A multi-layer core organic package substrate (400) includes: a multi-layer core (409) comprising at least two organic core layers (41 1, 413), wherein two of the at least two organic core layers (41 1, 413) are separated by a core metal layer (401 ); a first plurality of build-up layers (207) formed on top of the multi-core layer (409); and a second plurality of build-up layers (207') formed below the multi-core layer (409).

Multi-layer core organic package substrate

Multi-layer core organic package substrate and its fabrication

The invention provides a transmission circuit structure body, in which a resin such as a fluororesin or a liquid crystal polymer having a low dielectric constant and a low dielectric loss tangent is unnecessary. Even if in a region having a frequency over 5 GHz, a signal can be transmitted in which no high frequency components are lost. The transmission circuit structure body is composed of the following: a signal wire, formed by contacting with a main surface of an interlayer insulating layer, and a ground layer, including a conductive fine particle dispersion film, formed by contacting with another main surface of the interlayer insulating layer. The conductive fine particle dispersion film is formed by dispersing conductive fine particles in an organic material.

Transmission circuit structure body

Provided is a power supply structure, wherein electromagnetic radiation and fluctuation of a power supply voltage due to resonance of electromagnetic energy between power supply layers can be eliminated without requiring a decoupling capacitor. A circuit board is also provided. A power supply structure (1) is provided with two power supply layers (11, 13), and an interlayer insulating film (15) sandwiched between the power supply layers (11, 13). The power supply structure is characterized in that at least one of the power supply layers (11, 13) is composed of a conductive fine particle-dispersed film (a) having conductive fine particles dispersed in an organic material. A circuit board of the present invention is provided with the power supply structure (1) having such configuration.

Circuit board, power supply structure, method for manufacturing circuit board, and method for manufacturing power supply structure

Power integrity (PI) for recent electronics circuits and systems is the most important technological issue in the field and has been addressed in important papers through several approaches[1][2] A novel technology is used in our study only using a conductive layer of dispersed metal particles instead of copper plane We investigate physical phenomena and some fundamental data for PI The transmission lines which uses metal particle conductive layer(MPCL), it causes the change in a variety of electromagnetic wave transmission speeds such as increases 76% and decrease by 21% As a result, Z11 value of power/GND plane test coupon at 5GHz is from 201 (ICEP2011 [3]) to 179 ohm Also we made a trial PCB in which we only replaced from the power copper metal plane in the circuit board with MPCL The voltage fluctuation was decreased about 60% using a MPCL structure Our developed MPCL structure has excellent characteristics not only for PI but also SI in the desirable high-frequency region This phenomenon must be clarified as the physical basis for more progressive PI and SI issues We suppose that these characteristic is due to interactions between electromagnetic wave and metal surface electrons So we think that the morphology of MPCL must be an important point of improving PI and SI in the desirable high frequency region

Novel technology for power integrity using a metal particle conductive layer

Power integrity (PI) has been an important technological issue in the field of electronic circuits and systems. It has been addressed in important papers using several different approaches [1][2]. The latest concept of the best PI condition is a low impedance between the power and ground lines or planes, that can be maintained regardless of the clock frequency, even in the GHz region. A novel technology was used in our previous study, in which a metal particle conductive layer (MPCL) was used instead of a copper plane [3][4]. This structure improved the PI for any clock frequency, particularly in the GHz region. The MPCLs consist of micrometer sized silver flakes (SF) and binder resin. In this study, we used an epoxy as a binder for conductive paste, polyimide (PI) copper clad laminate (CCL) and 60 µm thickness prepreg as the inner dielectric of test coupons. These are general-use material so that they can be made easily, and apply to printed circuit boards (PCBs) and package substrates (PKGs). It has been found from transmission line test coupon measurements, that energy propagation time and frequency characteristics, are strongly affected by the metal particle content and chemical composition. From power/GND plane test coupon measurements, MPCL can reduce Z11 about 70% compared with copper plane from 1 to 5GHz frequency region. In this paper, we will show the detailed phenomena of MPCL, exceeding the region of usual transmission line theory, and MPCL adaptability to commercial materials of PCB and PKG.

Analysis of novel technology for power and signal integrity using a metal particle conductive layer

Power integrity (PI) has been an important technological issue in the field of electronic circuits and systems. It has been addressed in important papers using several different approaches [1][2]. The latest concept of the best PI condition is a low impedance between the power and ground lines or planes, that can be maintained regardless of the clock frequency, even in the GHz region. A novel technology was used in our previous study, in which a metal particle conductive layer (MPCL) was used instead of a copper plane [3][4]. This structure improved the PI for any clock frequency, particularly in the GHz region. The MPCLs consist of micrometer sized silver flakes (SF) and binder resin. In this study, we used an epoxy as a binder for conductive paste and polyimide (PI) copper clad laminate (CCL) as the inner dielectric of test coupons. These are general-use material so that they can be made easily, and apply to printed circuit boards (PCBs) and package substrates (PKGs). It has been found from transmission line test coupon measurements, that energy propagation time and frequency characteristics, are strongly affected by the metal particle content and chemical composition. From power/GND plane test coupon measurements, MPCL can reduce Z11 about 70% compared with copper plane from 1 to 5GHz frequency region. In this paper, we reveal the detail phenomena of MPCL exceed the region of usual transmission line theory and some critical factors to improve PI using MPCL.

Recently, power integrity (PI) has been the most important technological issue in the field of electronic circuits and systems and has been addressed in important papers using several different approaches [1][2]. The latest concept of the best PI condition is a low impedance between the power and ground lines or planes that can be maintained regardless of the clock frequency, even in the GHz region. This concept was mentioned in a relatively old book [3] from the 1980s, so it is not the newest idea. However, this condition cannot be completely realized using several of the previously proposed approaches, including many involving the use of low-inductance capacitances. We are aware that the electromagnetic interference (EMI) problems of plane power/ground resonance are induced because of the resonance caused by eddy currents or multiple reflections of voltage fluctuations. A novel technology was used in our previous study in which a conductive layer of dispersed metal particles was used instead of a copper plane [4][5]. This structure improved the PI for any clock frequency, particularly in the GHz region, with an impedance of less than 1 Ω. In this study, we examine the electromagnetic wave transmission data in order to investigate the different physical phenomena, and we present some fundamental data on PI and signal integrity (SI). The results indicate that the use of a transmission line with a metal particle conductive layer can yield various changes in the electromagnetic wave transmission speed, such as an increase of 76% or a decrease of 21%. The Z11 values of the power/GND plane test coupon were from 1.8 to 3.0 Ω in the frequency region from 5 to 20 GHz. These results suggest that the metal particle conductive layer has useful characteristics for improving the PI and SI.

Norifumi Sasaoka

Papers

Circuit board, power supply structure, method for manufacturing circuit board, and method for manufacturing power supply structure

Novel technology for power integrity using a metal particle conductive layer

Analysis of novel technology for power and signal integrity using a metal particle conductive layer

Analysis of novel technology for power and signal integrity using a metal particle conductive layer

Novel technology for power and signal integrity using a metal particle conductive layer