PROBLEM TO BE SOLVED: To accurately evaporate a necessary amount of organic material by heat to provide an organic thin film with a fine film quality. SOLUTION: In a vapor deposition apparatus, vapor generating devices 20a to 20c are connected to a discharge device 50 to supply vapor while other vapor generating devices 20a to 20c are cut off from the discharge device 50, so that vapors are not mixed together. After film formation, the vapor generating devices 20a to 20c are connected to an exhaust tank while kept cut off from the discharge device 50. The exhaust tank contains cooling means 85a to 85c, on which vapor discharged into the exhaust tank is deposited to form a deposited material 39, which is recovered and reused. COPYRIGHT: (C)2009,JPO&INPIT

Vapor deposition apparatus and film forming method

PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus that can feed a vapor of a film-forming material generated in a vapor generator to a vapor deposition head without lowering the temperature of the vapor.SOLUTION: The vapor deposition apparatus 13 performs film forming processing of an object G to be processed by vapor deposition. The vapor deposition apparatus 13 is configured such that: a processing chamber 30 where the object G is subjected to the film forming processing and a vapor generation chamber 31 where a film-forming material is evaporated, are adjacently arranged; and exhaust mechanisms 36, 41 which reduce the pressure inside the processing chamber 30 and inside the vapor generation chamber 31 and vapor deposition units 55-60 which feed the vapor of the film-forming material into the processing chamber 30, are included therein. The vapor deposition units 55-60 includes: a vapor outlet 80 which blows out the vapor of the film-forming material toward the inside of the processing chamber 30; vapor generators 70-72 for evaporating the film-forming material in the vapor generation chamber 31; control valves 75-77 for controlling the supply of the vapor of the film-forming material; and flow passages 81-83, 85 which supply the vapor of the film-forming material generated in the vapor generators 70-72 to the vapor outlet 80 without emitting the vapor to the outside of the processing chamber 30 and the vapor generation chamber 31.

Vapor deposition apparatus

An evaporator for vaporizing organic material is described. The evaporator includes a first chamber having a nozzle adapted to be directed to a substrate to be coated; at least one second chamber for vaporizing the organic material; at least one vapor channel for guiding vaporized organic material from the at least one second chamber to the first chamber; wherein the first chamber is adapted to provide vaporized organic material to the nozzle corresponding to a first virtual sublimation surface, and the at least one second chamber being adapted to provide during operation a second sublimation surface area, wherein the second sublimation surface area corresponds to at least 70 percent of the first virtual sublimation surface.

Evaporator for organic materials

An evaporator for vaporizing an organic material to be deposited on a flexible substrate where the evaporator includes an evaporation tube having a wall encompassing a cavity for vaporizing the organic material, at least one heating device arranged adjacent to the wall and being adapted to heat the evaporation tube, and at least one nozzle assembly protruding from the evaporation tube. The nozzle assembly further comprises a nozzle cover with an opening, and a shutter for selectively opening and closing the opening of the nozzle cover. The shutter is adapted to have in operation of the evaporation tube a temperature within a shutter temperature range of 140° C. such that the temperature of the nozzle cover is within the shutter temperature range.

Evaporator for organic materials and method for evaporating organic materials

The invention relates to an arrangement for the coating of substrates, which comprises an evaporation source and a vapor barrier between the evaporation source and the substrate. The vapor barrier is maintained at a temperature which is at least equal to or above the vaporization temperature of the material to be vaporized. The vapor barrier is implemented as a quartz valve, which includes a spherical closure part connected with a movable rod. In a first position this spherical closure part closes a vapor conducting tube, which is connected with the evaporation source, and, in a second position, the spherical closure part abuts a spherical calotte which seals off a quartz tube.

Arrangement for coating a substrate

PROBLEM TO BE SOLVED: To provide an easily treatable evaporating source for an organic material capable of executing uniform heating at a certain temp. to various organic evaporating materials, particularly, to liq. organic evaporating materials. SOLUTION: A vessel 3 for evaporation housing an organic compound monomer 2 and a heating medium source 4 controlling the temp. of a heating medium 40 in a heating medium tank 45 to a prescribed one are provided. The vessel 3 for evaporation is composed of a housing part 30 housing the organic compound monomer 2 and a heating medium holding part 31 provided so as to surround the vicinity of the housing part 30, and a heating medium circulating path 32 is formed by the space between the housing part 30 and the heating medium holding part 31. The heating medium 40 is introduced into the heating medium circulating path 32 from the heating medium source 4 and is circulated, and the organic compound monomer 2 in the housing part 30 is heated and cooled. A microheater 62 for heating the organic compound monomer 2 to a temp. higher than that in the vessel 2 for evaporation is wound around the heating medium holding part 31.

