A method and system for spectroscopic ellipsometry employing reflective optics to measure a small region of a sample by reflecting radiation (preferably broadband UV, visible, and near infrared radiation) from the region. The system preferably has an autofocus assembly and a processor programmed to determine from the measurements the thickness and/or complex refractive index of a thin film on the sample. Preferably, only reflective optics are employed along the optical path between the polarizer and analyzer, a sample beam reflects with low incidence angle from each component of the reflective optics, the beam is reflectively focused to a small, compact spot on the sample at a range of high incidence angles, and an incidence angle selection element is provided for selecting for measurement only radiation reflected from the sample at a single, selected angle (or narrow range of angles). The focusing mirror preferably has an elliptical shape to reduce off-axis aberrations in the focused beam. Some embodiments include both a spectrophotometer and an ellipsometer integrated together as a single instrument. In such instrument, the spectrophotometer and ellipsometer share a radiation source, and radiation from the source can be focused by either the spectrophotometer or the ellipsometer to the same focal point on a sample. Preferred embodiments of the ellipsometer employ a rotating, minimal-length Rochon prism as a polarizer, and include a spectrometer with an intensified photodiode array to measure reflected radiation from the sample, and a reference channel (in addition to a sample channel which detects radiation reflected from the sample).

Focused beam spectroscopic ellipsometry method and system

Methods and systems for determining a critical dimension and overlay of a specimen

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

Automated wafer defect inspection system and a process of performing such inspection

A method and system for performing reflectance measurements of a sample using radiation having UV frequency components (preferably in a broad UV band) and visible frequency components (preferably in a broad band). Preferably, two detectors simultaneously receive a sample beam reflected from the sample surface. One detector generates a signal indicative of the sample beam components in the UV band and the other detector generates a signal indicative of the sample beam components in the visible band. By processing these two signals, the invention enables accurate measurement of the thickness of a very thin film on the sample. Preferably, the system determines a single effective wavelength for the UV radiation incident on the first detector and a single effective wavelength for the visible radiation incident on the second detector. Embodiments of the system can also measure reflectance spectra and refractive indices, and can determine lithographic exposure times. Preferred embodiments include an objective lens assembly having a pupil stop with an entrance portion with one or more relatively large apertures therethrough and an exit portion with one or more relatively small apertures therethrough. Illuminating radiation passes through the relatively large apertures before reflecting from the sample, and then passes through the relatively small apertures after reflecting from the sample. This design and pupil stop orientation dramatically increases the insensitivity of the system to ripple on the sample surface.

Method and apparatus for measuring reflectance in two wavelength bands to enable determination of thin film thickness

Methods and systems for determining a critical dimension and a thin film characteristic of a specimen

A method and apparatus for predicting the number of contaminant particles in circuit area of a patterned semiconductor wafer having a number of reflective circuit areas. The method includes forming on a wafer in specified areas, a grating test pattern, such as a line grating. The grating patterns are formed at the same time and in the same manner that repetitive circuit patterns are formed on the wafer. The wafer is then scanned by a light beam. Since the diffraction pattern caused by the grating test patterns is known, it is possible to detect when the light beam is scanning one of the known grating patterns. The diffraction pattern may be inspected for fabrication derived variations. In response to detecting a known grating pattern, a detection mechanism is activated. Since the diffraction pattern is known it may be spatially separated. In this way only light scattered by particles or defects in the pattern are collected and detected. From the scattered light that is collected and detected, a particle count may be determined for the grating pattern area. From this particle count an accurate prediction of the number of particles in the circuit patterns may be made. The apparatus may also inspect bare areas. In this manner real time inspection may be performed on patterned wafers.

Particle detection on a patterned or bare wafer surface

An inspection apparatus for a light diffracting surface employs a planar array of individually addressable light valves for use as a spatial filter in an imaged Fourier plane of a diffraction pattern, with valves having a stripe geometry corresponding to positions of members of the diffraction pattern, blocking light from those members. The remaining valve stripes, i.e. those not blocking light from diffraction order members, are open for transmission of light. Light directed onto the surface, such as a semiconductor wafer, forms elongated curved diffraction orders from repetitive patterns of circuit features. The curved diffraction orders are transformed to linear orders by a Fourier transform lens. The linear diffraction orders from repetitive patterns of circuit features are blocked, while light from non-repetitive features, such as dirt particles or defects is allowed to pass through the light valves to a detector. Patterns of stripes can be recorded corresponding to the repetitive features of different integrated circuits. Different filters may be rapidly switched electronically in synchronization with a beam scanning a patterned surface inspecting different light diffracting patterns in different positions, allowing scattered or diffracted light from non-repetitive features to pass through the filter to a detector. A logical AND combination of two filters may be used so that two regions may be inspected in a single scan of the beam.

Adaptive spatial filter for surface inspection

A thin film thickness monitor using successive reflection of a polychromatic light beam off of reference thin film of variable optical thickness and a sample thin film whose thickness is to be determined, in which a monochromatic light source is used beforehand to first determine the actual optical thickness of the reference thin film at each relative position of the beam and reference thin film. In one embodiment, the ratio S/R of detected light intensity S from the sample thin film and detected light intensity R from the reference thin film is found for each relative position and the position at which the ratio is a maximum is determined. In another embodiment, this ratio is corrected by a corresponding ratio S 1 /R 1 derived from a bare wafer substrate. The sample can then be located behind additional optical surfaces, such as a vacuum port without causing substantial errors. In yet a third embodiment, the detected light intensity R2 from two reflections off of the reference thin film is used in place of intensity R, allowing very thin films to be accurately measured.

Ralph C. Wolf

Papers

Particle detection on a patterned or bare wafer surface

Adaptive spatial filter for surface inspection

Thin film thickness monitor