A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Probe card assembly and kit, and methods of making same

Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784) In this manner, the electronic components (784) are not 'at risk' during the fabrication process The sacrificial substrate (702) establishes a predetermined spatial relationship between the interconnection elements (752) which may be composite interconnection elements (752) having a relatively soft elongate element (752) as a core and a relatively hard (springy material) overcoat (754) Interconnection elements (752) may be fabricated upon tip structures (770), or may first be mounted to the electronic component (784) and the tip structures (770) joined to the free-ends of the interconnection elements (752) Tip structures (770) formed as cantilever beams are described

Fabricating interconnects and tips using sacrificial substrates

The present invention provides a satellite broadcast receiving and distribution system that will permit for the transmission of vertical and horizontal or left-hand circular and right-hand circular polarization signals simultaneously via a single coaxial cable. The system of the present invention will accommodate two different polarity commands from two or more different sources at the same time. This satellite broadcast receiving and distribution system of the present invention will provide for the signals received from the satellite to be converted to standard frequencies so as to permit for signals to travel via existing wiring which the present day amplifiers can transport in buildings, high-rises, hospitals, and the like so that satellite broadcasting can be viewed by numerous individuals by way of a single satellite antenna.

Satellite broadcast receiving and distribution system

Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

Microelectronic contact structure, and method of making same.

An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

Microelectronic contact structure

937,851. Cables. GENERAL CABLE CORPORATION. Jan. 25, 1960 [March 5, 1959], No. 2720/60. Class 36. A combined power and communication cable comprises at least three conductor units laid up helically together within a common sheath, two of these units being of insulated power conductors 11 and the third 14 (and Fig. 5) containing a plurality of individually insulated communication conductors 31 cabled together helically and having a continuous surrounding shield 35 formed by a helically lapped metal tape with overlapping convolutions. Bare earthing wires 33 are laid up in the interstices of at least some of the communication conductors such earthing wires being in contact with successive convolutions of the shield. A further earthing conductor 19 may be laid up between the power cores of the completed cable. The shield may be of copper tape and a further covering of steel tape may be provided and held in place by a P.V.C. sheath 36. The power conductors 11 may be insulated with P.V.C. 12, served with wrappings of crumpled paper 13, laid up with the communication unit with crumpled paper fillers 17 and provided with a braided sheath 18 suitably proofed and coloured. Alternatively the assembly may be sheathed with a helically-applied steel strip with interengaging edges (Fig. 2, not shown).

Combination power and communication cable

Dual insulated telephone wire

Dual laminated telephone cable sheath

A high-tension cable is made with a strand shield of crosslinked, conductive polyethylene compound and with insulation that is a proprietary compound of ethylene-propylene rubber. The insulation is approximately 48 percent ethylene-propylene amorphous copolymer; approximately 12 percent crystalline polyethylene homopolymer; and reinforcing fillers to provide adequate physical properties. The shield and insulation are extruded and cured simultaneously to obtain void-free bonding.

Ethylene-propylene rubber insulated cable with cross-linked polyethylene strand shielding

1,133,603. Cables. GENERAL CABLE CORP. 15 NQV., 1965 [22 Jan., 1965], No. 48391/65. Heading H1A. In a shielded electric cable plastics sheathing 13 adheres strongly to the periphery of tubular metal shield 12 within the strip between A and B which includes the overlap of the shield and has a controlled lesser adhesion to the rest of the periphery, indicated by 15, to facilitate stripping the plastic from the shield in regions removed from the overlap. To achieve this the strip of metal, prior to being folded round the insulated conductors 11, is coated with a strongly adhesive copolymer of ethylene with a monomer containing carboxyl groups and a region of lesser adhesion is produced by heating with preferably an oxidizing flame. Alternatively, only the outer edges of the strip are coated with the strong adhesive and the centre is coated with a polyethylene of lesser adhesion. In another method the strip coated with strong adhesive is wrapped round the conductors and before the polyethylene sheath 13 is extruded, a release agent such as talc or a silicone is applied to the region requiring lesser adhesion. Reference has been directed by the Comptroller to Specification 977,038.

Oscar G Garner

Papers

Combination power and communication cable

Dual insulated telephone wire

Dual laminated telephone cable sheath

Ethylene-propylene rubber insulated cable with cross-linked polyethylene strand shielding

Shielded electrical cable