Example embodiments of the present invention are directed to a compensated microelectromechanical oscillator, having a microelectromechanical resonator that generates an output signal and frequency adjustment circuitry, coupled to the microelectromechanical resonator to receive the output signal of the microelectromechanical resonator and, in response to a set of values, to generate an output signal having second frequency. The values may be determined using the frequency of the output signal of the microelectromechanical resonator, which depends on the operating temperature of the microelectromechanical resonator and/or manufacturing variations of the microelectromechanical resonator. The frequency adjustment circuitry may include frequency multiplier circuitry, for example, PLLs, DLLs, digital/frequency synthesizers and/or FLLs, as well as any combinations and permutations thereof. The frequency adjustment circuitry, in addition or in lieu thereof, may include frequency divider circuitry, for example, DLLs, digital/frequency synthesizers (for example, DDS) and/or FLLs, as well as any combinations and permutations thereof.

Frequency and/or phase compensated microelectromechanical oscillator

The present invention aims to present an angular velocity sensor having a self diagnosis function. An angular velocity sensor of the present invention includes a driving part for stably vibrating a driving part of a sensor element having a driver part and a detector part for detecting an angular velocity and detection means for detecting the angular velocity of the sensor element and obtains a self diagnosis signal for a malfunction by detecting a mechanical coupling signal obtained at the detection means.

Angular velocity sensor

A driving mass of an integrated microelectromechanical structure is moved with a rotary motion about an axis of rotation, and a first sensing mass is connected to the driving mass via elastic supporting elements so as to perform a first detection movement in a presence of a first external stress. The driving mass is anchored to an anchorage arranged along the axis of rotation by elastic anchorage elements. An opening is provided within the driving mass and the first sensing mass is arranged within the opening. The elastic supporting and anchorage elements render the first sensing mass fixed to the driving mass in the rotary motion, and substantially decoupled from the driving mass in the first detection movement. A second sensing mass is connected to the driving mass so as to perform a second detection movement in a presence of a second external stress. A first movement is a rotation about an axis lying in a plane, and a second movement is a linear movement along an axis of the plane.

Microelectromechanical integrated sensor structure with rotary driving motion

Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.

Temperature compensation for silicon MEMS resonator

not available for EP1633673Abstract of corresponding document: US2004245586There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging and a contact area disposed at least partially outside the chamber. The contact area is electrically isolated from nearby electrically conducting regions by way of dielectric isolation trench that is disposed around the contact area. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

Microelectromechanical systems having trench isolated contacts, and methods for fabricating same

There is described a time base comprising a resonator (4) and an integrated electronic circuit (3) for driving the resonator into oscillation and for producing, in response to the oscillation, a signal having a determined frequency. The resonator is an integrated micromechanical ring resonator supported above a substrate (2) and adapted to oscillate around an axis of rotation (O) substantially perpendicular to the substrate, the ring resonator comprising a central post (5) extending from the substrate along the axis of rotation, a free-standing oscillating structure (6) connected to the central post and including an outer ring (60) coaxial with the axis of rotation and connected to the central post by means of a plurality of spring elements (62), and electrode structures (9; 9*) disposed around the outer ring and connected to the integrated electronic circuit. The free-standing oscillating structure further comprises a plurality of thermally compensating members (65) which are adapted to alter a mass moment of inertia of the free-standing oscillating structure as a function of temperature so as to compensate for the effect of temperature on the resonant frequency of the ring resonator.

Temperature compensation mechanism for a micromechanical ring resonator

There is described a time base comprising a resonator (4) and an integrated electronic circuit (3) for driving the resonator into oscillation and for producing, in response to this oscillation, a signal having a determined frequency. The resonator is an integrated micromechanical tuning fork resonator (4) supported above a substrate (2) and adapted to oscillate in a plane substantially parallel to the substrate. The tuning fork resonator comprises a base member (5) extending substantially perpendicularly from the substrate, a free-substantially parallel fork tines (7, 8) and an electrode structure (9) disposed adjacent to the fork tines and connected to the integrated electronic circuit.

Time base comprising an integrated micromechanical tuning fork resonator

There is described a time base comprising a resonator (4) and an integrated electronic circuit (3) for driving the resonator into oscillation and for producing, in response to this oscillation, a signal having a determined frequency. The resonator is an integrated micromechanical ring resonator (4) supported above a substrate (2) and adapted to oscillate around an axis of rotation (O) substantially perpendicular to the substrate. The ring resonator comprises a central post (5) extending from the substrate along the axis of rotation, and a free-standing oscillating structure (6) including an outer ring (60) coaxial with the axis of rotation, and a plurality of spring elements (62) disposed symmetrically around the central post and connecting the outer ring to the central post.

Time base comprising an integrated micromechanical ring resonator

There is described a time base comprising a resonator (4) and an integrated electronic circuit (3) for driving the resonator into oscillation and for producing, in response to the oscillation, a signal having a determined frequency. The resonator is an integrated micromechanical ring resonator supported above a substrate (2) and adapted to oscillate, according to a first oscillation mode, around an axis of rotation (O) substantially perpendicular to the substrate, the ring resonator comprising a central post (5) extending from the substrate along the axis of rotation, a free-standing oscillating structure (6) connected to the central post and including an outer ring (60) coaxial with the axis of rotation and connected to the central post by means of a plurality of spring elements (62), and electrode structures (9; 9*) disposed around the outer ring and connected to the integrated electronic circuit. Electrodes (100, 120; 130, 150) are positioned under the free-standing oscillating structure in such a way as to drive and sense a second oscillation mode in a plane substantially perpendicular to the substrate and having a resonant frequency which is different from the resonant frequency of the first oscillation mode, a frequency difference between the resonant frequencies of both oscillation modes being used for compensating for the effect of temperature on the frequency of the signal produced by the time base.

Time base comprising integrated micromechanical ring resonator

There is described a time base comprising a resonator (4) and an integrated electronic circuit (3) for driving the resonator into oscillation and for producing, in response to this oscillation, a signal having a determined frequency. The resonator is an integrated micromechanical tuning fork resonator (4) supported above a substrate (2) and adapted to oscillate in a plane substantially parallel to the substrate. The tuning fork resonator comprises a base member (5) extending substantially perpendicularly from the substrate, a free-standing oscillating structure (6) connected to the base member and including at least a first pair of substantially parallel fork tines (7, 8) and an electrode structure (9) disposed adjacent to the fork tines and connected to the integrated electronic circuit.

Platz Rainer

Papers

Temperature compensation mechanism for a micromechanical ring resonator

Time base comprising an integrated micromechanical tuning fork resonator

Time base comprising an integrated micromechanical ring resonator

Time base comprising integrated micromechanical ring resonator

Time base comprising integrated micromechanical tuning fork resonator