Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Diodes Offering Asymmetric Stability During Fluidic Assembly

The commercial integration of optoelectronic devices heavily relies on hybrid techniques such as wire bonding and flip-chip bonding. These methods are limited in the scale and flexibility in integration. Research focused on optoelectronic integration is performed using numerous techniques such as direct epitaxy, full-scale wafer bonding, and selfassembly. Magnetically Assisted Statistical Assembly (MASA) is an example of the latter technique and improves scale and flexibility by enabling the simultaneous integration of large numbers of individual devices. This thesis work is focused on the demonstration of the MASA concept through characterization of the magnetic materials forming the foundation for this technique and development of an adequate process technology. Both, the magnetic characteristics and the process technology required to integrate the technology are presented along with results of the integration. Thesis Supervisor: Clifton G. Fonstad Jr. Title: Professor of Electrical Engineering

Optoelectronic integration using the magnetically assisted statistical assembly technique : initial magnetic characterization and process development

Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structures on a substrate.

Systems and methods for creating fluidic assembly structures on a substrate

Embodiments are related generally to display fabrication, and more particularly to a fluidic assembly process for the placement of light emitting diodes on a transparent display substrate

Patterned phosphors in through hole via (THV) glass

Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

Substrate with topological features for steering fluidic assembly LED disks

This paper introduces an electro-fluidic assembly approach that provides a potential route towards a low-cost, parallel heterogeneous integration process suitable for III-V device integration. In this process, nonuniform electric fields are used to attract III-V devices from a carrier fluid to a Si substrate patterned with predefined alignment locations. We have demonstrated the utility of this approach by assembling Au die using circular apertures defined on an oxidized Si substrate.

P.A. Smith

Papers

An electro-fluidic assembly technique for integration of III-V devices onto silicon