A reaction system and process for uniformly heating semiconductor substrates and a device for supporting the same and direct conductive heating of IC wafers within a reactor are described. The substrate is held in direct contact with the heating source positioned within the reactor. The heat source is a thermal delivery module made of material such as solid silicon carbide, or high temperature material containing resistive heating elements. The heat is uniformly transferred to the walls of the module by a molten metal having a low melting point and high boiling point such as essentially indium or bismuth or a eutectic or indium and bismuth.

Semiconductor substrate heater and reactor process and apparatus

In a method of producing a nanotube layer on a substrate by using a CVD process, the substrate is placed in a reaction chamber, which is flushed with a carbon-containing gas. Subsequently, the substrate is heated by an induction process to a temperature at which carbon from the gas phase is deposited on the substrate while forming nanotubes thereon.

Method of producing a nanotube layer on a substrate

A system for dehydrating lubricating and hydraulic fluids includes a heating circuit and circuitry for creating a vacuum. The heating circuitry introduces a stream of heated fluid into a vacuum chamber in which a partial vacuum is drawn by the vacuum circuit. Aqueous components of the fluid stream are flashed in the vacuum chamber by virtue of the elevated temperature and reduced pressure. Dehydrated fluid is then collected and evacuated from the vacuum chamber. Vapor from the vacuum chamber, including the aqueous components of the fluid stream are collected, condensed and separately evacuated. The heating circuit limits surface temperature of a heating element in a closed-loop manner to avoid degradation of the fluid. The fluid stream is introduced into the vacuum chamber or is recirculated through the heating circuit to maintain a desired level of fluid temperature in a closed-loop manner. The system includes circuits for evacuating dehydrated fluid in a closed-loop manner and for automatically discharging condensate. The technique avoids undesirable foaming of dehydrated fluid within the vacuum chamber. A vacuum pulsing circuit is provided for periodically pulsing vacuum pressure within the vacuum chamber to aid in flashing aqueous components from the heated fluid stream.

Apparatus for dehydrating oil

The present invention provides a process for the
production of a semiconductor device comprising a semiconductor
element provided on a printed circuit board with a plurality of
connecting electrode portions provided interposed therebetween,
the gap between said printed circuit board and said
semiconductor element being sealed with an underfill resin
layer. In accordance with the present invention, (1) the
underfill resin layer is formed by melting a lamellar solid
resin provided interposed between said printed circuit board
and said semiconductor element, and (2) the lamellar solid
resin provided interposed between said printed circuit board
and said semiconductor element is heated for a predetermined
period of time until the temperature of the solid resin layer
reaches a predetermined range where the two components are
connected to each other under pressure under the following
conditions (X) and (Y):
 (X) Supposing that the initial residual heat of reaction of
the solid resin before heating is 100% as determined by a
differential scanning calorimeter (DSC), the residual heat of
reaction thereof is not more than 70% of the initial residual
heat of reaction; and (Y) The temperature of the semiconductor element is
predetermined higher than that of the printed circuit board,
and the difference in temperature between them is not less than
50°C. In this manner, a production process which facilitates the
resin sealing of the gap between the semiconductor element and
the board and thus can inhibit warpage of the entire
semiconductor device and a semiconductor device having an
excellent reliability can be provided. In the present
invention, the use of a sheet-like underfill material which
gives an underfill resin layer having an elastic modulus in
tension at 25°C of from 300 to 15,000 MPa when hardened can
provide a semiconductor device which exerts an excellent effect
of relaxing the stress on the semiconductor element, printed
circuit board and connecting electrode portions and thus
exhibits a high reliability.

Manufacture of semiconductor device

There are provided a vaporizer for use with a CVD apparatus and a CVD apparatus, capable of long-term, reliable and efficient production of CVD film with good properties, and a semiconductor device manufactured employing the same. The vaporizer for use with a CVD apparatus is comprised of a material introducing tube, a vaporization chamber and a cooling member. The material introducing tube transports a mixture containing a solution of a material for the CVD film and a gas carrying the solution. The vaporization chamber is connected to the material introducing tube to vaporize the material introduced through the material introducing tube. The cooling member cools that portion of the material introducing tube adjacent to the vaporization chamber.

Vaporizer for chemical vapor deposition apparatus, chemical vapor deposition apparatus, and semiconductor device manufactured thereby

A vacuum evaporation apparatus for depositing an evaporant as a thin film on a substrate comprises a sealed container including a substrate support for mounting thereon the substrate. A heat medium such as of diphenyl, for example, is filled in the substrate support. The heat medium in the substrate support is supplied with heat by a heater. When heated, the heat medium is vaporized and the vapor gas having absorbed heat of evaporation is moved quickly from a high-temperature region to a low-temperature region. The vapor gas in the low-temperature region is supersaturated and turned into the heat medium liquid. The heat energy born as latent heat by the vapor gas is given off to heat the substrate support uniformly. With this thermosiphon action, the substrate can be heated through the substrate support so as to have a uniform overall temperature distribution for forming a uniformly deposited thin film on the substrate surface.

