An oscillator includes an amplifier having an input and an output, a feedback network connected between the input of the amplifier and the output of the amplifier, the feedback network being configured to provide suitable positive feedback from the output of the amplifier to the input of the amplifier to initiate and sustain an oscillating condition, and a tuning circuit connected to the input of the amplifier, wherein the tuning circuit is continuously variable and consists of solid state electrical components with no mechanically adjustable devices including a pair of diodes connected to each other at their respective cathodes with a control voltage connected at the junction of the diodes. Another oscillator includes an amplifier having an input and an output, a feedback network connected between the input of the amplifier and the output of the amplifier, the feedback network being configured to provide suitable positive feedback from the output of the amplifier to the input of the amplifier to initiate and sustain an oscillating condition, and transmission lines connected to the input of the amplifier with an input pad and a perpendicular transmission line extending from the input pad and forming a leg of a resonant “T”, and wherein the feedback network is coupled to the leg of the resonant “T”.

High frequency inductive lamp and power oscillator

A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si 3 N 4 or Al 2 O 3 . An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

Ceramic circuit board with heat sink

A structure includes a metal nitride film of the form MN, where M is selected from the group consisting of Ga, In, AlGa, AlIn, and AlGaIn. The structure has at least one electrically conductive metal region that is formed within and from the metal nitride film by a thermal process driven by absorption of light having a predetermined wavelength. Single films comprised of AlN are also within the scope of this invention, wherein an Al trace or interconnect is formed by laser radiation of wavelength 248 nm so as to contact circuitry that exists under the film. Multilayered stacks of films are also within the scope of the teachings of this invention. In this case each film layer may be separately deposited and then illuminated to selectively form the desired electrical connection(s), which may also connect to conductive feature(s) in an underlying layer, or a plurality of metal nitride layers are stacked bottom to top in order of increasing electronic band gap energy value, and then the conductive features are written into selective ones of the layers by controlling the wavelength of the light to be absorbed in a desired layer. The teachings of this invention can be employed to fabricate fuses and anti-fuses enabling selective circuit customization, test and repair. Also disclosed is a technique for forming electrical resistors in a metal nitride layer by adjusting the electrical resistance of the metallization formed from the metal nitride film layer.

Metal embedded passivation layer structure for microelectronic interconnect formation, customization and repair

A metal matrix composite casting comprises a metal matrix composite and a processed member inserted in the metal matrix composite by enveloped casting. By the processed member which is easier to process than the metal matrix composite, a processed portion of a predetermined shape can be formed in the metal matrix composite. That is, by a simple processing such that the processed member is removed from the metal matrix composite or the processed portion is formed in the processed member itself, the processed portion having a desired shape can be easily formed in the metal matrix composite.

Metal matrix composite casting and manufacturing method thereof

Compound preforms are provided having a first region, including a porous ceramic and a second region including a porous or solid ceramic in which the two regions differ in composition. The compound preform is infiltrated with a liquid metal which is then solidified to form a metal matrix composite.

Metal matrix composite structure and method

A method of fabricating a metal matrix composite containing electrically isolated areas and the MMC formed from the method. The method comprises: (a) providing a liquid pool of unreinforced aluminum alloy; (b) infiltrating the unreinforced aluminum alloy into a stack comprising upper and lower porous preforms and an electrical insulator material placed between the preforms; (c) solidifying the liquid-phase metal to form a metal matrix composite product that completely surrounds the stack; and (d) forming at least one groove in the solidified metal, the groove extending downward to the insulating substrate so as to electrically isolate at least one region on the surface of the metal matrix composite.

Metal matrix composites containing electrical insulators

Verfahren zur Herstellung von Metalleinlagerungs-Verbundwerkstoffen, die elektrische Isolatoren enthalten

Procede de fabrication d'un composite a matrice metallique (30) contenant des zones isolees electriquement (34, 36, 38) et composite a matrice metallique (30) ainsi produit. Le procede consiste a a) prendre une masse liquide d'alliage d'aluminium non renforce; b) faire penetrer l'alliage d'aluminium non renforce (46) dans un assemblage constitue de preformes poreuses superieure et inferieure et d'un materiau d'isolation electrique (42) place entre les preformes; c) solidifier le metal en phase liquide de facon a former un produit composite a matrice metallique entourant completement l'assemblage et d) former au moins une gorge dans le metal solidifie, cette gorge s'etendant vers le bas vers le substrat isolant, de facon a isoler electriquement au moins une region de la surface du composite a matrice metallique.

Mosur K Premkumar

Papers

Metal matrix composites containing electrical insulators

Verfahren zur Herstellung von Metalleinlagerungs-Verbundwerkstoffen, die elektrische Isolatoren enthalten

Fabrication de composites a matrice metallique contenant des isolants electriques