Reliability consideration is always important among the manufacturers of power modules and converters. Before using of power electronic converters into the related application, it is necessary to predict its reliability over time. In the meanwhile, the power loss and heat generated within the power semiconductors play a key role in the lifespan of the whole system. In this paper, a method for assessing the reliability of a step-down DC-DC converter is employed based on the thermal modeling of power semiconductors. As is evident from the used reliability approach, the junction temperature of power semiconductors – diodes and insulated-gate bipolar transistors (IGBTs) – is the most influential factor on the lifetime of power converters. Therefore, the simultaneous influence of switching frequency and duty cycle is analyzed at the same time as a factor for evaluating reliability. A cut-off of 150°C is considered for the maximum allowable junction temperature for the examined IGBT power module. The results show that a failure can be expected after 46,000 hours of operation of the considered power converter. Additionally, 3D curves are presented to illustrate the influence of duty cycle and switching frequency on the reliability of circuit’s components and the overall system. The obtained results confirmed that an increase in switching frequency from 1 kHz to 10 kHz can decrease the circuit’s lifetime almost 22%.

http://ieco.usb.ac.ir/article_4607_df31110ad265ed17dc3308caacd7a5de.pdf

Reliability Assessment and Thermal Consideration of a Step-down DC/DC Converter

Currently LED technology for lighting has a great boom in the automotive industry. In this industry it is required that the main headlights change luminosity instantaneously; this is achieved using LED arrays. In this type of power LED arrays can be controlled independently using a dc-dc converter for each of the arrays, or using a converter that controls the voltage or series depending on the change in brightness. An important factor in determining what type of strategy to implement is the failure rate of the system, as it is known that the greater the number of components or stages, the system will be more likely to fail in a certain time. In this article we analyzed the conditions of the Flyback converter for five power levels, it was established that the element with the highest failure rates is the switching MOSFET, this element was also the one that increased its temperature more in the last power interval. Therefore the study of this case determines that to have a lower failure rate it is recommended to have several converters of less power than a larger one.

R. Santillan

Papers

Reliability Analisys of a Flyback Converter for Automotive Applications