In this paper, a numerical model using ANSYS Fluent for a minichannel cold plate is developed for water-cooled LiFePO4 battery. The temperature and velocity distributions are investigated using exp...

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Numerical modeling and experimental investigation of a prismatic battery subjected to water cooling

Novel CFD approach for the thermal analysis of a continuous variable transmission (CVT)

/pdf/fundamental-aspects-of-a-novel-technology-for-abatement-of-4ynq60rvjv.pdf

Fundamental Aspects Of A Novel Technology For Abatement Of Indoor Allergens

As the technology is advancing day by day, experiments and researches are being carried out to make the cooling of electronic systems such as PCB and projector’s internal electronic components more efficient. The motive of this paper is to endow the better cooling environment to the electronic devices. The location of a fan or the blower installed in them is varied to enhance the heat transfer through forced convection phenomenon. If the cooling system of an electronic device is designed effectively the high heat generated at the maximum load can be easily cast off, and hence better reliability can be achieved. Turbulence model is applied to visualize the flow behavior. This analysis is done on the software ANSYS 15.0 (modeling in ICEM CFD, and flow analysis on FLUENT). This analysis will help to predict the better conditions for the manufacturing of cooling models for electronic systems.

Analysis Of Heat Transfer Enhancement Of Electronic Chip Using CFD

CFD has penetrated into the field of electronic cooling for some time.Both paralled and staggered plate fin heatsinks are widely used in modern computers.This paper presents the ways to make most use of CFD in optimization design of those heatsinks:the flow and heat transfer of staggered and parallel plate fin heatsinks of various geometry were simulated by using Fluent 5.0 commercial CFD code.Based on 60 different simulation solutions,two correlations,concerning Nusselt number and friction factor as the functions of geometrical and operational parameters of the heatsinks were developed.The presentation parameter examination was also performed by comparing the numerical solutions with the analytical solutions of parallel plate arrays,showing that the correct parameters are used in the correlations.

2—Dimensional CFD Simulation and Correlation Development for Optimization of Fin Heatsinks in electronic Cooling

As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.

https://file.scirp.org/pdf/JECTC_2013121709495248.pdf

STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

Niveditha Krishnamoorthy

Papers

STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials