Preface. Microelectromechanical Systems (MEMS) and Radio Frequency MEMS. MEMS Materials and Fabrication Techniques. RF MEMS Switches and Micro Relays. MEMS Inductors and Capacitors. Micromachined RF Filters. Micromachined Phase Shifters. Micromachined Transmission Lines and Components. Micromachined Antennae. Integration and Packaging for RF MEMS Devices. Index.

RF MEMS and their applications

Guided wave health monitoring of complex structures by sparse array systems: Influence of temperature changes on performance

A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Mems package and method for the production thereof

Many implantable medical devices contain sophisticated electronic cir- cuits. Hermetic packaging is required to provide the implant's electronic circuitry with protection from the harsh environment of the human body. This chapter pro- vides a review of available hermetic sealing methods and their applications. General considerations of implantable medical device packaging are discussed. Various test- ing methods applicable to the packaging of implantable medical devices are also presented. Many issues associated with hermetic packaging are not yet completely understood, nor are any corresponding difficulties completely overcome. The con- tinued miniaturization of future implantable medical devices provides both oppor- tunities and challenges for packaging/materials engineers to improve the existing packaging methods, and to develop new methods. Reliable hermetic micropackag- ing technologies are the key to a wide utilization of microelectromechanical systems (MEMS) in miniaturized implantable medical devices.

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Technology Advances and Challenges in Hermetic Packaging for Implantable Medical Devices

In this paper, we present the detailed fabrication process, high-frequency characterization, and modeling of through-wafer copper-filled vias ranging from 50- to 70-/spl mu/m-in diameter on 400-/spl mu/m-thick silicon substrates. The high aspect ratio via-holes were fabricated by carefully optimizing the inductively coupled plasma deep reactive ion etching process. The high aspect ratio via-holes are completely filled with copper using a bottom-up electroplating approach. The fabricated vias were characterized using different resonating structures based on which the inductance and resistance of the filled via-holes are extracted. For a single 70-/spl mu/m via, the inductance and resistance are measured to be 254 pH and 0.1 /spl Omega/, respectively. In addition, the effect of the physical arrangement and distribution in multiple-via configurations on the resulting inductance is also evaluated with double straightly aligned quadruple and diagonally aligned quadruple vias. Physical mechanisms of the dependence was depicted by electromagnetic simulation. An equivalent-circuit model is proposed and model parameters are extracted to provide good agreement.

Microwave characterization and modeling of high aspect ratio through-wafer interconnect vias in silicon substrates

Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure. This is not true for MEMS with respect to packaging and testing. It is more difficult to adopt standardized MEMS device packaging for wide applications although MEMS use many similar technologies to IC packaging. Packaging of MEMS devices is more complex since in some cases it needs to provide protection from the environment while in some cases allowing access to the environment to measure or affect the desired physical or chemical parameters. Microscopic mechanical moving parts of MEMS have also their unique issues. Therefore, testing MEMS packages using the same methodologies, as those for electronics packages with standard procedures might not always be possible especially when quality and reliability need to be assessed. Single MEMS chip packaging approaches and their limitations in the packaging of high performance MEMS will be reviewed in this presentation and also identifies a need for a systematic approach for this purpose. MEMS package reliability depends on package type, i.e. ceramic, plastic, or metal, and reliability of device. The MEMS device reliability depends on its materials and wafer level processes and sealing methods used for environmental protection. MEMS quality and reliability challenges are discussed and needs for study in these areas are identified.

R. Ghaffarian

Papers

Challenges in interconnection and packaging of microelectromechanical systems (MEMS)