Preface. Microelectromechanical Systems (MEMS) and Radio Frequency MEMS. MEMS Materials and Fabrication Techniques. RF MEMS Switches and Micro Relays. MEMS Inductors and Capacitors. Micromachined RF Filters. Micromachined Phase Shifters. Micromachined Transmission Lines and Components. Micromachined Antennae. Integration and Packaging for RF MEMS Devices. Index.

RF MEMS and their applications

Preface. About the Authors. PART 1: FUNDAMENTALS. 1. Introduction to Smart Systems. 1.1 Components of a smart system. 1.2 Evolution of smart materials and structures. 1.3 Application areas for smart systems. 1.4 Organization of the book. References. 2. Processing of Smart Materials. 2.1 Introduction. 2.2 Semiconductors and their processing. 2.3 Metals and metallization techniques. 2.4 Ceramics. 2.5 Silicon micromachining techniques. 2.6 Polymers and their synthesis. 2.7 UV radiation curing of polymers. 2.8 Deposition techniques for polymer thin films. 2.9 Properties and synthesis of carbon nanotubes. References. PART 2: DESIGN PRINCIPLES. 3. Sensors for Smart Systems. 3.1 Introduction. 3.2 Conductometric sensors. 3.3 Capacitive sensors. 3.4 Piezoelectric sensors. 3.5 Magnetostrictive sensors. 3.6 Piezoresistive sensors. 3.7 Optical sensors. 3.8 Resonant sensors. 3.9 Semiconductor-based sensors. 3.10 Acoustic sensors. 3.11 Polymeric sensors. 3.12 Carbon nanotube sensors. References. 4. Actuators for Smart Systems. 4.1 Introduction. 4.2 Electrostatic transducers. 4.3 Electromagnetic transducers. 4.4 Electrodynamic transducers. 4.5 Piezoelectric transducers. 4.6 Electrostrictive transducers. 4.7 Magnetostrictive transducers. 4.8 Electrothermal actuators. 4.9 Comparison of actuation schemes. References. 5. Design Examples for Sensors and Actuators. 5.1 Introduction. 5.2 Piezoelectric sensors. 5.3 MEMS IDT-based accelerometers. 5.4 Fiber-optic gyroscopes. 5.5 Piezoresistive pressure sensors. 5.6 SAW-based wireless strain sensors. 5.7 SAW-based chemical sensors. 5.8 Microfluidic systems. References. PART 3: MODELING TECHNIQUES. 6. Introductory Concepts in Modeling. 6.1 Introduction to the theory of elasticity. 6.2 Theory of laminated composites. 6.3 Introduction to wave propagation in structures. References. 7. Introduction to the Finite Element Method. 7.1 Introduction. 7.2 Variational principles. 7.3 Energy functionals and variational operator. 7.4 Weak form of the governing differential equation. 7.5 Some basic energy theorems. 7.6 Finite element method. 7.7 Computational aspects in the finite element method. 7.8 Superconvergent finite element formulation. 7.9 Spectral finite element formulation. References. 8. Modeling of Smart Sensors and Actuators. 8.1 Introduction. 8.2 Finite element modeling of a 3-D composite laminate with embedded piezoelectric sensors and actuators. 8.3 Superconvergent smart thin-walled box beam element. 8.4 Modeling of magnetostrictive sensors and actuators. 8.5 Modeling of micro electromechanical systems. 8.6 Modeling of carbon nanotubes (CNTs). References. 9. Active Control Techniques. 9.1 Introduction. 9.2 Mathematical models for control theory. 9.3 Stability of control system. 9.4 Design concepts and methodology. 9.5 Modal order reduction. 9.6 Active control of vibration and waves due to broadband excitation. References. PART 4: FABRICATION METHODS AND APPLICATIONS. 10. Silicon Fabrication Techniques for MEMS. 10.1 Introduction. 10.2 Fabrication processes for silicon MEMS. 10.3 Deposition techniques for thin films in MEMS. 10.4 Bulk micromachining for silicon-based MEMS. 10.5 Silicon surface micromachining. 10.6 Processing by both bulk and surface micromachining. 10.7 LIGA process. References. 11. Polymeric MEMS Fabrication Techniques. 11.1 Introduction. 11.2 Microstereolithography. 11.3 Micromolding of polymeric 3-D structures. 11.4 Incorporation of metals and ceramics by polymeric processes. 11.5 Combined silicon and polymer structures. References. 12. Integration and Packaging of Smart Microsystems. 12.1 Integration of MEMS and microelectronics. 12.2 MEMS packaging. 12.3 Packaging techniques. 12.4 Reliability and key failure mechanisms. 12.5 Issues in packaging of microsystems. References. 13. Fabrication Examples of Smart Microsystems. 13.1 Introduction. 13.2 PVDF transducers. 13.3 SAW accelerometer. 13.4 Chemical and biosensors. 13.5 Polymeric fabrication of a microfluidic system. References. 14. Structural Health Monitoring Applications. 14.1 Introduction. 14.2 Structural health monitoring of composite wing-type structures using magnetostrictive sensors/actuators. 14.3 Assesment of damage severity and health monitoring using PZT sensors/actuators. 14.4 Actuation of DCB specimen under Mode-II dynamic loading. 14.5 Wireless MEMS-IDT microsensors for health monitoring of structures and systems. References. 15. Vibration and Noise-Control Applications. 15.1 Introduction. 15.2 Active vibration control in a thin-walled box beam. 15.3 Active noise control of structure-borne vibration and noise in a helicopter cabin. References. Index.

