A method of resin molding for molding regular products and a resin molding machine for the same In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies A member to be molded by the molding dies is clamped together with the release film An inner face of a pot of the molding die is covered with the release film A resin tablet is supplied into the pot

Resin molding machine

The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the molding dies; and filling the melted resin in the molding section of the molding die, wherein the release film is tightly pressed on a surface of a part of the work piece, which is exposed after molding, in the clamping step. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.

Method of resin molding

An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.

Method of operating a molding machine with release film

A method and apparatus for resin molding upon an insert-member. The molding machine includes an upper die and a lower die, a cavity in at least one of the dies, a pot in which resin is introduced, and a resin path which allows the resin to flow from the pot into the cavity and onto the insert-member set in the dies. A film member is set between a parting face of the die and the insert-member. The film member covers a part of the insert-member corresponding to the resin path. An edge of the film member coincides with at least one of side edges of the cavity. The insert-member is clamped by the dies together with the film member when molding occurs.

Method of resin molding and resin molding machine for the same

A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.

Method of manufacturing a semiconductor component

PURPOSE: To obtain high mold release ability without using an external mold releasing agent, by forming nickel-phosphorus films on the surface of metal molds. CONSTITUTION: Nickel-phosphorus films 3 and 4 are formed on the surface of seal metal molds 1 and 2 for resin-sealed type semiconductor device which are used in sealing a semiconductor element 6 mounted on a lead frame 5 with resin by transfer shaping. For example, the nickel-phosphorus films 3 and 4 are formed by electroless deposition with plating liquid having pH 3 to 6, the principal components of which are sodium hypophosphite and nickel sulfate, and containing 7 to 15% of phosphorus. Desirable conditions of heat treatment after plating are at 280°C and for 30 minutes to form films of about 800Hv of Vickers hardness or higher. The films about 40μm thick are formed first and are then polished to be 3 to 5μm thick finally. COPYRIGHT: (C)1989,JPO&Japio

Seal metal mold for resin-sealed semiconductor device

PURPOSE:To enhance the mold release characteristics by a method wherein silver plated films having non-adherence to a resin are formed on the surface of sealing dies. CONSTITUTION:Silver plated films 6, 5 respectively formed on the surface of top and bottom dies 4, 3 by electroplating process ares provided with mirror surface roughness not to exceed 0.1mum. The resin implanted into the sealing dies 3, 4 and specified to be an epoxy resin comprising acid anhydride base setting agent adheres firmly to a semiconductor element 1 and a lead frame 2 but not to the dies 4, 3 on the surface of which the silver plated films 5, 6 having non-adherence to thin resin are formed so that the resin may be released without injuring the visual appearance even if no outer mold release agent is applied at all. Through these procedures, the mold release characteristics can be enhanced.

Namiki Moriga

Papers

Seal metal mold for resin-sealed semiconductor device

Sealing dies for resin sealed semiconductor device