A thin film magnetic head includes an upper shield section, a lower shield section and a magnetoresistance device section between the upper shield section and the lower shield section. The magnetoresistance device section is connected to the upper shield section and the lower shield section through conductive layers. Current flows through the magnetoresistance device section via the upper shield and the lower shield.

Thin film magnetic head

An integrated circuit comprises a microelectromechanical (MEMS) resonator circuit that generates a reference frequency. A temperature sensor senses a temperature of the integrated circuit. Memory stores calibration parameters and selects at least one of the calibration parameters as a function of the sensed temperature. A phase locked loop module receives the reference signal, comprises a feedback loop having a feedback loop parameter and selectively adjusts the feedback loop parameter based on the at least one of the calibration parameters.

Crystal oscillator emulator

A magnetic head supporting device which includes a supporter having a resilient spring portion and a rigid beam portion contiguous to the resilient spring portion a flexible member whose one end is attached to the supporter at a portion near its free end; a loading projection provided in the upper surface of the flexible member or in the lower surface of the supporter at a portion near its free end to thereby transmit a loading force from the free end of the supporter to the flexible member; and a magnetic head having a slider attached with reading/writing elements, the magnetic head being fixed to the lower surface of the flexible member, wherein the flexible member is composed of a plate of a polymeric resinous material having conductors for wiring; the conductors are electrically connected to electrodes for the reading/writing elements of the magnetic head, and the plate of a polymeric resinous material is extended on the supporter in its longitudinal direction

Flexible polymeric resinous magnetic head supporting device

An integrated structure is provided for magnetic recording which utilizes a silicon wafer having two parallel faces which are crystal planes of orientation 100. One face is designed so as to constitute a displacement plane when used as a read and write device in a magnetic support. The magnetic head has a horizontal structure and is integrated into the silicon wafer in the face having the displacement plane. An electronic circuit is integrated in the silicon wafer in one of the two faces and connections are provided between the magnetic head and the electronic circuit.

Head slider with an integrated flat magnetic head

An improved connector apparatus for electrically coupling a magnetic transducer to the read/write electronics of a magnetic recording system is described. The connector apparatus includes a first connector having an elongated substrate with a plurality of first bonding pads on one end connected to a corresponding plurality of second bonding pads on the other end. The invention further includes a second connector having a plurality of third bonding pads on one end connected to a plurality of fourth bonding pads on the other end. Bonding pads are included for aligning the first bonding pads with the terminals of the conductive cable that is connected to the electronics of the magnetic system and the second bonding pads with the third bonding pads to facilitate electrical interconnection between the first and second connectors.

Connector apparatus for electrically coupling a transducer to the electronics of a magnetic recording system

A magnetic transducer head assembly having a support member in which a magnetic transducer head mounting portion, an integrated circuit element mounting portion and a plurality of lead terminals are supported to be a unitary body by a resin mold, a multichannel magnetic transducer head element mounted on the magnetic transducer head mounting portion, an integrated circuit element mounted on the integrated circuit element mounting portion which integrated circuit element includes a reproducing or recording circuit for the magnetic transducer head element, and wiring for carrying out a predetermined electric connection between the integrated circuit element and the lead terminals.

Magnetic transducer head assembly with support system therefor

A multi channel magnetic transducer head comprises a magnetic substrate, and a plurality of thin film type magnetic transducer head elements arranged on the magnetic substrate, each magnetic transducer head element including a coil conductor disposed on the magnetic substrate and a thin film magnetic core to constitute a magnetic circuit in co-operation with the substrate, wherein a non-magnetic gap spacer layer with a predetermined thickness is formed at track width portion below front end of the thin film magnetic core on the magnetic core, a non-magnetic layer with thickness larger than that of the gap spacer layer is formed at track spacing portion, the thin film magnetic core has width covering at least the gap spacer layer of the track width portion, thereby good magnetic recording can be performed.

Multi channel magnetic transducer head

PURPOSE: To decrease the number of lead wires led out of a multi-channel magnetic head device by wiring each terminal of the magnetic head element to each prescribed terminal of an IC element provided in a body with said magnetic head element. CONSTITUTION: The terminal of a multi-channel magnetic head element 1 is wired 23 to a prescribed terminal of an IC circuit element 22 with solder junction of an Au thermosonic wire bond or a beam lead provided to the element 22. At the same time, a prescribed terminal of the element 22 is wired 24 to a prescribed lead wire 17 with solder junction of the Au thermosonic wire bond or the beam lead of the element 22. Then the sealing epoxy resin 25 is charged to the element 22 set at a prescribed position of the element 1 and at the prescribed position of the wire 17. At the same time, a mold cover 26 is adhered with epoxy resin 25. COPYRIGHT: (C)1984,JPO&Japio

Magnetic head device

PURPOSE:To obtain with high yield a magnetic head which excels in the sealing effect by putting an integrated circuit and a multi-element magnetic head on a resin mold material which is previously formed with use of leads to bond them together and casting the resin into a space formed by butting the mold material to a casting mold and then hardening the resin CONSTITUTION:Wall parts 35a-35c and a bank part 33 are provided to form an integrated circuit storing recess part 32 and a multi-element magnetic head setting part 34, and a resin casting cut part 36 is formed to the side wall 35b at one side of the part 32 to obtain a mold material 31 This material 31 is molded by burying a lead frame 21 which is previously produced with addition of a lead part 23 and an integrated circuit attaching part 22 Then a magnetic head 1, an integrated circuit 41 and a circuit parts 80 are set and bonded to the part 23 A casting mold 61 is butted to the material 31, and the resin is cast through the cut part 36 and hardened Then each multi-element magnetic head device is removed, and a contact surface between the head 1 and a magnetic recording medium is formed Thus it is possible to produce with high yield a multi-element magnetic head which excels in the sealing effect such as humidity resistance, etc with no disconnection of the part 23

Production of multi-element magnetic head device

PURPOSE:To attain superior magnetic recording by forming non-magnetic layers with prescribed thickness respectively on a track width part and a track interval part on the opposed surface side to a magnetic recording medium on a magnetic substrate. CONSTITUTION:An insulating film 2 is adhered to the magnetic substrate 1, coil conductors 3 are arranged on prescribed positions and an insulating film 5 is adhered to the whole surface. The insulating films 2, 4 on portions to form gap spacers 7 are removed by photoetching or the like and removed parts 8 are formed in respective tracks. The width W and depth (d) of the removed parts 8 are set up as the track width of the magnetic gaps (g) and the gap depth respectively. In addition, the interval D between the removed parts 8 is set up as the track interval. The gap spacers 7 having the depth corresponding to the gap length of the gaps (g) are formed in the removed parts 8 and a magnetic thin film is patterned on the whole surface to form a thin film magnetic core 4. The total thickness of the insulating films 2, 5 is thicker than the thickess of the layer 7 and thinner than that of a magnetic film 4, so that superior magnetic recording is attained.

Noboru Wakabayashi

Papers

Magnetic transducer head assembly with support system therefor

Multi channel magnetic transducer head

Magnetic head device

Production of multi-element magnetic head device

Multielement thin film magnetic head