A PVC adhesive for joining PVC pipes comprises: (a) about 10 to 22 wt % PVC resin and about 2 to 25 wt % acrylic resin, the total of the PVC resin and acrylic resin ranging from about 18 to 35 wt % of said adhesive; (b) a high vapor pressure solvent comprising about 10 to 50 wt % tetrahydrofuran and 0 to about 40 wt % methyl ethyl ketone, with the total high vapor pressure solvent concentration not exceeding a maximum concentration of about 55 wt % of the total adhesive composition; and a low vapor pressure solvent comprising about 10 to 35 wt % cyclohexanone and 0 to about 35 wt % N-methyl pyrrolidone, with the total low vapor pressure solvent concentration at least about 19 wt % of the total adhesive composition. The VOC (volatile organic compound) level of the PVC adhesive composition of the invention is at or below the allowed maximum value of 450 g/l, yet the adhesive meets or exceeds required performance standards, such as lap shear strength.

Low VOC (volatile organic compounds), solvent-based CPVC pipe adhesives which maintain joint adhesive performance

A method of adhesively bonding or welding a first plastic surface to a second plastic surface is described which comprises the steps of: (I) applying to the first surface or second surface or both surfaces, a composition which is free of hollow microspheres and comprises a mixture of (A) from about 5% to about 60% by weight of at least one water-insoluble polymer selected from ABS, PVC, CPVC or mixtures thereof; (B) from about 1% to about 60% by weight of at least one water-insoluble polymer selected from acrylic polymers, vinyl aromatic polymers and vinylpyrrolidone polymers; and (C) from about 10% up to about 90% by weight of at least one volatile organic liquid which is a solvent for polymers (A) and (B); (II) contacting the first surface with the second surface; and (III) allowing the adhesive composition to form a bond or weld between the first surface and the second surface. The invention also relates to compositions which comprise a mixture of components (A) through (C) as defined above.

Method of bonding and bonding compositions

The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. Desirably the adhesive has a flash point of at least 100° F. when measured in accordance with ASTM D3828-87. The solvent blend of the low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent blends in solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, and cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices. In addition, the novel low VOC solvent based adhesive has good storage stability in metal or non-metal containers.

Low volatile organic solvent based adhesive

New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and optionally other addition-polymerizable monomers such as (meth)acrylate monomers, vinylbenzyl chloride, and diesters of maleic acid or fumaric acid. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer which may or may not be crosslinked upon heating.

Spin-on protective coatings for wet-etch processing of microelectronic substrates

Nitrile - containing thermoplastic compositions, when lightly crosslinked by compounding with from 0.1 to about 1.0% by weight of an epoxy compound and with 0.1 to about 1.0% of a suitable curing agent, and cured by compounding at temperatures in excess of 350* F, are capable of being thermally processed by injection molding and extrusion processes and exhibit improved hot-strength characteristics compared with the uncrosslinked thermoplastic. The crosslinked compositions retain sufficient thermoplastic character to permit foaming, and when additionally compounded with a blowing agent, may be extruded or injection-molded to give structures exhibiting a smooth skin and a uniform cellular structure, which have hot strength properties adequate for postforming operations.

Epoxy-crosslinked, foamed nitrile containing polymers and method of preparing same

A coating composition comprises an acrylonitrile-butadiene -styrene resin, a solvent and a non-solvent diluent which is compatible with the solvent. The resins may be terpolymers or mixtures of copolymers with a homopolymer of the third component, or mixtures of the homopolymers or mixtures of the terpolymer with one of the copolymers or homopolymers and copolymers of four or more monomers such as an ABS-alpha-methyl styrene (or -methyl-methacrylate) graft polymers. They may also contain further polymers, e.g. ABS blended with an alpha-methyl styrene and the ABS components may be replaced wholly or partially by their homologues. The preferred compositions contain 10-30% A, 20-60% B and 30-70% S. The solvent may be methyl ethyl ketone, methyl isobutyl ketone or ethylene dichloride, a mixture of methyl ethylene ketone and ethylene dichloride being particularly preferred. Diluents specified are butanol, toluene or lacquer thinner.ALSO:Coating compositions comprising an acrylonitrile-butadiene-styrene resin, a solvent and a non-solvent diluent which is compatible with the solvent are used as anti-corrosive coatings on metallic materials and for the water-proofing and moisture-proofing of materials. The applied compositions may be baked. The compositions are preferably applied on top of an undercoat preferably containing a mixture of a thermosetting resin such as an epoxy resin, a polyester or a polyurethane curable at normal temperature and an acrylonitrile-butadiene-styrene resin, and acrylonitrile type resin, a butadiene type resin, a styrene type resin, an acrylate type resin or a methacrylate type resin or a mixture of two or more thereof. Especially preferred are undercoat paints containing a mixture of a thermosetting resin curable at normal temperature and an ABS resin, or even more preferably a thermosetting resin on an amount of a coating composition of the invention. In examples a steel plate is coated with an ABS resin dissolved in a mixture of methyl ethyl ketone and ethylene dichloride (50:50) and as a non-solvent 2(B) toluene, 4(A) lacquer thinner, 4(E) toluene and 4(-) butanol. In Example 5 a steel plate is undercoated with an ABS resin dissolved in methyl isobutyl-ketone/diacetone alcohol containing toluene and also clay, styrene monomer, red lead and dimethyl phthalate followed by a top coat containing the same ABS resin in the ketone/alcohol/toluene mixture together with dimethyl phthalate.

Oda Akira Ube

Papers

Coating compositions and process of preparing the same