https://www.physics.utoronto.ca/~marj/references/Herman2000-9.pdf

Laser shaping of photonic materials: deep-ultraviolet and ultrafast lasers

A system for acquiring an ultrasound signal comprises a signal processing unit adapted for acquiring a received ultrasound signal from an ultrasound transducer having a plurality of elements. The system is adapted to receive ultrasound signals having a frequency of at least 20 megahertz (MHz) with a transducer having a field of view of at least 5.0 millimeters (mm) at a frame rate of at least 20 frames per second (fps). The signal processing can further produce an ultrasound image from the acquired ultrasound signal. The transducer can be a linear array transducer, a phased array transducer, a two-dimensional (2-D) array transducer, or a curved array transducer.

High frequency array ultrasound system

An ultrasonic transducer comprises a stack having a first face, an opposed second face and a longitudinal axis extending therebetween. The stack comprises a plurality of layers, each layer having a top surface and an opposed bottom surface, wherein the plurality of layers of the stack comprises a piezoelectric layer and a dielectric layer. The dielectric layer is connected to the piezoelectric layer and defines an opening extending a second predetermined length in a direction substantially parallel to the axis of the stack. A plurality of first kerf slots are defined therein the stack, each first kerf slot extending a predetermined depth therein the stack and a first predetermined length in a direction substantially parallel to the axis. The first predetermined length of each first kerf slot is at least as long as the second predetermined length of the opening defined by the dielectric layer and is shorter than the longitudinal distance between the first face and the opposed second face of the stack in a lengthwise direction substantially parallel to the axis.

Arrayed ultrasonic transducer

The invention features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the inventions provides methods of patterning electrodes, e.g., in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layer for an ultrasound transducer. The invention also features ultrasound transducers produced by the methods described herein.

Methods for manufacturing ultrasound transducers and other components

Laser jacket stripping of the two-layer polymer jacket coating of Corning SMF-28 silica fibres has been studied as an alternative approach to chemical and mechanical techniques. These polymer outer layers, although chemically similar, become discernable through laser ablation and depth per pulse experiments. Etch rate measurements using nanosecond UV excimer laser sources (F2, ArF, KrF and XeCl lasers) reveal that, as expected, the threshold fluence (energy per unit area) for significant material removal drops as the laser wavelength becomes shorter. For some wavelengths and fluences, spontaneous cone formation has been observed, thus providing additional threshold data through apex angle determination. The possible occurrence of deleterious damage to the silica cladding has been assessed using electron microscopy and optical transmission measurements. A wide fluence range over which damage was not observed characterised all the interactions. Irradiation techniques for producing apertures in the polymer coating or complete jacket removal are demonstrated and discussed. Briefly, polymer jacket stripping using a femtosecond laser source (800 nm) has been demonstrated.

Polymer jacket stripping of optical fibres by laser irradiation

Photonics Research Ontario (PRO) is an Ontario Provincial Center of Excellence supporting a broad range of laser- processing activities within its photonics program. These activities are centered at the University of Toronto, and split between an industrial-user facility and the individual research programs of principal investors. The combined effort furnishes forefront laser system and advanced optical tools to explore novel processing applications in photonic, biomedical, and microelectronic areas. Facilities include laser micromachining stations, excimer-based mask-projection stations, extremely short wavelength lasers such as the molecular fluorine laser, and ultrafast laser systems. The latter two advanced laser offer interesting advantages and contrast in processing 'difficult' materials through linear and nonlinear absorption processes, respectively. These laser systems provide fine precision and strong interaction with a wide range of materials, including 'transparent' glasses, and also ceramics and metals. Applications fall broadly into several areas: wafer-level circuit trimming, high-resolution ultrasonic transducers, and the shaping of optical waveguides and Bragg-gratings for photonic components. This paper summarizes the laser-processing infrastructure and research activities at PRO.© (1999) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

R. J. D. Miller

Papers

Advanced-laser processing of photonic and microelectronic components at Photonics Research Ontario