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Rajmond Jano

Researcher at Technical University of Cluj-Napoca

Publications -  21
Citations -  45

Rajmond Jano is an academic researcher from Technical University of Cluj-Napoca. The author has contributed to research in topics: Soldering iron & Soldering. The author has an hindex of 3, co-authored 20 publications receiving 41 citations.

Papers
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Proceedings ArticleDOI

Accelerated ageing tests for predicting capacitor lifetimes

TL;DR: The following paper analyses current prediction algorithms and offers an improved solution for capacitor lifetime prediction that can be applied in safety critical applications.
Proceedings ArticleDOI

Parameter monitoring of electronic circuits for reliability prediction and failure analysis

TL;DR: In this paper, a method for predicting the value of capacitors on the electronic modules, in order to perform real-time prediction of their lifetimes affected by their operational environment, is proposed.
Proceedings ArticleDOI

Thermal via placement for high-power applications

TL;DR: In this article, the authors aim to decrease the junction temperature of a power device, by optimizing the placement of thermal vias underneath the IC, in order to improve the thermal dissipation from a component to the PCB and ambient.
Proceedings ArticleDOI

Implementation of a car model for indirect tire pressure monitoring system

TL;DR: The novelty of the research is the achievement of a Simulink car model which is able to feed simulated data consistent with real-life measurements to the hardware system for functional testing of the implemented measurement method, without the need of an actual car and road test.
Proceedings ArticleDOI

Effects of reflow soldering methods on the lifetime of capacitors

TL;DR: In this article, the influence of different soldering methods and specific thermal profiles on the lifetime of through hole capacitors was investigated and the behavior of aluminum electrolytic, ceramic and two capacitor types with different plastic dielectric capacitors were evaluated when using alternative soldering method instead of the standard wave soldering process, such as vapour phase or infrared convection.