Vacuum evaporation apparatus

PURPOSE:To perform cooling and heating under uniform temperature distribution, by internally mounting one end of a cooling and heating device into a tightly-closed heat emitting and absorbing body, sealing a heat medium, which is different from a medium in the tightly-closed heat emitting and absorbing body, into the cooling and heating device, and heating and cooling the other end of the cooling and heating device. CONSTITUTION:In vacuum evaporation, a tightly-closed heat emitting and absorbing body 3 is rotated, a heater 6 is conducted, and a material to be evaporated 2 is evaporated at a high temperature. Thereafter one end of a cooling and heating device 12 is made to pierce through a bell jar 1. A refrigerant 14 is jetted to a cooling part 12a of the cooling and haeting device 12 from a nozzle 15, and the entire cooling and heating device 12 from a nozzle 15, and the entire cooling and heating device 12 is uniformly cooled from the inside. A high-temperature heat medium 5 in the tightly-closed heat emitting and absorbing body 3 is cooled, and the entire tightly-closed heat emitting and absorbing body 3 is cooled from the inside. The material to be evaporated 2 is cooled by the heat medium 5 and a heat medium in the cooling and heating device 12, whose boiling point is lower than that of the heat medium 5. Therefore, the material to be evaporated 2 in the high temperature state can be efficiently cooled under uniform temperature distribution.

Temperature controlling apparatus

PURPOSE:To provide a titled device which can form a thin film having uniform and high quality by using a hermetic vessel having a heating surface and a heater for heating the heat medium sealed in the hermetic vessel in forming a substrate heater CONSTITUTION:A substrate heater 4 is disposed in a bell-jar 2 to heat a substrate 5 The heater 4 consists of a hermetic vessel 6 having a heating plane (curved surface) 6a in the upper part, a heat medium 7 sealed in the vessel 6 after removing non-condensible gas therefrom and a heater 8 for heating the medium 7 The substrate 5 is heated in tight contact with the upper heating surface 6a of the heater 4, and is subjected to vapor deposition by a vapor source 16 placed in a boat 15 in a hood 14 disposed under guide rolls 11, 12 between said guide rolls The substrate 5 is uniformly heated by the above- mentioned device and the vapor deposition is uniformly accomplished

Forming device for thin film

PURPOSE:To perform effective temperature control, by arranging a detector for detecting temperature in a tightly sealed heat emitting and absorbing body, closely contacting the detector to the inner surface of the tightly sealed heat emitting and absorbing body, and detecting the temperature of the tightly sealed heat emitting and absorbing body accurately. CONSTITUTION:A temperature detector 5 is arranged in a tightly sealed heat emitting and absorbing body 1 and contacted to the inner surface of the tightly sealed heat emitting and absorbing body 1. In this constitution, the temperature detector 5 can always detect the temperature of the tightly sealed heat emitting and absorbing body 1 accurately. Therefore, the effective control of the temperature can be performed.

Temperature controlling device

PURPOSE:To heat or cool a tightly closed container evenly at every part, by always keeping the inside of the tightly closed container in a wet state by a heat medium. CONSTITUTION:In vacuum evaporation, a mandrel 3 and a material to be evaporated 2 are rotated by way of a rotary shaft 10 and a driving gear 11. When a heater 6 is conducted, a heat medium 5 in the mandrel 3 is gasified. The gas, which has absorbed heat in gasification, is sent to a part of the mandrel 3, where temperature is low, by a heat transfer action. The gas becomes a supersaturated state and condensed, and liquid is yielded. Then the mandrel 3 is heated by latent heat, and the temperture is balanced. Uneven patterns 13 are provided on the inner surface of the mandrel 3 and the outer surfaces of heater protecting pipes 7. Pick up implellers 14 are provided on the pipes 7. Therefore the inside of the mandrel 3 is always kept in the wet state by the heat medium 5. Thus the uniform heating becomes possible, and deteroration of the heat medium 5, thermal decomposition, and the deterioration of the heat medium 5, thermal decomposition, and the deterioration of the mandrel 3 and the like can be prevented.

Miura Shinichi

Papers

Vacuum evaporation apparatus

Temperature controlling apparatus

Forming device for thin film

Temperature controlling device

Heat exchanging apparatus