PROBLEM TO BE SOLVED: To provide a method for manufacturing at low cost with high reproducibility a heat dissipation structure, with which semiconductor components can be bonded without impairing heat dissipation property even for fluxless case. SOLUTION: The method for manufacturing a heat dissipation structure comprises a first step, where a ceramic circuit-board having at least an aluminum circuit on the front and a metal plate on the back is brazed to a copper heatsink through a brazing filler metal, and a second step, where a nickel layer is coated on the area of the heatsink except the surface the brazing filler metal is bonded to and an aluminum circuit surface on the ceramic circuit-board.

Method for manufacturing heat dissipation structure

Objects of the present invention are to provide oxidation resistant nickel-coated copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit, and to provide a method for producing the same. In order to achieve the objects, there is provided nickel-coated copper powder which is characterized in that it comprises nickel-coated copper particles in which a core material is copper particles, a catalyst for plating is fixed to a surface of the copper-particles by reduction reaction and electroless plated nickel is applied to the outermost surface. The reduction reaction is characterized in that hydrazine is used as a reducing agent.

Nickel-Coated Copper Powder and Method for Producing the Nickel-Coated Copper Powder

Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4 When the catalyst application solution is compared with a Pd—Sn colloidal solution, the catalyst application solution has the following advantages: since the catalyst application solution is a colloidal solution of Pd only that does not contain Sn, a pre-dip process and an Sn removal process are unnecessary and thus the catalyst application process can be simplified; since the catalyst application solution has a pH of not less than 4, haloing does not occur; and since the catalyst application solution is in a reducing atmosphere due to the reducer contained therein, a copper surface is not oxidized and no copper dissolution occurs, thereby causing no palladium displacement reaction

Catalyst application solution, electroless plating method using same, and direct plating method

A method for producing a surface-treated Al sheet, which comprises forming a Zn layer on the surface of an Al substrate by the displacement plating and then forming a Ni layer and an Sn layer by plating on the Zn layer, or further comprises forming a layer having the property of a soldering flux and improving the heat dissipation ability of the Al sheet on the Sn layer of the previous surface-treated Al sheet; a surface-treated Al sheet produced by the method; a heat sink using the Al sheet. The surface-treated Al sheet is excellent in the adhesion of soldering layers, the wettability of a solder and soldering strength and exhibits excellent heat dissipation ability, and thus can be suitably used for a heat sink capable of being soldered, and the method allows the production of the Al sheet at a low cost.

SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY

PROBLEM TO BE SOLVED: To provide a silicon nitride wiring board of high productivity, high strength, high heat conduction, and high flexibility without tightening manufacturing conditions; and to provide a highly reliable silicon nitride wiring board of low heat resistance. SOLUTION: In the silicon nitride wiring board 1, a wiring circuit pattern 13 consisting of a metal is joined to a surface of a silicon nitride substrate 11 formed of a silicon nitride sintered body by a brazing material, and a plating layer is formed in the surface of the wiring circuit pattern 13. The surface roughness Rz of the silicon nitride substrate 11 is more than 3 μm and less than or equal to 20 μm. COPYRIGHT: (C)2007,JPO&INPIT

Silicon nitride wiring board and its production method

PURPOSE: To provide a method for electroless plating the conductor circuit of a ceramic wiring board by which electroless plating can be selectively performed only on the conductor circuit part of the ceramic wiring board and, in addition, a film having excellent uniformity, adhesion, throwing power, precision, etc, can be formed CONSTITUTION: After processing a ceramic wiring board having a metallic conductor circuit formed by a metal bonding method with a catalytic aqueous solution containing a palladium compound at a rate of 0003-005g/l as a metallic palladium, the wiring board is processed with an aqueous solution containing a reducing agent and electroless plating is performed on the conductor circuit COPYRIGHT: (C)1995,JPO

Electroless plating method for conductor circuit of ceramic wiring board

PURPOSE:To develop an Al member having the plating layer excellent in characteristics by forming the metal substituted film consisting essentially of Zn or Sn and subjecting the metal to electroless plating after activating its surface. CONSTITUTION:After cleaning the surface of Al or an Al alloy made member, the member is immersed in the aq. soln. for forming the metal substituted film consisting essentially of Zn or Sn to form the metal substituted film consisting essentially of Zn or Sn on the surface. Then, after uniformly activating the surface by being treated with the aq. soln. containing the reductant such as sodium hypophosphite and having 4-12pH value, the member is immersed in the electroless plating liq. such as electroless Ni plating liq. to form the electroless plating Al metallic member having excellent appearence, adhesiveness, corrosion resistance and covering power, etc.

七朗古川

Papers

Electroless plating method for conductor circuit of ceramic wiring board

Electroless plating method to aluminum material

七朗 古川

Papers

Electroless plating method for conductor circuit of ceramic wiring board

Electroless plating method to aluminum material

七朗古川