Evaporating source for organic material

PROBLEM TO BE SOLVED: To provide an org. thin film forming apparatus which is capable of preventing the reevaporation of the org. materials sticking to the wall surfaces, etc., near a substrate and preventing the reaction with water and oxygen at the time of film formation. SOLUTION: The org. thin film forming apparatus for forming org. thin films on the substrate 8 by evaporating the different org. materials in a vacuum vessel 2 is provided with a shroud 12 for capturing the unnecessary vapor in the vacuum vessel 2 by cooling the vapor near the substrate 8. This shroud 12 is so arranged as to enclose the circumference of the substrate 8. The shroud 12 is connected to a tank of liquid nitrogen disposed on the outside of the vacuum vessel 2 and is so constituted that the liquid nitrogen is circulated. Org. compd. monomers for forming org. electroluminescence elements are housed in respective evaporation sources 3A, 3B for the org. materials.

Organic thin film forming apparatus

PROBLEM TO BE SOLVED: To provide a technique for forming an org thin film on the activated surface of a substrate without receiving any damages SOLUTION: A substrate is arranged in a vacuum vessel 12 before an org thin film is formed on the substrate 11, the vessel is evacuated, the substrate 11 surface is irradiated with a radical by a radical gun 5, then the substrate is sent to an evacuated vacuum vessel 32, and the org thin film is formed on the activated surface Since the surface is treated with the radical gun 5, a transparent conductive film is hardly damaged, and even a substrate of resin is treated because a temp rise is slight The org film is formed without being exposed to the atmosphere after the transparent conductive film surface is activated, hence the adhesion of the transparent conductive film to the org thin film is improved, and an EL element good in characteristic is obtained

Formation of organic thin film using radical and organic thin film forming device

PROBLEM TO BE SOLVED: To provide an evaporation source for a metallic material capable of subjecting the material having high reactivity and a low work function to vapor deposition at an adequate evaporation rate. SOLUTION: The evaporation source 3 for the metallic material has a vessel 32 for evaporation comprised a blind cylindrical main body part 30 which is capable of housing the evaporation material and a disk-shaped cap part 31 which is attachable and detachable to and from the main body part 30. A disk- shaped partition part 30c is formed on the concentric axis with a peripheral wall part 30a within the main body part 30. An annular housing part 30d is formed within the main body part 30 by the peripheral wall part 30a and partition part 30c of the main body part 30. A leading-out part 31a of a circular truncated cone shape is projected and formed in the central part of a rear surface 31e facing the main body part 30 of the cap part 31. A spacing is formed between the partition part 30c of the main body part 30 and the leading-out part 31a of the cap part 31 in the meshed state of the main body part 30 and the cap part 31 so that the vapor 9a of lithium is discharge in bypass from the evaporation port 31b of the leading-out part 31a.

Evaporation source for metallic material and vacuum treating device using the same

PURPOSE: To provide a mold for molding synthetic resin which has the excellent transferability of the surface shape of the mold wall surface without external appearance failure, a method for manufacturing the same and a method for molding the resin used for the mold CONSTITUTION: Synthetic resin is molded by using a mold in which a polymer heat insulation layer 8 is formed by vapor deposition polymerizing the monomer of heat resistant polymer on a mold wall surface for constituting at least a mold cavity 6 For example, the layer of polyimide resin is formed in a mold 33 by vapor deposition polymerizing pyromellitic anhydride as raw material monomer 31 and 4,4'-diaminodiphenyl ether as raw material monomer 32 by using a vapor deposition polymerizing unit

Nagashima Naoki

Papers

Evaporating source for organic material

Organic thin film forming apparatus

Formation of organic thin film using radical and organic thin film forming device

Evaporation source for metallic material and vacuum treating device using the same

Mold for molding synthetic resin, manufacture thereof and molding method for the resin used for the mold