI) reduction with scrap zero-valent aluminum induced by oxalate

Both citrate and hypophosphite in aqueous solution were degraded by advanced oxidation processes (Fe2+/H2O2, UV/Fe2+/H2O2, and electrolysis/ Fe2+/H2O2) in this study. Comparison of these techniques in oxidation efficiency was undertaken. It was found that Fenton process could not completely degrade citrate in the presence of hypophosphite since it caused a series inhibition. Therefore, UV light (photo-Fenton) or electron current (electro-Fenton) was applied to improve the degradation efficiency of the Fenton process. Results showed that both photo-Fenton and electro-Fenton processes could overcome the inhibition of hypophosphite, especially the electro-Fenton.

Removal of citrate and hypophosphite binary components using Fenton, photo-Fenton and electro-Fenton processes.

The effect of cupric (Cu2+) ion as an additive in the acidic electroless nickel plating (ENP) bath on the characteristics of the resulting nickel−phosphorus (Ni−P) alloys was investigated mainly with X-ray diffraction, scanning electron microscopy, and energy-dispersive X-ray (EDX) spectrometry. Cupric ions in the acidic ENP bath using hypophosphite anions as reductants have been reported ambiguously as stabilizers or codeposit constituents. In this work, the critical concentration of added copper salts, CuSO4·5H2O, that starts to inhibit the ENP process was determined to be ca. 536 mg/L. In general, the deposition rate, surface morphology, and pit formation on the surface of as-deposits are significantly improved with Cu2+ addition at concentrations less than the critical value. The electroless nickel alloys were shown as a mixture of an amorphous deposit and a crystalline copper metal rather than as amorphous alloys alone.1,2 During the initial stage of the electroless plating process, the copper conten...

Role of Cu2+ as an Additive in an Electroless Nickel−Phosphorus Plating System: A Stabilizer or a Codeposit?

Electroless deposition is a process that has been used in practice for centuries. Although not recognized as such, electroless deposition of noble metals, e.g., silver or gold was known to the ancient civilizations. In spite of very slow developments throughout the centuries, significant scientific results have been achieved in the second part of the twentieth century. The research achievements in the area of electroless deposition have contributed to tremendous applications and developments in various industries.

Electroless Deposition: Theory and Applications

The two mechanisms of phosphorus incorporation with nickel in electroless plating nickel are studied using X-ray fluorescence spectrometer (XRF) and cyclic voltammetry (CV). The results of XRF and CV data on the effect ofsingle and double complexing agents on deposition rate and deposit composition indicate that nickel chelates can catalyze phosphorus generation, i.e., the mechanism of interface complex heterocatalysis on phosphorus incorporation with nickel. Furthermore, the choice principle to complexing agents for low-phosphorus electroless nickel bath was proposed based on it. Additionally, the direct mechanism of phosphorus generation can explain how single sodium hypophosphite can be reduced on nickel substrate on the CV curve. Finally, the optimal condition for low-phosphorus electroless nickel plating baths was determined. The experimental results support the explanation of the proposed mechanism.

http://jes.ecsdl.org/content/152/10/C669.full.pdf

Minglei Chi

Papers

Study of Optimized Complexing Agent for Low-Phosphorus Electroless Nickel Plating Bath