Apparatus for mapping an object includes an illumination assembly, which includes a single transparency containing a fixed pattern of spots. A light source transilluminates the single transparency with optical radiation so as to project the pattern onto the object. An image capture assembly captures an image of the pattern that is projected onto the object using the single transparency. A processor processes the image captured by the image capture assembly so as to reconstruct a three-dimensional (3D) map of the object.

Depth mapping using projected patterns

A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

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Step and flash imprint lithography

The present invention is directed to methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. In one embodiment, the imprint process is designed to imprint only a portion of the substrate. The remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.

Step and repeat imprint lithography processes

Described are imprint lithography templates, methods of forming and using the templates, and a template holder device. An imprint lithography template may include a body with a plurality of recesses on a surface of the body. The body may be of a material that is substantially transparent to activating light. At least a portion of the plurality of recesses may define features having a feature size less than about 250 nm. A template may be formed by obtaining a material that is substantially transparent to activating light and forming a plurality or recesses on a surface of the template. In some embodiments, a template may further include at least one alignment mark. In some embodiments, a template may further include a gap sensing area. An imprint lithography template may be used to form an imprinted layer in a light curable liquid disposed on a substrate. During use, the template may be disposed within a template holder. The template holder may include a body with an opening configured to receive the template, a support plate, and at least one piezo actuator coupled to the body. The piezo actuator may be configured to alter a physical dimension of the template during use.

Template for room temperature, low pressure micro- and nano-imprint lithography

The present invention is directed to a template having a body including a surface with first and second regions. The first region has first wetting characteristics for a given material and the second region has second wetting characteristics for the given material. The first wetting characteristics differ from the second wetting characteristics. Specifically, the first region is formed from a surface treatment layer with a first surface energy to provide the first wetting characteristics. The second region is exposed portions of the body, typically quartz of fused silica, having a second surface energy associated therewith. The second surface energy is greater than the first surface energy to provide the second region with the second wetting characteristics.

Formation of discontinuous films during an imprint lithography process

A system for semiconductor wafer processing including wafer measurement and characterization having vertical wafer processing apparatus with which only the edge of a wafer is contacted. A wafer processing station is provided having a support bridge to which a rotor subassembly is attached. The rotor subassembly includes a housing and a rotor having a central aperture and a retention mechanism for retaining a wafer in a measurement position. A pair of pivotable probe arms includes one probe arm positioned on either side of the wafer. A sensor provides an image of a wafer prior to its retention by the retention mechanism in the measurement position in order to permit the retention mechanism to avoid any flat on the wafer. Additional sensors eliminate the effect of wobble or vibration of the rotor on wafer measurement results. Artifact removal processors are provided for removing errors in the measured wafer data and a database stores the uncorrupted and corrected data. The system couples with a data network to allow global viewing of wafer processing trouble spots. A correlation of information from actual data and wafer processing simulation is provided for allowing the application of corrective measures before processes deviate beyond control or specification limits.

Wafer handling and processing system

Disclosed are methods and systems for: (i) sequentially illuminating a specimen with different spatial distributions of light, wherein each illumination causes an object embedded in the specimen to emit radiation in response to the light; (ii) for each different spatial distribution of illumination light, imaging the radiation emitted from the specimen from each of multiple sides of the specimen; and (iii) determining information about the object in the specimen based on the imaged radiation from each of the multiple sides for each of the different spatial distributions of illumination light.

Systems and methods for in-vivo optical imaging and measurement

A measurement station which rotates a wafer in a vertical plane and moves a scanning sensor linearly along an axis which is parallel to the wafer rotation plane, thus providing a spiral, or other, scan path across the wafer. The vertical orientation reduces errors from weight induced sagging, especially of large, e.g. 300 mm wafers. The measurement station includes wafer grippers which move in the wafer's plane for securing the wafer in position for rotation. The measurement station also includes master calibration gauges which simplify calibration and obviate the need for calibration test wafers. A technique for reducing vibration and assuring scan repeatability includes coasting of the wafer in rotation and coordinated linear probe motions for scanning. Probe measurement data obtained is digitized early and calibration, demodulation, filtering and other processing is done digitally.

Wafer testing and self-calibration system

A proximity mask alignment system (1) includes a remotely-focusing microscope (14) and a video frame storage device (34c). When a first surface, such as an integrated circuit substrate (12), is in focus an image of the first surface is obtained and stored. Then, after the microscope is re-focused to a second surface, such as a photomask (10), the stored image of the first surface is superimposed onto the "live" image of the second surface. The two focal positions are stored, with a selected one being normally provided to the microscope. A user initiates an automatic sequence wherein the microscope focuses to the other focal position, stores an image obtained at the other focal position, then refocuses to the original focal position. The stored image is superimposed on the image currently being generated, enabling the user to simultaneous view each surface in sharp focus, facilitating the alignment of the two surfaces to one another.

Proximity mask alignment using a stored video image

Apparatus is disclosed for the generation and display of interference patterns for the purpose of quantifying the distortion of either a surface or a transmitted wavefront. The invention comprises, in one embodiment, means to align the elements comprising the interferometer cavity, means to continuously magnify, i.e., zoom, the aperture diameter of the interference pattern, means to focus either the measured or limiting aperture onto the face of the vidicon, and means for transducing both the alignment spots and the interference pattern with a standard CCTV camera.

Peter Domenicali

Papers

Wafer handling and processing system

Systems and methods for in-vivo optical imaging and measurement

Wafer testing and self-calibration system

Proximity mask alignment using a stored video image

Optical interferometer system with CCTV camera for measuring a wide range of aperture sizes