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Smart Material Systems and MEMS: Design and Development Methodologies

This paper presents a review of the recent literature on the use of adhesives in MEMS packaging applications. The aim of this review has been to establish the current applications of adhesives in MEMS and MOEMS assembly and to investigate the limitations and future requirements of these materials. The review has shown that while there is a wealth of information available on the packaging of MEMS devices, there is very limited detail available within the public domain regarding the specific uses of adhesives and in particular exactly which products are in use. The paper begins with an overview of the uses of adhesives in MEMS packaging, subdivided into sections on structural adhesives, adhesives for optical applications and other applications. The paper then describes methods for adhesive dispensing and issues with adhesive use which affect the reliability of the package. The reliability of MEMS devices assembled using adhesives is a challenging issue, being more than a simple combination of electrical, mechanical and material reliability. Many failure modes in MEMS devices can be attributed to the adhesives used in the assembly; for example, thermal expansion mismatches can cause stress in the die attach, while outgassing from epoxies can cause failure of sealed devices and contamination of optical surfaces.

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Application of adhesives in MEMS and MOEMS assembly: a review

A structured, self-assembled nanoenergetic material (10) is disclosed that includes a nanostructure comprising at least one of the group consisting of a fuel (16) and an oxidizer (14) and a plurality of substantially spherical nanoparticles (18) comprising at least the other of the group consisting of a fuel (16) and an oxidizer (14). The spherical particles (18) are arranged around the exterior surface area of a nanorod (20). This structured particle (10) assures that the oxidizer (14) and the fuel (16) have a high interfacial surface area between them. Preferably, the nanostructure is at least one of a nanorod (20), nanowire and a nanowell (24), and the second shaped nanoparticle is a nanosphere (18).

Ordered nanoenergetic composites and synthesis method

We established a versatile method for site-specific nanopatterning of functional metallic and molecular arbitrary features in glass nanofluidic channels, with well-controlled feature sizes ranging from tens to hundreds of nanometers and precisely controlled placements in the range of several tens of nanometers. With the method, we achieved the fabrication of quasi-0D, quasi-1D, 2D, and 3D gold nanopatterns in nanofluidic channels, as well as a high-density fluorescent molecular nanoarray in arrayed femtoliter nanofluidic channels. The method opens the way for precise functionalization of nanofluidic channels, which has been greatly challenging in the field of nanofluidics.

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Site-specific nanopatterning of functional metallic and molecular arbitrary features in nanofluidic channels

The bond layer is often the weakest link in the reliability of chip packages in the integrated circuit (IC) industry. Micro-electrical-mechanical systems (MEMS) packages are no exception to this trend. This paper presents a nondestructive methodology for determining delamination in chip-to-chip bonded MEMS. Experimental methods are used to determine the adhesive layer strength in samples subjected to environmental testing, and the reliability of the bonding layer is investigated. A simulation is performed using inputs from scanning acoustic microscopy, and simulation model results are correlated with the experimental die shear measurements to establish the validity of the nondestructive methodology for determining adhesive layer strength.

Reliability assessment of delamination in chip-to-chip bonded MEMS packaging

Packaging of MEMS devices introduces new challenges to the package architecture. MEMS systems introduce new interfaces, processes, and materials foreign to the IC packaging industry. To build reliable MEMS systems, failure modes must be activated and understood. In addition, the metrology techniques must be developed to interrogate critical aspects of the package. The system presented in this paper is a MEMS based safety and arming device (S&A) for underwater weapons. Critical components, packaged in various hermetic and non-hermetic configurations, are cycled through a series of metrologies and environmental conditioning.

Packaging of a MEMS based safety and arming device

In the IC industry, the bond layer serves as the foundation and often the weak link in the reliability of chip packages. MEMS packages are likely to have a greater number of bond layers with more stringent requirements. The additional bond layers arise from multiple interfaces inside the package. The bond layers in MEMS devices often must maintain precise component or chip alignment. In addition, the bond layers may have to withstand loading from both the macroenvironment and loading within the package. This paper presents the bond requirements for a MEMS based Safety and Arming (S&A) device. The S&A system requires precise alignment between a micromachined silicon chip, a patterned Alumina ceramic chip, and a deflection delimiter. Several candidate designs were subjected to a series of environmental tests including thermal cycling, accelerated stress tests, mechanical shock, and combinations of the above conditions. A Scanning Acoustic Microscope (SAM) is utilized to measure initial delamination and to identify incremental damage due to environmental exposure. The tests are ultimately used to rank the suitability of the bond layer material for chip-to-chip attachment with large coefficient of expansion differences. Tested bond materials include epoxy, thermoplastic, and solder.

R. Swaminathan

Papers

Reliability assessment of delamination in chip-to-chip bonded MEMS packaging

Packaging of a MEMS based safety and arming device

Test and evaluation of chip-to-chip attachment of MEMS devices